Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG714C Spartan-II FPGA: High-Performance Programmable Gate Array Solution

Product Details

The XC2S200-6FGG714C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, manufactured by AMD (formerly Xilinx). This high-density programmable logic device delivers exceptional performance for cost-sensitive applications requiring reliable digital signal processing and embedded control capabilities.

XC2S200-6FGG714C Overview and Key Features

The XC2S200-6FGG714C represents the pinnacle of the Spartan-II FPGA family, offering 200,000 system gates in a fine-pitch BGA package. This Xilinx FPGA combines advanced programmable logic with cost-effective implementation, making it ideal for high-volume production applications.

Core Architecture Specifications

The XC2S200-6FGG714C features a robust internal architecture based on Virtex FPGA technology:

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Process Technology 0.18µm CMOS
Core Voltage 2.5V
Speed Grade -6 (High Performance)

Programmable Logic Resources

The XC2S200-6FGG714C provides extensive configurable logic blocks organized in a flexible, programmable architecture:

  • Configurable Logic Blocks (CLBs): 1,176 total CLBs arranged in a 28×42 array
  • Look-Up Tables (LUTs): 4-input function generators implementing any Boolean function
  • Flip-Flops/Latches: Abundant registers with enable, set, and reset capabilities
  • Dedicated Carry Logic: High-speed arithmetic operations support
  • Cascade Chain: Wide-input function implementation

XC2S200-6FGG714C Memory Capabilities

Block RAM Features

The integrated block RAM provides substantial on-chip memory resources:

Memory Type Capacity
Total Block RAM 56 Kbits
Block RAM Cells 14 blocks
RAM Configuration 4,096-bit dual-port
Port Width Options 1, 2, 4, 8, or 16 bits

Each block RAM cell operates as a fully synchronous dual-ported RAM with independent control signals for each port, enabling simultaneous read and write operations.

Distributed RAM Resources

Memory Type Capacity
Distributed RAM 75,264 bits
RAM per LUT 16 bits
Configuration Single or dual-port

XC2S200-6FGG714C I/O Standards and Interface Support

Supported I/O Standards

The XC2S200-6FGG714C supports 16 high-performance interface standards:

  • LVTTL – Low Voltage TTL (2-24 mA drive)
  • LVCMOS2 – Low Voltage CMOS 2.5V
  • PCI – 3.3V/5V compliant at 33/66 MHz
  • GTL/GTL+ – Gunning Transceiver Logic
  • HSTL Class I, III, IV – High-Speed Transceiver Logic
  • SSTL2/SSTL3 Class I and II – Stub Series Terminated Logic
  • CTT – Center Tap Terminated
  • AGP-2X – Accelerated Graphics Port

I/O Banking Architecture

The device features eight independent I/O banks, allowing mixed voltage operations across different interface standards while maintaining signal integrity.

XC2S200-6FGG714C Clock Management

Delay-Locked Loop (DLL) Features

Four dedicated DLLs provide advanced clock management:

Feature Specification
Number of DLLs 4
Clock Multiplication
Clock Division 1.5, 2, 2.5, 3, 4, 5, 8, 16
Phase Outputs 0°, 90°, 180°, 270°
Global Clock Networks 4 primary, 24 secondary

Clock Distribution Benefits

  • Zero propagation delay compensation
  • Low clock skew across the device
  • Board-level clock deskewing capability
  • Duty cycle correction

XC2S200-6FGG714C Configuration Options

Multiple Configuration Modes

Mode Data Width CCLK Direction
Master Serial 1-bit Output
Slave Serial 1-bit Input
Slave Parallel 8-bit Input
Boundary Scan (JTAG) 1-bit N/A

Configuration File Size

The XC2S200-6FGG714C requires 1,335,840 bits for complete configuration, supporting unlimited reprogramming cycles through SRAM-based configuration memory.

XC2S200-6FGG714C Package and Electrical Specifications

Package Details

Parameter Value
Package Type Fine-Pitch BGA (FBGA)
Pin Count 714
Pb-Free Option Available (G suffix)
Temperature Range Commercial (0°C to +85°C)

Power Supply Requirements

Supply Voltage Range
VCCINT (Core) 2.375V to 2.625V
VCCO (I/O Banks) 1.5V, 2.5V, or 3.3V

XC2S200-6FGG714C Design and Development Support

Software Tools

The XC2S200-6FGG714C is fully supported by the Xilinx ISE Design Suite, providing:

  • Automatic mapping, placement, and routing
  • Timing-driven optimization
  • HDL synthesis support
  • In-circuit debugging capabilities

Boundary Scan Testing

Full IEEE 1149.1 JTAG boundary scan compliance enables:

  • EXTEST for external interconnect testing
  • SAMPLE/PRELOAD for device verification
  • BYPASS for efficient chain configuration
  • User-defined scan chain support

XC2S200-6FGG714C Target Applications

The XC2S200-6FGG714C excels in various application domains:

Industrial Applications

  • Programmable logic controllers
  • Motor drive control systems
  • Industrial automation equipment
  • Process control interfaces

Communications Systems

  • Protocol conversion bridges
  • Data encryption/decryption
  • Network interface controllers
  • Telecommunications equipment

Consumer Electronics

  • Set-top boxes
  • Digital display controllers
  • Audio/video processing
  • Gaming peripherals

Automotive Systems

  • In-vehicle networking
  • Dashboard controllers
  • Sensor interface modules
  • Diagnostic systems

XC2S200-6FGG714C Ordering Information

Part Number Breakdown

XC2S200-6FGG714C

  • XC2S200: Spartan-II device, 200K system gates
  • -6: High-performance speed grade
  • FGG: Fine-pitch BGA package, Pb-free
  • 714: Pin count
  • C: Commercial temperature range

Why Choose the XC2S200-6FGG714C

The XC2S200-6FGG714C offers compelling advantages for design engineers:

  1. Cost-Effective Performance: Superior alternative to mask-programmed ASICs without initial NRE costs
  2. Design Flexibility: Unlimited reprogrammability enables field upgrades and design iterations
  3. Rich Feature Set: Comprehensive I/O standards, integrated RAM, and advanced clocking
  4. Proven Technology: Based on mature 0.18µm process with established reliability
  5. Development Ecosystem: Full tool support with extensive documentation and IP cores

Technical Documentation Resources

For complete technical specifications, refer to the official Spartan-II FPGA Family Data Sheet (DS001), which includes:

  • Module 1: Introduction and Ordering Information
  • Module 2: Functional Description
  • Module 3: DC and Switching Characteristics
  • Module 4: Pinout Tables

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.