Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG734C: High-Performance Spartan-II FPGA with 200K System Gates

Product Details

The XC2S200-6FGG734C is a powerful Field-Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. This commercial-grade programmable logic device delivers exceptional performance with 200,000 system gates, 5,292 logic cells, and a high-speed -6 speed grade rating. Packaged in a 734-ball Fine-Pitch Ball Grid Array (FGG734), this Xilinx FPGA provides extensive I/O capabilities for complex digital system designs.


XC2S200-6FGG734C Key Features and Benefits

The XC2S200-6FGG734C combines robust architecture with cost-effective programmability, making it an ideal solution for high-volume applications requiring flexible, upgradeable digital logic.

Core Architecture Highlights

The Spartan-II architecture features a regular, programmable structure of Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). Four Delay-Locked Loops (DLLs) positioned at each die corner enable precise clock management, while dual columns of block RAM provide high-speed on-chip memory storage.

Why Choose the XC2S200-6FGG734C?

  • High Logic Density: 200,000 system gates support complex digital implementations
  • Fast Speed Grade: The -6 speed grade delivers optimal timing performance up to 200 MHz
  • Pb-Free Packaging: The “G” designation indicates RoHS-compliant lead-free manufacturing
  • Field Upgradeable: Reprogrammable design eliminates costly hardware revisions
  • Superior ASIC Alternative: Avoids initial NRE costs and lengthy ASIC development cycles

XC2S200-6FGG734C Technical Specifications

Logic and Memory Resources

Parameter Specification
Device Family Spartan-II
Part Number XC2S200-6FGG734C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Total On-Chip Memory 131,264 bits

Package and Electrical Characteristics

Parameter Specification
Package Type FGG734 (Fine-Pitch Ball Grid Array)
Total Balls 734
Ball Pitch 1.0 mm
Speed Grade -6 (Fastest)
Core Voltage 2.5V
Temperature Range Commercial (0°C to +85°C)
Process Technology 0.18µm / 0.22µm
Maximum Frequency 200 MHz

I/O Capabilities and Standards

Feature Specification
Maximum User I/O 284
Global Clock Pins 4
Delay-Locked Loops (DLLs) 4
SelectI/O Standards 16

XC2S200-6FGG734C Supported I/O Standards

The XC2S200-6FGG734C supports a comprehensive range of single-ended and differential I/O standards for maximum design flexibility.

Single-Ended I/O Standards

Standard Description
LVTTL Low-Voltage TTL (3.3V)
LVCMOS2 Low-Voltage CMOS (2.5V)
PCI 3.3V PCI Local Bus Standard
GTL Gunning Transceiver Logic
GTL+ Enhanced GTL
HSTL Class I/II/III/IV High-Speed Transceiver Logic
SSTL2 Class I/II Stub Series Terminated Logic (2.5V)
SSTL3 Class I/II Stub Series Terminated Logic (3.3V)
CTT Center-Tapped Termination
AGP-2X Accelerated Graphics Port

Differential I/O Standards

Standard Application
LVDS Low-Voltage Differential Signaling
BLVDS Bus LVDS
LVPECL Low-Voltage Positive ECL

XC2S200-6FGG734C Architecture Overview

Configurable Logic Blocks (CLBs)

Each CLB contains four Logic Cells (LCs) arranged in two slices. Every Logic Cell includes a 4-input function generator (LUT), carry logic, and storage elements. The function generators support implementation as 16×1 synchronous RAM (distributed RAM) for flexible on-chip memory allocation.

Block RAM Configuration

The XC2S200-6FGG734C features 56 Kbits of dedicated block RAM organized in dual columns. Block RAM supports multiple configurations including single-port RAM, dual-port RAM, and ROM implementations with synchronous read/write operations.

Delay-Locked Loops (DLLs)

Four DLLs provide advanced clock management capabilities including clock deskew, frequency synthesis, and phase shifting. These features enable precise timing control essential for high-speed digital designs.


XC2S200-6FGG734C Configuration Options

Configuration Mode Data Width CCLK Direction Description
Master Serial 1 bit Output Uses external serial PROM
Slave Serial 1 bit Input Daisy-chain configuration
Slave Parallel 8 bits Input Parallel data loading
Boundary-Scan 1 bit N/A JTAG-based configuration

Configuration Memory Requirements

Device Configuration Bits
XC2S200-6FGG734C 1,335,840 bits

XC2S200-6FGG734C Application Areas

The XC2S200-6FGG734C excels in diverse application domains requiring programmable logic solutions.

Telecommunications and Networking

This FPGA handles high-speed data processing for communication protocols, network routers, switches, and data transmission equipment. The abundant I/O resources and block RAM enable efficient packet buffering and protocol conversion.

Industrial Automation and Control

Motor control, process automation, and PLC implementations benefit from the XC2S200-6FGG734C’s reliable digital processing capabilities. The commercial temperature range ensures stable operation in industrial environments.

Consumer Electronics

Video processing, audio systems, and multimedia applications leverage the FPGA’s parallel processing architecture and multiple I/O standards for seamless peripheral integration.

Medical Equipment

Imaging systems, diagnostic instruments, and patient monitoring devices utilize the XC2S200-6FGG734C’s reconfigurable logic for specialized signal processing and data acquisition.

Prototyping and Development

Engineers use this FPGA for rapid prototyping of ASIC designs, enabling functional verification before committing to expensive mask production.


XC2S200-6FGG734C Part Number Decoder

Understanding the part number structure helps identify exact device specifications:

Code Segment Meaning
XC2S Xilinx Spartan-II Family
200 200,000 System Gates
-6 Speed Grade (Fastest)
FG Fine-Pitch Ball Grid Array
G Pb-Free (Lead-Free) Package
734 734-Ball Package
C Commercial Temperature (0°C to +85°C)

XC2S200-6FGG734C Design Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG734C is fully supported by Xilinx ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification. Both VHDL and Verilog HDL languages are supported for RTL design entry.

Development Resources

Resource Type Description
Datasheets DS001 – Complete electrical and timing specifications
User Guides Application notes and implementation guidelines
Reference Designs Proven design templates for common applications
IP Cores Pre-verified functional blocks
Technical Support Documentation and community forums

XC2S200-6FGG734C vs. Mask-Programmed ASICs

Factor XC2S200-6FGG734C FPGA Mask-Programmed ASIC
Initial Cost Low High NRE
Development Time Weeks Months
Design Risk Low (reprogrammable) High (fixed)
Field Upgrades Yes No
Time-to-Market Fast Slow
Volume Cost Moderate Low (high volume)

The XC2S200-6FGG734C offers compelling advantages for applications requiring flexibility, fast development cycles, and the ability to implement field upgrades without hardware changes.


XC2S200-6FGG734C Environmental Compliance

Standard Status
RoHS Compliant Yes (Pb-Free)
REACH Compliant Yes
Halogen-Free Option Available
MSL Rating Per JEDEC J-STD-020

XC2S200-6FGG734C Ordering Information

When ordering the XC2S200-6FGG734C, verify the following specifications match your design requirements:

  • Speed Grade: -6 (commercial temperature only)
  • Package: FGG734 (734-ball Fine-Pitch BGA, Pb-Free)
  • Temperature Range: C (Commercial: 0°C to +85°C)

Related Spartan-II Devices

Device System Gates Logic Cells Max User I/O
XC2S15 15,000 432 86
XC2S30 30,000 972 92
XC2S50 50,000 1,728 176
XC2S100 100,000 2,700 176
XC2S150 150,000 3,888 260
XC2S200 200,000 5,292 284

Conclusion

The XC2S200-6FGG734C delivers outstanding value for designs requiring high logic density, extensive I/O capability, and the flexibility of programmable logic. With 200,000 system gates, 5,292 logic cells, and support for 16 I/O standards, this Spartan-II FPGA meets the demands of telecommunications, industrial, consumer, and medical applications. The Pb-free FGG734 package ensures environmental compliance while the -6 speed grade provides maximum performance for timing-critical designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.