The XC2S200-6FGG716C is a powerful Field-Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family, engineered to deliver exceptional performance for demanding digital design applications. This commercial-grade programmable logic device combines 200,000 system gates with advanced architecture features, making it an ideal solution for engineers seeking flexibility, reliability, and cost-effectiveness in their embedded system designs.
XC2S200-6FGG716C Technical Specifications Overview
The XC2S200-6FGG716C represents the flagship device in the Spartan-II product lineup, offering maximum logic density and I/O capability. Below is a comprehensive breakdown of its technical specifications.
Core Architecture Specifications
| Parameter |
Specification |
| Device Family |
Xilinx Spartan-II |
| Part Number |
XC2S200-6FGG716C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Speed Grade |
-6 (Fastest) |
| Process Technology |
0.18µm CMOS |
| Supply Voltage |
2.5V Core |
XC2S200-6FGG716C Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (7 blocks × 4,096 bits) |
| Configuration Bits |
1,335,840 |
Package and I/O Configuration
| Specification |
Value |
| Package Type |
FGG716 (Fine Pitch Ball Grid Array) |
| Pin Count |
716 |
| Maximum User I/O |
284 |
| Global Clock Pins |
4 |
| Operating Temperature |
Commercial (0°C to +85°C) |
| RoHS Compliant |
Yes (Pb-Free) |
Key Features of the XC2S200-6FGG716C Spartan-II FPGA
High-Speed Performance with -6 Speed Grade
The XC2S200-6FGG716C features the fastest -6 speed grade available in the Spartan-II family, enabling maximum clock frequencies up to 263 MHz. This speed grade is exclusively available for commercial temperature applications, providing optimal performance for high-bandwidth signal processing and communication systems.
Advanced Configurable Logic Blocks (CLBs)
Each CLB in the XC2S200-6FGG716C contains:
- 4 Logic Cells (LCs) arranged in 2 slices
- 2 Function Generators (4-input LUTs) per slice
- 2 Flip-Flops per slice with clock enable
- Fast carry logic for arithmetic operations
- Distributed RAM capability for local storage
Flexible Input/Output Blocks (IOBs)
The XC2S200-6FGG716C IOBs support multiple I/O standards for seamless system integration:
- LVTTL (3.3V Low-Voltage TTL)
- LVCMOS (2.5V, 3.3V)
- PCI (33 MHz, 3.3V signaling)
- GTL/GTL+ for high-speed buses
- SSTL for DDR memory interfaces
- HSTL for high-speed logic
Four Delay-Locked Loops (DLLs)
The XC2S200-6FGG716C integrates four DLLs positioned at each corner of the die, providing:
- Clock deskewing for eliminating distribution delays
- Frequency synthesis (multiply/divide)
- Phase shifting for precise timing control
- Clock domain management for complex designs
XC2S200-6FGG716C DC Electrical Characteristics
Power Supply Requirements
| Parameter |
Minimum |
Typical |
Maximum |
Unit |
| VCCINT (Core) |
2.375 |
2.5 |
2.625 |
V |
| VCCO (I/O) |
2.3 |
3.3 |
3.6 |
V |
| Input Low Voltage (VIL) |
-0.5 |
— |
0.8 |
V |
| Input High Voltage (VIH) |
2.0 |
— |
5.5 |
V |
Power Consumption Characteristics
The XC2S200-6FGG716C offers efficient power consumption profiles suitable for portable and power-sensitive applications. Typical quiescent current remains under 10mA, while dynamic power consumption varies based on clock frequency and resource utilization.
XC2S200-6FGG716C Configuration Modes
The XC2S200-6FGG716C supports multiple configuration modes for flexible system design:
| Mode |
CCLK Direction |
Data Width |
Description |
| Master Serial |
Output |
1-bit |
Device controls configuration clock |
| Slave Serial |
Input |
1-bit |
External controller drives clock |
| Slave Parallel |
Input |
8-bit |
High-speed parallel loading |
| Boundary Scan |
N/A |
1-bit |
JTAG-based configuration |
Typical Applications for XC2S200-6FGG716C FPGA
The XC2S200-6FGG716C excels in numerous application domains where programmable logic offers advantages over fixed-function ASICs:
Telecommunications and Networking
- Protocol bridging and conversion
- Network interface controllers
- Base station processing
- VoIP codec implementations
Industrial Automation and Control
- Motion control systems
- Programmable logic controllers
- Sensor interface processing
- Real-time monitoring systems
Consumer Electronics
- Video processing and scaling
- Audio codec implementations
- Display controllers
- Gaming peripherals
Embedded Systems
- Microcontroller peripherals expansion
- Custom bus interfaces
- Hardware acceleration modules
- System-on-Chip (SoC) integration
Automotive Applications
- In-vehicle networking
- Dashboard display controllers
- Sensor fusion systems
- Driver assistance processing
XC2S200-6FGG716C vs. Alternative FPGA Solutions
Advantages Over Mask-Programmed ASICs
The XC2S200-6FGG716C provides significant benefits compared to traditional ASIC solutions:
- Zero NRE Costs — No mask development expenses
- Rapid Time-to-Market — Immediate prototyping capability
- Field Upgradability — In-system reprogramming support
- Design Flexibility — Modify functionality without hardware changes
- Risk Reduction — Verify designs before volume production
Comparison with Other Spartan-II Devices
| Feature |
XC2S100 |
XC2S150 |
XC2S200-6FGG716C |
| System Gates |
100K |
150K |
200K |
| Logic Cells |
2,700 |
3,888 |
5,292 |
| Block RAM |
40K |
48K |
56K |
| Max User I/O |
176 |
260 |
284 |
Development Tools and Software Support
The XC2S200-6FGG716C is fully supported by the Xilinx ISE Design Suite, providing comprehensive development capabilities:
- Design Entry — Schematic capture and HDL (Verilog/VHDL)
- Synthesis — XST synthesis engine optimization
- Implementation — Place-and-route with timing optimization
- Verification — Integrated simulation and timing analysis
- Programming — iMPACT configuration tool support
For engineers seeking reliable Xilinx FPGA components, the XC2S200-6FGG716C offers proven architecture backed by extensive documentation and application support.
Ordering Information for XC2S200-6FGG716C
Part Number Breakdown
XC2S200 - 6 - FGG716 - C
│ │ │ │
│ │ │ └── C = Commercial (0°C to +85°C)
│ │ │
│ │ └── FGG716 = 716-ball Fine Pitch BGA (Pb-Free)
│ │
│ └── -6 = Fastest Speed Grade
│
└── XC2S200 = Spartan-II, 200K Gates
Package Options Available
| Package Code |
Description |
Ball Count |
| PQ(G)208 |
Plastic Quad Flat Pack |
208 |
| FG(G)256 |
Fine Pitch BGA |
256 |
| FG(G)456 |
Fine Pitch BGA |
456 |
| FGG716 |
Fine Pitch BGA (Pb-Free) |
716 |
Quality and Compliance Standards
The XC2S200-6FGG716C meets stringent quality and environmental standards:
- RoHS Compliant — Lead-free (Pb-free) packaging designated by “G” suffix
- MSL Rating — Moisture Sensitivity Level 3
- ECCN — Export Classification Number 3A991.D
- Quality System — ISO 9001 certified manufacturing
Storage and Handling Guidelines for XC2S200-6FGG716C
Environmental Requirements
| Parameter |
Requirement |
| Storage Temperature |
-40°C to +85°C |
| Humidity |
< 10% RH (dry pack) |
| Floor Life |
168 hours (MSL-3) |
| Reflow Temperature |
260°C peak (Pb-free) |
ESD Precautions
The XC2S200-6FGG716C requires proper ESD handling procedures:
- Use grounded wrist straps
- Store in anti-static packaging
- Handle on ESD-safe workstations
- Implement humidity control in assembly areas
Conclusion: Why Choose the XC2S200-6FGG716C
The XC2S200-6FGG716C Xilinx Spartan-II FPGA delivers an optimal combination of performance, flexibility, and value for demanding digital design applications. With its 200,000 system gates, 5,292 logic cells, and comprehensive I/O capability in a 716-ball BGA package, this device provides engineers with the resources needed to implement complex designs while maintaining cost-effectiveness.
Whether you’re developing telecommunications equipment, industrial control systems, or embedded applications, the XC2S200-6FGG716C offers the programmable logic solution that enables faster development cycles, reduced risk, and field-upgradable functionality that traditional ASICs cannot match.