Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG711C: High-Performance Xilinx Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG711C is a powerful field-programmable gate array (FPGA) from Xilinx’s proven Spartan-II family, delivering exceptional performance and reliability for demanding industrial and commercial applications. This 200K system gate FPGA combines advanced programmable logic capabilities with cost-effective implementation, making it an ideal solution for engineers seeking robust digital signal processing, telecommunications, and embedded control systems.


XC2S200-6FGG711C Key Features and Benefits

The Xilinx XC2S200-6FGG711C offers a comprehensive feature set that distinguishes it in the programmable logic market. Built on Xilinx’s mature 0.18μm CMOS technology, this device provides an excellent balance between performance, power consumption, and cost-effectiveness.

Core Logic Architecture

The XC2S200-6FGG711C incorporates a flexible, programmable architecture featuring:

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits

Speed Grade and Performance

The “-6” speed grade designation indicates this is the fastest speed grade available in the commercial temperature range for the Spartan-II family. This makes the XC2S200-6FGG711C ideal for applications requiring maximum clock frequencies and minimum propagation delays.

Package Configuration

The FGG711 package is a Fine-Pitch Ball Grid Array (FBGA) configuration that provides:

  • Excellent thermal performance
  • Superior signal integrity
  • Pb-free (RoHS compliant) construction
  • Reliable surface mount assembly

XC2S200-6FGG711C Technical Specifications

Electrical Characteristics

Parameter Specification
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V to 3.3V
Operating Temperature 0°C to +85°C (Commercial)
Process Technology 0.18μm CMOS
Maximum Frequency 263MHz

Memory Resources

The XC2S200-6FGG711C features a hierarchical memory architecture:

Distributed RAM

  • Total capacity: 75,264 bits
  • Implemented using look-up tables (LUTs)
  • Supports synchronous single-port and dual-port configurations
  • Ideal for FIFO buffers and small data storage

Block RAM

  • Total capacity: 56K bits (14 blocks × 4,096 bits)
  • True dual-port synchronous RAM
  • Configurable data widths (1, 2, 4, 8, 16 bits)
  • Independent read/write clocks per port
  • Supports ROM initialization

Clock Management

The XC2S200-6FGG711C includes four Delay-Locked Loops (DLLs), one positioned at each corner of the die:

  • Clock deskew and phase alignment
  • Clock multiplication and division
  • Zero-delay buffer functionality
  • Support for board-level clock distribution

XC2S200-6FGG711C Applications

Telecommunications and Networking

The high I/O count and flexible logic resources make the XC2S200-6FGG711C suitable for:

  • Protocol conversion and bridging
  • Data packet processing
  • Network interface controllers
  • SDH/SONET framing

Industrial Automation

Engineers frequently deploy this FPGA in:

  • Motor control systems
  • Programmable logic controllers (PLCs)
  • Industrial communication interfaces
  • Sensor data acquisition

Consumer Electronics

The cost-effective nature of the Spartan-II family enables applications in:

  • Set-top boxes
  • Digital displays
  • Audio/video processing
  • Gaming peripherals

Aerospace and Defense

With proper qualification, variants support:

  • Avionics systems
  • Radar signal processing
  • Secure communications
  • Test and measurement equipment

XC2S200-6FGG711C I/O Capabilities

Supported I/O Standards

The XC2S200-6FGG711C Input/Output Blocks (IOBs) support multiple I/O standards for seamless system integration:

  • LVTTL (3.3V)
  • LVCMOS (3.3V, 2.5V)
  • PCI (3.3V)
  • GTL and GTL+
  • SSTL3 (Class I and II)
  • HSTL (Class I, II, III, IV)
  • CTT
  • AGP-2X

I/O Features

Each IOB provides:

  • Programmable slew rate control
  • Selectable pull-up/pull-down resistors
  • Input delay elements
  • Three-state output control
  • Registered input and output paths

XC2S200-6FGG711C Configuration Options

The XC2S200-6FGG711C supports multiple configuration modes for maximum design flexibility:

Configuration Mode Data Width CCLK Direction
Master Serial 1-bit Output
Slave Serial 1-bit Input
Slave Parallel 8-bit Input
Boundary Scan (JTAG) 1-bit N/A

Configuration Data

  • Total configuration bits: 1,335,840
  • JTAG IEEE 1149.1 compliant
  • In-system reconfiguration support
  • Compatible with Xilinx Platform Flash and third-party PROMs

Why Choose the XC2S200-6FGG711C Spartan-II FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG711C serves as a superior alternative to mask-programmed ASICs. Benefits include:

  • Zero NRE costs: No expensive mask tooling required
  • Rapid development: Eliminate lengthy ASIC design cycles
  • Risk mitigation: Design changes possible at any development stage
  • Field upgradability: Update functionality without hardware replacement

Proven Reliability

The Spartan-II family has a proven track record spanning decades of successful deployments across diverse industries. Xilinx’s mature 0.18μm process ensures consistent quality and reliable supply.

Comprehensive Ecosystem

For more Xilinx FPGA products and development resources, engineers have access to:

  • Xilinx ISE Design Suite
  • Comprehensive reference designs
  • Application notes and technical documentation
  • Global technical support network

XC2S200-6FGG711C Development Tools

Software Support

  • ISE WebPACK: Free design tools for synthesis and implementation
  • ISE Foundation: Full-featured development environment
  • ChipScope Pro: On-chip debugging and analysis
  • ModelSim XE: VHDL/Verilog simulation

IP Core Library

Pre-verified IP cores accelerate development:

  • UART and SPI controllers
  • Memory interfaces
  • PCI bridge cores
  • DSP building blocks

XC2S200-6FGG711C Ordering Information

Part Number Breakdown

XC2S200-6FGG711C

Code Meaning
XC Xilinx Commercial
2S Spartan-II Family
200 200K System Gates
-6 Speed Grade (Fastest)
FGG Fine-Pitch BGA (Pb-free)
711 Pin Count
C Commercial Temperature (0°C to +85°C)

Availability and Lead Times

Contact authorized Xilinx distributors for current pricing, stock availability, and volume discounts. The XC2S200-6FGG711C is available through major electronic component distributors worldwide.


XC2S200-6FGG711C Summary

The XC2S200-6FGG711C represents an excellent solution for engineers requiring a reliable, high-performance FPGA with proven technology. With 200,000 system gates, 5,292 logic cells, 56K block RAM, and 284 maximum user I/O pins, this Spartan-II device delivers the resources needed for complex digital designs while maintaining cost-effectiveness.

Whether developing telecommunications equipment, industrial controls, or consumer electronics, the XC2S200-6FGG711C provides the flexibility, performance, and reliability that modern electronic designs demand.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.