The XC2S200-6FGG708C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family. This advanced programmable logic device delivers exceptional performance, reliability, and flexibility for demanding industrial, commercial, and telecommunications applications. With 200,000 system gates, 5,292 logic cells, and a 708-pin fine-pitch BGA package, the XC2S200-6FGG708C represents the ideal solution for engineers seeking cost-effective ASIC replacement technology.
XC2S200-6FGG708C Key Features and Benefits
The XC2S200-6FGG708C offers an impressive array of features that make it a superior choice for complex digital design implementations:
High-Density Logic Architecture
The XC2S200-6FGG708C features a robust 28 × 42 configurable logic block (CLB) array, providing 1,176 total CLBs for implementing sophisticated digital circuits. This Xilinx FPGA delivers the highest gate density in the Spartan-II family, making it ideal for applications requiring substantial logic resources.
On-Chip Memory Resources
The device integrates generous on-chip memory capabilities, including 75,264 bits of distributed RAM and 56 Kbits of dedicated block RAM. This dual-memory architecture enables efficient implementation of FIFOs, lookup tables, register files, and other memory-intensive functions without consuming external memory resources.
Advanced Clock Management
Four integrated Delay-Locked Loops (DLLs) positioned at each corner of the die provide sophisticated clock management capabilities. These DLLs enable clock deskewing, frequency synthesis, and phase shifting operations, supporting system clock rates up to 200 MHz for high-speed applications.
XC2S200-6FGG708C Technical Specifications
| Parameter |
Specification |
| Device Family |
Xilinx Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| DLLs |
4 |
| Speed Grade |
-6 (Fastest) |
| Core Voltage |
2.5V |
| Process Technology |
0.18 µm CMOS |
| Package Type |
FGG708 (Fine-Pitch BGA, Pb-Free) |
| Pin Count |
708 |
| Operating Temperature |
Commercial (0°C to +85°C) |
| Maximum Operating Frequency |
263 MHz |
XC2S200-6FGG708C Package Information
FGG708 Fine-Pitch BGA Package
The XC2S200-6FGG708C utilizes a 708-ball fine-pitch ball grid array (BGA) package that offers several advantages for modern PCB designs:
Enhanced Signal Integrity
The BGA package configuration provides superior electrical performance with shorter lead lengths and reduced parasitic inductance, ensuring clean signal transmission at high frequencies.
Thermal Performance
The package design facilitates efficient heat dissipation through the PCB, maintaining optimal operating temperatures even in demanding applications.
RoHS Compliance
The “G” designation in the FGG708 package code indicates Pb-free (lead-free) construction, ensuring full compliance with RoHS environmental directives.
XC2S200-6FGG708C I/O Capabilities
Flexible I/O Standards Support
The XC2S200-6FGG708C supports 16 different I/O standards, enabling seamless interfacing with various system components:
- LVTTL (Low-Voltage TTL)
- LVCMOS (3.3V, 2.5V, 1.8V)
- PCI (33 MHz and 66 MHz compliant)
- GTL and GTL+
- HSTL (Classes I, II, III, IV)
- SSTL (Classes I and II)
- SSTL2 and SSTL3
- AGP-2X
- CTT
Independent I/O Banking
The device features eight independent VCCO banks, allowing designers to interface with multiple voltage domains simultaneously without requiring level translation circuitry.
XC2S200-6FGG708C Application Areas
The XC2S200-6FGG708C excels in numerous application domains:
Telecommunications Equipment
The high-speed performance and abundant logic resources make this FPGA ideal for implementing protocol converters, channel cards, and base station equipment.
Industrial Automation
Programmable logic controllers, motor drive systems, and process control applications benefit from the device’s reliability and reconfigurability.
Digital Signal Processing
With substantial on-chip memory and fast multiplication capabilities, the XC2S200-6FGG708C efficiently implements FIR filters, FFT engines, and image processing algorithms.
Networking Infrastructure
Routers, switches, and network interface cards leverage the device’s I/O flexibility and processing power for packet handling and protocol conversion.
Consumer Electronics
Set-top boxes, digital displays, and multimedia devices utilize the cost-effective processing capabilities of this Spartan-II FPGA.
XC2S200-6FGG708C Development Tools
ISE Design Suite Support
The XC2S200-6FGG708C is fully supported by Xilinx ISE Design Suite, providing a comprehensive development environment with:
- Schematic capture and HDL entry (VHDL, Verilog)
- Synthesis and implementation tools
- Timing analysis and simulation capabilities
- In-system debugging with ChipScope Pro
- Extensive IP core library access
Configuration Options
The device supports multiple configuration modes for maximum design flexibility:
- Master Serial Mode
- Slave Serial Mode
- Master Parallel Mode
- Slave Parallel Mode
- Boundary Scan (JTAG) Mode
Why Choose the XC2S200-6FGG708C?
Cost-Effective ASIC Alternative
The XC2S200-6FGG708C eliminates the initial NRE costs, lengthy development cycles, and inherent risks associated with traditional ASIC implementations. Design changes can be implemented quickly without hardware modifications.
Field Upgradability
The unlimited reprogrammability of the XC2S200-6FGG708C allows for post-deployment feature additions, bug fixes, and performance optimizations—capabilities impossible with mask-programmed devices.
Proven Reliability
Built on Xilinx’s mature 0.18 µm CMOS process technology, the Spartan-II family has demonstrated exceptional reliability across millions of deployed units worldwide.
Fastest Speed Grade
The -6 speed grade designation indicates the fastest performance binning available, ensuring maximum operating frequency and minimum propagation delays for timing-critical applications.
XC2S200-6FGG708C Ordering Information
The part number XC2S200-6FGG708C decodes as follows:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (fastest commercial grade)
- FG: Fine-pitch BGA package
- G: Pb-free (lead-free) packaging
- 708: Pin count
- C: Commercial temperature range (0°C to +85°C)
Conclusion
The XC2S200-6FGG708C represents an outstanding choice for engineers requiring high-performance, cost-effective programmable logic in a compact BGA package. With 200,000 system gates, comprehensive I/O flexibility, integrated memory resources, and advanced clock management, this Xilinx Spartan-II FPGA delivers the capabilities needed for today’s demanding digital designs. Contact your authorized distributor today to discuss how the XC2S200-6FGG708C can accelerate your next project.
