Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S300E-6FT256C: High-Performance Spartan-IIE FPGA for Industrial Applications

Product Details

Overview of XC2S300E-6FT256C FPGA

The XC2S300E-6FT256C is a field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-IIE family. This advanced programmable logic device delivers exceptional performance with 300,000 system gates and 6,912 logic cells, making it an ideal choice for cost-sensitive applications requiring robust functionality. As a member of the Spartan-IIE 1.8V FPGA family, this component offers engineers a reliable, flexible solution for digital circuit design and implementation.

Key Technical Specifications

Core Architecture Features

Parameter Specification
Logic Cells 6,912 cells
System Gates 300,000 gates
Block RAM 288 Kbits total
Distributed RAM Up to 221,184 bits
Maximum Frequency 357 MHz
Technology Node 0.15 micron (150nm)
Supply Voltage 1.8V core voltage
Package Type 256-pin FTBGA (Fine-pitch Ball Grid Array)
Temperature Range 0°C to +85°C (Commercial grade)
Speed Grade -6 (Standard performance)

Memory Configuration

The XC2S300E-6FT256C provides flexible memory options:

  • Block RAM: Configurable 4K-bit true dual-port block RAM reaching 288 Kbits total capacity
  • Distributed RAM: 16 bits per Look-Up Table (LUT) architecture
  • Total RAM: 8KB integrated memory for program execution

Advanced FPGA Capabilities

I/O and Interface Features

  • User I/O Pins: 182 configurable user I/O pins
  • I/O Standards: Support for 19 selectable I/O standards
  • DLLs: Four Delay-Locked Loops (DLLs) for precise timing control
  • Total Pins: 256-pin configuration for maximum connectivity

Performance Characteristics

The XC2S300E-6FT256C FPGA excels in applications requiring:

  • Fast, predictable interconnect architecture ensuring timing closure across design iterations
  • High-speed operation up to 357 MHz
  • Efficient resource utilization through hierarchical SelectRAM memory
  • Unlimited in-system reprogrammability for field upgrades

Package and Manufacturing Details

Specification Details
Package Type FTBGA (Fine-pitch Ball Grid Array)
Pin Count 256 pins
Mounting Type Surface Mount Technology (SMT)
RoHS Compliance Yes (Lead-free compliant)
Operating Temp 0°C to +85°C
Storage Temp -55°C to +150°C
Moisture Sensitivity Level 3

Application Areas and Use Cases

Industrial Applications

The XC2S300E-6FT256C serves diverse markets including:

  • Automotive Infotainment Systems: Dashboard displays and entertainment control units
  • Communications Equipment: Network routers, switches, and protocol converters
  • Broadband Access: Fixed-line access equipment and data transmission systems
  • Industrial Automation: Control systems and process monitoring
  • Consumer Electronics: Smart home devices and embedded systems
  • Peripheral Devices: Connected printers and computing accessories

Design Advantages Over ASICs

FPGA Advantage Benefit
No NRE Costs Eliminates initial mask and tooling expenses
Rapid Prototyping Accelerated development cycles compared to ASIC
Field Upgradability Software updates without hardware replacement
Lower Risk No commitment to fixed silicon design
Faster Time-to-Market Immediate implementation upon design completion

Why Choose XC2S300E-6FT256C?

Superior ASIC Alternative

The Spartan-IIE architecture provides a compelling alternative to traditional mask-programmed ASICs. Engineers benefit from FPGA flexibility while avoiding lengthy development cycles, high initial costs, and the inherent risks of conventional ASIC designs.

Proven Xilinx Technology

Built on second-generation ASIC replacement technology, the XC2S300E leverages streamlined features based on the Virtex-E FPGA architecture. This heritage ensures reliability while maintaining cost-effectiveness through advanced 0.15-micron manufacturing processes.

Design Flexibility

The device supports unlimited in-system reprogrammability, enabling:

  • Real-time design modifications during development
  • Field updates and feature enhancements post-deployment
  • Iterative optimization without hardware changes
  • Reduced inventory requirements through programmable configurations

Development and Programming Support

Design Tools Compatibility

The XC2S300E-6FT256C integrates seamlessly with industry-standard development environments:

  • Xilinx ISE Design Suite: Legacy support for Spartan-IIE family
  • Third-party EDA Tools: Compatible with major synthesis and simulation platforms
  • Programming Solutions: JTAG boundary-scan programming interface

Available Resources

Engineers working with this Xilinx FPGA can access:

  • Comprehensive datasheets and reference manuals
  • Application notes and design examples
  • PCB footprint libraries and CAD symbols
  • Technical support from authorized distributors

Ordering Information and Availability

Part Number Breakdown

XC2S300E-6FT256C nomenclature:

  • XC2S = Spartan-IIE family
  • 300E = 300K gates, extended features
  • 6 = Speed grade (-6 standard performance)
  • FT256 = 256-pin Fine-pitch BGA package
  • C = Commercial temperature range (0°C to +85°C)

Package Variants

Part Number Package Temperature Grade
XC2S300E-6FT256C 256-FTBGA Commercial (0°C to +85°C)
XC2S300E-6FT256I 256-FTBGA Industrial (-40°C to +100°C)
XC2S300E-6FTG256C 256-FTBGA (Green) Commercial, RoHS
XC2S300E-7FT256C 256-FTBGA Commercial, Higher Speed

Technical Comparison Table

Spartan-IIE Family Comparison

Device System Gates Logic Cells Block RAM Max I/O
XC2S50E 50,000 1,728 98 Kbits 86
XC2S100E 100,000 2,700 98 Kbits 166
XC2S150E 150,000 3,456 98 Kbits 182
XC2S300E 300,000 6,912 288 Kbits 182
XC2S400E 400,000 10,368 288 Kbits 182
XC2S600E 600,000 15,552 288 Kbits 205

Quality and Reliability

Manufacturing Standards

  • RoHS Compliant: Lead-free manufacturing for environmental compliance
  • Quality Assurance: Rigorous testing protocols ensure reliability
  • Traceability: Full supply chain documentation from authorized sources
  • ESD Protection: Anti-static packaging for component protection

Warranty and Support

Authorized distributors provide:

  • Manufacturer warranty coverage
  • Technical support and design assistance
  • Authentic component verification
  • Responsive customer service

Frequently Asked Questions

Is the XC2S300E-6FT256C recommended for new designs?

While the Spartan-IIE family is considered legacy technology, the XC2S300E-6FT256C remains widely available and suitable for cost-sensitive applications. For new high-performance designs, consider newer Xilinx families like Spartan-7 or Artix-7.

What development tools are required?

The primary development tool is Xilinx ISE Design Suite, which supports synthesis, implementation, and programming for Spartan-IIE devices. Modern alternatives include third-party synthesis tools compatible with legacy architectures.

Can this FPGA be reprogrammed in the field?

Yes, the XC2S300E-6FT256C supports unlimited in-system reprogrammability through JTAG interface, enabling field updates without hardware modifications.

What is the difference between FT256C and FTG256C packages?

The “G” designation indicates green/RoHS-compliant manufacturing with lead-free materials, while both use the same 256-pin FTBGA physical package.

Conclusion

The XC2S300E-6FT256C represents proven FPGA technology delivering reliable performance for embedded systems and industrial applications. With 300,000 system gates, 6,912 logic cells, and comprehensive I/O capabilities in a compact 256-pin FTBGA package, this Spartan-IIE device offers excellent value for cost-constrained projects requiring programmable logic solutions.

Whether replacing legacy designs or implementing new cost-effective systems, the XC2S300E-6FT256C provides the flexibility, reliability, and performance needed for successful product development. Its RoHS compliance, extensive development tool support, and proven track record make it a solid choice for engineers worldwide.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.