The XC2S200-6FGG729C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx FPGA Spartan-II family. This device delivers exceptional performance with 200,000 system gates, making it an ideal solution for high-speed digital applications, embedded systems, and cost-effective ASIC replacement projects.
XC2S200-6FGG729C Overview and Key Features
The XC2S200-6FGG729C combines industry-leading programmable logic technology with a robust 729-ball Fine-Pitch BGA package. This FPGA offers engineers flexibility, reliability, and outstanding performance for demanding electronic design requirements.
Why Choose the XC2S200-6FGG729C?
This Spartan-II family member provides a superior alternative to mask-programmed ASICs. The XC2S200-6FGG729C eliminates the initial cost, lengthy development cycles, and inherent risks associated with conventional ASICs. Furthermore, its programmability permits field upgrades without hardware replacement—something impossible with traditional ASIC solutions.
XC2S200-6FGG729C Technical Specifications
The following table summarizes the essential technical specifications of the XC2S200-6FGG729C FPGA:
| Parameter |
Specification |
| Device Family |
Xilinx Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 Total CLBs) |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Delay-Locked Loops (DLLs) |
4 |
| Operating Frequency |
Up to 263 MHz |
| Process Technology |
0.18 μm |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Fastest) |
| Package Type |
FGG729 (729-Ball Fine-Pitch BGA, Pb-Free) |
| Operating Temperature |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Lead-Free (Pb-Free) |
XC2S200-6FGG729C Architecture Details
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG729C features 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB contains multiple slices with look-up tables (LUTs), flip-flops, and dedicated carry logic for efficient arithmetic operations. This architecture enables complex digital design implementations with optimal resource utilization.
Input/Output Blocks (IOBs)
With up to 284 user-programmable I/O pins, the XC2S200-6FGG729C supports multiple I/O standards for seamless integration with various system components. The IOBs provide configurable pull-up/pull-down resistors, programmable slew rate control, and multiple voltage standards to meet diverse interface requirements.
On-Chip Memory Resources
Distributed RAM
The XC2S200-6FGG729C includes 75,264 bits of distributed RAM implemented within the CLB structure. This distributed memory provides flexible, fast storage options throughout the device fabric, ideal for small buffers and register files.
Dedicated Block RAM
Additionally, 56 Kbits of dedicated Block RAM are available in fully synchronous dual-port configurations. Each 4,096-bit block RAM cell offers independent control signals for each port, supporting configurable data widths for versatile memory implementations.
Delay-Locked Loops (DLLs)
Four integrated Delay-Locked Loops, positioned at each corner of the die, provide advanced clock management capabilities. These DLLs enable clock deskewing, frequency synthesis, and phase shifting for precise timing control in high-speed designs.
XC2S200-6FGG729C Package Information
FGG729 Package Specifications
The FGG729 package represents a 729-ball Fine-Pitch Ball Grid Array with lead-free (Pb-free) construction. The “G” designation in the package name indicates compliance with RoHS environmental directives through lead-free solder ball composition.
| Package Attribute |
Value |
| Package Type |
Fine-Pitch BGA |
| Total Pins |
729 |
| Ball Pitch |
1.0 mm |
| Environmental Compliance |
Pb-Free, RoHS Compliant |
Understanding the Part Number
The XC2S200-6FGG729C part number follows Xilinx’s standard naming convention:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade designation (fastest available)
- FG: Fine-Pitch BGA package type
- G: Lead-free (Pb-free) packaging option
- 729: Total ball count
- C: Commercial temperature range (0°C to +85°C)
XC2S200-6FGG729C Speed Grade Performance
The -6 speed grade represents the fastest performance tier available for Spartan-II devices. This grade is exclusively offered in the commercial temperature range, delivering optimal timing characteristics for demanding applications.
Speed Grade Comparison
| Speed Grade |
Performance Level |
Temperature Range |
| -6 |
Fastest |
Commercial Only |
| -5 |
Standard |
Commercial / Industrial |
| -4 |
Economy |
Commercial / Industrial |
XC2S200-6FGG729C Configuration Options
The XC2S200-6FGG729C supports multiple configuration modes for flexible system integration:
Supported Configuration Modes
| Mode |
Data Width |
CCLK Direction |
Description |
| Master Serial |
1-bit |
Output |
Self-timed configuration from external PROM |
| Slave Serial |
1-bit |
Input |
Controlled by external processor |
| Slave Parallel |
8-bit |
Input |
Fast parallel configuration |
| Boundary-Scan (JTAG) |
1-bit |
N/A |
IEEE 1149.1 compliant configuration |
Configuration Data Size
The XC2S200-6FGG729C requires approximately 1,335,840 bits (167 KB) of configuration data, supporting efficient storage in external PROMs or flash memory devices.
XC2S200-6FGG729C Applications
The versatility of the XC2S200-6FGG729C makes it suitable for numerous high-performance applications:
Industrial and Automation
- Programmable logic controllers (PLCs)
- Motor control systems
- Industrial networking and communication
- Sensor interface and data acquisition
Telecommunications
- Protocol conversion and bridging
- Digital signal processing modules
- Network interface controllers
- Baseband processing units
Consumer Electronics
- Video processing and display controllers
- Audio processing systems
- Gaming hardware
- Set-top boxes and multimedia devices
Embedded Systems
- Microcontroller peripheral expansion
- Custom interface controllers
- Hardware acceleration modules
- System-on-chip integration
XC2S200-6FGG729C Development Support
Design Tools
The XC2S200-6FGG729C is fully supported by Xilinx ISE Design Suite, providing comprehensive development capabilities:
- HDL synthesis (VHDL/Verilog)
- Implementation and place-and-route
- Timing analysis and simulation
- In-system debugging with ChipScope
Documentation Resources
Complete technical documentation supports XC2S200-6FGG729C implementation:
- DS001: Spartan-II Family Data Sheet
- Application notes and design guides
- Package drawings and pinout specifications
- Configuration and programming guides
XC2S200-6FGG729C Ordering Information
When ordering the XC2S200-6FGG729C, ensure the following specifications match your requirements:
| Order Parameter |
Specification |
| Part Number |
XC2S200-6FGG729C |
| Device Type |
Spartan-II FPGA |
| Speed Grade |
-6 |
| Package |
FGG729 (Pb-Free) |
| Temperature |
Commercial |
Conclusion
The XC2S200-6FGG729C delivers an exceptional combination of high-speed performance, generous logic resources, and flexible I/O capabilities in an environmentally compliant package. With 200,000 system gates, 5,292 logic cells, and advanced features including integrated Block RAM and DLLs, this Spartan-II FPGA provides an ideal platform for cost-sensitive, high-volume applications requiring programmable logic solutions.
For engineers seeking a reliable, high-performance FPGA with comprehensive development support and proven technology, the XC2S200-6FGG729C represents an outstanding choice that balances functionality, speed, and value.
