The XC2S300E-6FG456I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-IIE family, designed to deliver exceptional performance for complex digital designs. This industrial-grade FPGA combines 300,000 system gates with advanced features, making it ideal for communications, industrial, and embedded applications.
Overview of XC2S300E-6FG456I FPGA
The XC2S300E-6FG456I represents second-generation ASIC replacement technology, offering designers unlimited in-system reprogrammability at a fraction of traditional ASIC costs. Built on cost-effective 0.15-micron technology, this Xilinx FPGA delivers robust performance in demanding industrial environments.
Key Features and Specifications
Core Architecture Specifications
| Specification |
Value |
| Logic Cells |
6,912 cells |
| System Gates |
300,000 gates |
| Configurable Logic Blocks (CLBs) |
1,536 CLBs |
| Maximum Clock Frequency |
357 MHz |
| User I/O Pins |
329 pins |
| Block RAM |
98,304 bits (64K) |
| Operating Voltage |
1.8V |
| Technology Node |
0.15μm CMOS |
Package Information
| Parameter |
Specification |
| Package Type |
FBGA (Fine-Pitch Ball Grid Array) |
| Pin Count |
456 pins |
| Package Dimensions |
23mm x 23mm |
| Pitch |
1.0mm |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| RoHS Compliance |
Lead-Free / RoHS Compliant |
Technical Capabilities and Performance
High-Speed Processing Architecture
The XC2S300E-6FG456I features a streamlined architecture based on proven Virtex-E FPGA technology. With 6,912 logic cells arranged in a 32 x 48 array configuration, this device provides ample resources for implementing complex digital logic, DSP functions, and communication protocols.
Memory Resources
The integrated SelectRAM hierarchical memory system offers:
- Total Block RAM: 98,304 bits
- Distributed RAM: Additional storage using CLB resources
- Dual-Port Capability: Simultaneous read/write operations
- Flexible Configuration: Multiple block sizes for optimized design
Clock Management System
Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide:
- Precise clock distribution
- Clock multiplication and division
- Phase shifting capabilities
- Reduced clock skew across the device
Application Areas
Industrial Automation and Control
The XC2S300E-6FG456I excels in industrial applications requiring:
- Real-time control systems
- Motor control and drives
- Factory automation equipment
- Process monitoring systems
- PLC replacements
Communications Equipment
Perfect for telecommunications infrastructure including:
- Wireless base stations
- Network routers and switches
- Protocol converters
- Signal processing units
- Data acquisition systems
Enterprise and Data Center Applications
Suitable for:
- Server management controllers
- Storage system interfaces
- Network acceleration
- Security appliances
- Load balancing systems
Design and Development
FPGA Configuration Options
| Configuration Method |
Description |
| Master Serial Mode |
Direct configuration from serial PROM |
| Slave Serial Mode |
Configuration via external processor |
| JTAG Mode |
Boundary-scan programming and debugging |
| Master Parallel Mode |
Fast configuration using parallel data |
Development Tool Support
The XC2S300E-6FG456I is fully supported by Xilinx development tools:
- ISE Design Suite: Complete design environment
- Vivado Design Suite: Modern synthesis and implementation
- ChipScope Pro: Integrated logic analyzer
- CORE Generator: Pre-verified IP cores
Comparison with Related Spartan-IIE Devices
Device Family Comparison
| Part Number |
Logic Cells |
System Gates |
CLBs |
User I/O |
Block RAM |
| XC2S200E-6FG456I |
4,320 |
200,000 |
1,200 |
329 |
73,728 bits |
| XC2S300E-6FG456I |
6,912 |
300,000 |
1,536 |
329 |
98,304 bits |
| XC2S400E-6FG456I |
10,800 |
400,000 |
2,400 |
410 |
153,600 bits |
Speed Grade Options
The “-6” speed grade offers:
- Balanced performance and power consumption
- Maximum clock frequency of 357 MHz
- Optimized for industrial temperature range
- Cost-effective solution for most applications
Package and Pin Configuration
FBGA456 Package Advantages
The 456-pin fine-pitch ball grid array offers:
- Compact Footprint: 23mm x 23mm package size
- Excellent Thermal Performance: Direct die attachment to substrate
- High I/O Density: Maximum pin utilization
- Signal Integrity: Reduced lead inductance
- Board-Level Reliability: Robust solder ball connections
Pin Assignment Features
- 329 User I/O Pins: Flexible digital interface
- 4 Global Clock Inputs: Dedicated low-skew distribution
- Multiple Voltage Banks: Independent I/O voltage domains
- JTAG Interface: Standard 4-pin boundary scan
Quality and Reliability
Industrial Temperature Range
The “I” designation indicates industrial temperature operation:
- Operating Range: -40°C to +100°C
- Extended Reliability: Harsh environment capability
- Automotive-Grade Quality: Enhanced screening processes
Manufacturing and Compliance
- Technology: 0.15μm CMOS process
- RoHS Compliance: Lead-free construction
- Quality Standards: ISO-certified manufacturing
- Lifecycle Status: Legacy product (obsolete – not recommended for new designs)
Ordering and Availability
Part Number Breakdown
XC2S300E-6FG456I decodes as:
- XC2S: Spartan-II family
- 300E: 300,000 gate Enhanced version
- -6: Speed grade
- FG456: Fine-pitch BGA, 456 pins
- I: Industrial temperature range
Replacement Considerations
As this device is marked obsolete, consider these modern alternatives for new designs:
- Spartan-6 Family: Direct architectural successor
- Spartan-7 Family: Latest cost-optimized FPGA series
- Artix-7 Family: Enhanced performance and features
Design Resources and Documentation
Available Resources
- Datasheet: Complete electrical and timing specifications
- User Guide: Detailed architecture reference
- PCB Footprints: CAD library files
- Reference Designs: Application notes and examples
- Errata Documents: Known issues and workarounds
Technical Support
Access comprehensive support through:
- Xilinx documentation portal
- Community forums and discussion boards
- Authorized distributor technical teams
- Third-party FPGA design services
Frequently Asked Questions
What is the maximum usable gate count of the XC2S300E-6FG456I?
The device offers 300,000 system gates with 6,912 logic cells, providing substantial resources for complex digital designs.
What development tools support the XC2S300E-6FG456I?
The device is supported by Xilinx ISE Design Suite (legacy) and can be migrated using Vivado Design Suite for modern development workflows.
Is the XC2S300E-6FG456I radiation hardened?
No, this is a commercial/industrial-grade device and is not radiation hardened. For space or high-radiation applications, consider Xilinx’s dedicated radiation-tolerant FPGA families.
What is the operating temperature range?
The “I” grade supports industrial temperature operation from -40°C to +100°C, suitable for demanding environmental conditions.
Can I use this FPGA in new designs?
While the device remains available from distributors, it is marked obsolete by Xilinx and is not recommended for new designs. Consider migrating to Spartan-7 or Artix-7 families for new projects.
What package options are available for the XC2S300E family?
The XC2S300E is available in multiple packages including FG456 (FBGA), FT256 (FTBGA), and PQ208 (PQFP), with both commercial and industrial temperature grades.
Conclusion
The XC2S300E-6FG456I represents proven FPGA technology from Xilinx’s successful Spartan-IIE family. With 300,000 system gates, 357 MHz performance, and industrial-grade reliability, this device continues to serve existing designs in communications, industrial automation, and embedded systems. While marked obsolete for new designs, substantial inventory remains available through authorized distributors for legacy system support and production requirements.
For designers maintaining existing systems or requiring drop-in replacements, the XC2S300E-6FG456I delivers the performance, reliability, and cost-effectiveness that made the Spartan-IIE family an industry standard in programmable logic solutions.
