Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG716C: High-Performance Spartan-II FPGA for Advanced Digital Design Applications

Product Details

The XC2S200-6FGG716C is a powerful Field-Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family, engineered to deliver exceptional performance for demanding digital design applications. This commercial-grade programmable logic device combines 200,000 system gates with advanced architecture features, making it an ideal solution for engineers seeking flexibility, reliability, and cost-effectiveness in their embedded system designs.


XC2S200-6FGG716C Technical Specifications Overview

The XC2S200-6FGG716C represents the flagship device in the Spartan-II product lineup, offering maximum logic density and I/O capability. Below is a comprehensive breakdown of its technical specifications.

Core Architecture Specifications

Parameter Specification
Device Family Xilinx Spartan-II
Part Number XC2S200-6FGG716C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Speed Grade -6 (Fastest)
Process Technology 0.18µm CMOS
Supply Voltage 2.5V Core

XC2S200-6FGG716C Memory Resources

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56 Kbits (7 blocks × 4,096 bits)
Configuration Bits 1,335,840

Package and I/O Configuration

Specification Value
Package Type FGG716 (Fine Pitch Ball Grid Array)
Pin Count 716
Maximum User I/O 284
Global Clock Pins 4
Operating Temperature Commercial (0°C to +85°C)
RoHS Compliant Yes (Pb-Free)

Key Features of the XC2S200-6FGG716C Spartan-II FPGA

High-Speed Performance with -6 Speed Grade

The XC2S200-6FGG716C features the fastest -6 speed grade available in the Spartan-II family, enabling maximum clock frequencies up to 263 MHz. This speed grade is exclusively available for commercial temperature applications, providing optimal performance for high-bandwidth signal processing and communication systems.

Advanced Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG716C contains:

  • 4 Logic Cells (LCs) arranged in 2 slices
  • 2 Function Generators (4-input LUTs) per slice
  • 2 Flip-Flops per slice with clock enable
  • Fast carry logic for arithmetic operations
  • Distributed RAM capability for local storage

Flexible Input/Output Blocks (IOBs)

The XC2S200-6FGG716C IOBs support multiple I/O standards for seamless system integration:

  • LVTTL (3.3V Low-Voltage TTL)
  • LVCMOS (2.5V, 3.3V)
  • PCI (33 MHz, 3.3V signaling)
  • GTL/GTL+ for high-speed buses
  • SSTL for DDR memory interfaces
  • HSTL for high-speed logic

Four Delay-Locked Loops (DLLs)

The XC2S200-6FGG716C integrates four DLLs positioned at each corner of the die, providing:

  • Clock deskewing for eliminating distribution delays
  • Frequency synthesis (multiply/divide)
  • Phase shifting for precise timing control
  • Clock domain management for complex designs

XC2S200-6FGG716C DC Electrical Characteristics

Power Supply Requirements

Parameter Minimum Typical Maximum Unit
VCCINT (Core) 2.375 2.5 2.625 V
VCCO (I/O) 2.3 3.3 3.6 V
Input Low Voltage (VIL) -0.5 0.8 V
Input High Voltage (VIH) 2.0 5.5 V

Power Consumption Characteristics

The XC2S200-6FGG716C offers efficient power consumption profiles suitable for portable and power-sensitive applications. Typical quiescent current remains under 10mA, while dynamic power consumption varies based on clock frequency and resource utilization.


XC2S200-6FGG716C Configuration Modes

The XC2S200-6FGG716C supports multiple configuration modes for flexible system design:

Mode CCLK Direction Data Width Description
Master Serial Output 1-bit Device controls configuration clock
Slave Serial Input 1-bit External controller drives clock
Slave Parallel Input 8-bit High-speed parallel loading
Boundary Scan N/A 1-bit JTAG-based configuration

Typical Applications for XC2S200-6FGG716C FPGA

The XC2S200-6FGG716C excels in numerous application domains where programmable logic offers advantages over fixed-function ASICs:

Telecommunications and Networking

  • Protocol bridging and conversion
  • Network interface controllers
  • Base station processing
  • VoIP codec implementations

Industrial Automation and Control

  • Motion control systems
  • Programmable logic controllers
  • Sensor interface processing
  • Real-time monitoring systems

Consumer Electronics

  • Video processing and scaling
  • Audio codec implementations
  • Display controllers
  • Gaming peripherals

Embedded Systems

  • Microcontroller peripherals expansion
  • Custom bus interfaces
  • Hardware acceleration modules
  • System-on-Chip (SoC) integration

Automotive Applications

  • In-vehicle networking
  • Dashboard display controllers
  • Sensor fusion systems
  • Driver assistance processing

XC2S200-6FGG716C vs. Alternative FPGA Solutions

Advantages Over Mask-Programmed ASICs

The XC2S200-6FGG716C provides significant benefits compared to traditional ASIC solutions:

  1. Zero NRE Costs — No mask development expenses
  2. Rapid Time-to-Market — Immediate prototyping capability
  3. Field Upgradability — In-system reprogramming support
  4. Design Flexibility — Modify functionality without hardware changes
  5. Risk Reduction — Verify designs before volume production

Comparison with Other Spartan-II Devices

Feature XC2S100 XC2S150 XC2S200-6FGG716C
System Gates 100K 150K 200K
Logic Cells 2,700 3,888 5,292
Block RAM 40K 48K 56K
Max User I/O 176 260 284

Development Tools and Software Support

The XC2S200-6FGG716C is fully supported by the Xilinx ISE Design Suite, providing comprehensive development capabilities:

  • Design Entry — Schematic capture and HDL (Verilog/VHDL)
  • Synthesis — XST synthesis engine optimization
  • Implementation — Place-and-route with timing optimization
  • Verification — Integrated simulation and timing analysis
  • Programming — iMPACT configuration tool support

For engineers seeking reliable Xilinx FPGA components, the XC2S200-6FGG716C offers proven architecture backed by extensive documentation and application support.


Ordering Information for XC2S200-6FGG716C

Part Number Breakdown

XC2S200 - 6 - FGG716 - C
   │      │     │      │
   │      │     │      └── C = Commercial (0°C to +85°C)
   │      │     │
   │      │     └── FGG716 = 716-ball Fine Pitch BGA (Pb-Free)
   │      │
   │      └── -6 = Fastest Speed Grade
   │
   └── XC2S200 = Spartan-II, 200K Gates

Package Options Available

Package Code Description Ball Count
PQ(G)208 Plastic Quad Flat Pack 208
FG(G)256 Fine Pitch BGA 256
FG(G)456 Fine Pitch BGA 456
FGG716 Fine Pitch BGA (Pb-Free) 716

Quality and Compliance Standards

The XC2S200-6FGG716C meets stringent quality and environmental standards:

  • RoHS Compliant — Lead-free (Pb-free) packaging designated by “G” suffix
  • MSL Rating — Moisture Sensitivity Level 3
  • ECCN — Export Classification Number 3A991.D
  • Quality System — ISO 9001 certified manufacturing

Storage and Handling Guidelines for XC2S200-6FGG716C

Environmental Requirements

Parameter Requirement
Storage Temperature -40°C to +85°C
Humidity < 10% RH (dry pack)
Floor Life 168 hours (MSL-3)
Reflow Temperature 260°C peak (Pb-free)

ESD Precautions

The XC2S200-6FGG716C requires proper ESD handling procedures:

  • Use grounded wrist straps
  • Store in anti-static packaging
  • Handle on ESD-safe workstations
  • Implement humidity control in assembly areas

Conclusion: Why Choose the XC2S200-6FGG716C

The XC2S200-6FGG716C Xilinx Spartan-II FPGA delivers an optimal combination of performance, flexibility, and value for demanding digital design applications. With its 200,000 system gates, 5,292 logic cells, and comprehensive I/O capability in a 716-ball BGA package, this device provides engineers with the resources needed to implement complex designs while maintaining cost-effectiveness.

Whether you’re developing telecommunications equipment, industrial control systems, or embedded applications, the XC2S200-6FGG716C offers the programmable logic solution that enables faster development cycles, reduced risk, and field-upgradable functionality that traditional ASICs cannot match.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.