The XC2S200-6FGG736C is a powerful Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates, 5,292 logic cells, and comes in a 736-ball fine-pitch BGA package. The XC2S200-6FGG736C is engineered for demanding digital applications where high I/O count and reliable operation are critical requirements.
XC2S200-6FGG736C Key Features and Benefits
The XC2S200-6FGG736C offers engineers and designers a comprehensive set of features that make it an ideal choice for complex digital system implementations. This Spartan-II FPGA combines high-density logic resources with cost-effective pricing, providing an excellent alternative to mask-programmed ASICs.
Advanced Programmable Logic Architecture
The XC2S200-6FGG736C utilizes Xilinx’s proven Spartan-II architecture built on 0.18μm process technology. The device features a 28 × 42 CLB array with 1,176 total Configurable Logic Blocks (CLBs), offering designers maximum flexibility for implementing custom digital circuits. Four Delay-Locked Loops (DLLs) positioned at each corner of the die enable precise clock management and timing control.
High-Speed Performance Capability
With the -6 speed grade designation, the XC2S200-6FGG736C supports system frequencies up to 200 MHz, enabling high-throughput data processing applications. The device architecture supports clock frequencies reaching 263 MHz in optimized configurations, making it suitable for demanding signal processing and communication system designs.
XC2S200-6FGG736C Technical Specifications
Understanding the complete technical specifications of the XC2S200-6FGG736C is essential for successful design integration. The following tables provide detailed information about this Spartan-II FPGA device.
Core Logic Specifications
| Parameter |
Value |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K |
| Delay-Locked Loops (DLLs) |
4 |
XC2S200-6FGG736C Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Process Technology |
0.18μm |
| Maximum System Frequency |
200 MHz |
| Maximum Clock Frequency |
263 MHz |
| Speed Grade |
-6 |
Package and Environmental Information
| Parameter |
Value |
| Package Type |
FGG736 (Fine-pitch BGA) |
| Total Ball Count |
736 |
| Maximum User I/O |
284+ |
| Temperature Range |
Commercial (0°C to +85°C) |
| Temperature Code |
C |
| RoHS Compliance |
Pb-Free (indicated by “G”) |
XC2S200-6FGG736C Package Details
Understanding the FGG736 Ball Grid Array Package
The FGG736 package designation indicates a Fine-pitch Ball Grid Array with 736 solder balls. The “G” in FGG signifies Pb-free (lead-free) construction, ensuring full RoHS compliance for environmentally responsible manufacturing. This package option provides maximum I/O availability for the XC2S200 device, making it ideal for applications requiring extensive external connectivity.
Part Number Breakdown
| Element |
Meaning |
| XC2S |
Xilinx Spartan-II Series |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade (Highest) |
| FGG |
Fine-pitch BGA, Pb-Free |
| 736 |
736-Ball Package |
| C |
Commercial Temperature Range |
XC2S200-6FGG736C Applications and Use Cases
The XC2S200-6FGG736C FPGA excels in numerous application domains where programmable logic flexibility and high I/O count are essential requirements.
Industrial and Embedded Systems
The XC2S200-6FGG736C is well-suited for industrial automation, process control systems, and embedded computing platforms. Its extensive I/O capabilities enable simultaneous interfacing with multiple sensors, actuators, and communication peripherals. The commercial temperature rating ensures reliable operation in controlled industrial environments.
Telecommunications Infrastructure
Network equipment manufacturers leverage the XC2S200-6FGG736C for implementing protocol processing, data routing, and interface bridging functions. The high-speed performance and abundant logic resources support complex packet processing algorithms and multi-channel communication implementations.
Digital Signal Processing
With 75,264 bits of distributed RAM and 56K bits of dedicated block RAM, the XC2S200-6FGG736C provides substantial on-chip memory for DSP algorithm implementations. Engineers can design efficient filters, FFT processors, and modulation/demodulation systems within this versatile FPGA platform.
Prototyping and Development
The XC2S200-6FGG736C serves as an excellent prototyping platform for validating ASIC designs before committing to silicon. Its reprogrammability allows rapid design iteration while the high gate count accommodates complex logic structures typical of modern integrated circuits.
XC2S200-6FGG736C Design Resources and Development Tools
Configuration and Programming
The XC2S200-6FGG736C supports multiple configuration modes including Master Serial, Slave Serial, and SelectMAP interfaces. Compatible configuration PROMs and flash memory devices store FPGA configuration data, enabling standalone operation without external processors. The device supports JTAG Boundary Scan for testing and programming.
Software Development Environment
Xilinx ISE Design Suite provides comprehensive support for XC2S200-6FGG736C development. The toolchain includes synthesis, implementation, and programming capabilities along with simulation and timing analysis features. Visit Xilinx FPGA for additional resources and procurement options.
Available Documentation
| Document Type |
Description |
| Datasheet (DS001) |
Complete electrical specifications and timing parameters |
| User Guide |
Architecture details and design recommendations |
| Package Drawing |
Mechanical dimensions and pin assignments |
| Application Notes |
Implementation guidance and reference designs |
Spartan-II Family Comparison
The XC2S200-6FGG736C belongs to the larger Spartan-II FPGA family. Understanding the family hierarchy helps engineers select the optimal device for their specific requirements.
Spartan-II Device Options
| Device |
Logic Cells |
System Gates |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
284 |
56K |
Why Choose the XC2S200-6FGG736C FPGA
Cost-Effective ASIC Alternative
The XC2S200-6FGG736C eliminates the initial NRE costs, lengthy development cycles, and inherent risks associated with conventional ASIC development. Design upgrades can be implemented in the field through device reprogramming, providing flexibility impossible with fixed-function ASICs.
Proven Reliability
Built on Xilinx’s mature 0.18μm process technology, the XC2S200-6FGG736C benefits from extensive production history and proven reliability. The Spartan-II family has established itself as a trusted solution for volume production applications across multiple industries.
Maximum I/O Density
The 736-ball FGG package provides the highest I/O count available for the XC2S200 device. This makes the XC2S200-6FGG736C the optimal choice for designs requiring extensive external connectivity while maintaining the logic capacity of the 200K-gate platform.
Environmental Compliance
The Pb-free packaging of the XC2S200-6FGG736C ensures compliance with RoHS (Restriction of Hazardous Substances) regulations. This environmentally responsible construction meets increasingly stringent global requirements for electronic component manufacturing.
XC2S200-6FGG736C Ordering Information
When specifying the XC2S200-6FGG736C, verify the complete part number to ensure receipt of the correct device variant.
Ordering Specifications
| Attribute |
Specification |
| Complete Part Number |
XC2S200-6FGG736C |
| Manufacturer |
Xilinx (now AMD) |
| Device Type |
FPGA |
| Family |
Spartan-II |
| Package |
736-Ball Fine-pitch BGA |
| Lead-Free |
Yes |
| Temperature Range |
Commercial |
| Speed Grade |
-6 |
XC2S200-6FGG736C Summary
The XC2S200-6FGG736C represents a powerful, versatile, and cost-effective FPGA solution for digital system designers. Combining 200,000 system gates with 5,292 logic cells in a high-density 736-ball BGA package, this Spartan-II device delivers the performance and flexibility required for demanding industrial, telecommunications, and embedded applications.
The -6 speed grade ensures maximum performance capability, while the Pb-free FGG736 package provides both extensive I/O connectivity and full RoHS environmental compliance. Whether used for production systems or rapid prototyping, the XC2S200-6FGG736C offers engineers a proven platform backed by comprehensive development tools and extensive documentation.
For design engineers seeking a balance of high logic density, abundant I/O, and cost-effective programmable logic, the XC2S200-6FGG736C delivers exceptional value within the trusted Spartan-II FPGA family.
