Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG704C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

The XC2S200-6FGG704C is a powerful field-programmable gate array from the Xilinx Spartan-II family, delivering exceptional performance with 200,000 system gates and 5,292 logic cells. This cost-effective FPGA solution combines advanced 0.18-micron CMOS technology with comprehensive I/O capabilities, making it ideal for high-volume applications requiring reliable programmable logic.


Key Features of XC2S200-6FGG704C FPGA

High-Density Logic Architecture

The XC2S200-6FGG704C provides engineers with substantial logic resources for complex digital designs:

  • 200,000 System Gates for comprehensive logic implementation
  • 5,292 Logic Cells organized in 1,176 Configurable Logic Blocks (CLBs)
  • 28 × 42 CLB Array configuration for flexible design mapping
  • 284 Maximum User I/O Pins supporting diverse interface requirements

Advanced Memory Resources

This Spartan-II FPGA integrates hierarchical SelectRAM memory architecture:

  • 56 Kbits Block RAM configured as dual-port 4,096-bit memory blocks
  • 75,264 bits Distributed RAM utilizing 16 bits per Look-Up Table
  • Flexible Memory Configuration supporting various width and depth combinations
  • Fast External RAM Interfaces for system-level memory expansion

Superior Speed Performance

The -6 speed grade designation indicates this device operates at the higher performance tier within the Spartan-II family:

  • Up to 263 MHz System Clock Support
  • Low-Power Segmented Routing Architecture
  • Dedicated Carry Logic for high-speed arithmetic operations
  • Four Delay-Locked Loops (DLLs) for advanced clock management

XC2S200-6FGG704C Technical Specifications

Electrical Characteristics

Parameter Specification
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V / 2.5V / 3.3V
Process Technology 0.18 µm CMOS
Operating Temperature 0°C to +85°C (Commercial)
Package Type 704-Pin Fine Pitch BGA (Pb-Free)

Logic Resources Summary

Resource Quantity
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Flip-Flops 5,292
Maximum User I/O 284

Memory Specifications

Memory Type Capacity
Block RAM 56 Kbits
Block RAM Blocks 14
Distributed RAM 75,264 bits
Configuration Memory 1,335,840 bits

I/O Standards and Interface Support

The XC2S200-6FGG704C supports 16 high-performance interface standards, enabling seamless integration with various system components:

Supported I/O Standards

  • LVTTL (2-24 mA drive strength)
  • LVCMOS 2.5V
  • PCI 3.3V/5V (33 MHz and 66 MHz compliant)
  • GTL and GTL+
  • HSTL Class I, III, IV
  • SSTL2 and SSTL3 Class I/II
  • CTT
  • AGP-2X

I/O Banking Architecture

The FPGA features an 8-bank I/O structure allowing independent VCCO and VREF voltage configurations per bank, providing maximum flexibility for mixed-voltage system designs.


Clock Management and Distribution

Delay-Locked Loop (DLL) Features

The XC2S200-6FGG704C includes four dedicated DLL circuits offering:

  • Zero Propagation Delay clock distribution
  • Clock Multiplication (2× frequency doubling)
  • Clock Division (÷1.5, ÷2, ÷2.5, ÷3, ÷4, ÷5, ÷8, ÷16)
  • Quadrature Phase Generation (0°, 90°, 180°, 270°)
  • Board-Level Clock Deskew capability

Global Clock Network

  • Four Primary Global Clock Nets with minimal skew
  • Dedicated Clock Input Pins for each global buffer
  • Secondary Backbone Routing with 24 distribution lines

Configuration Options for XC2S200-6FGG704C

Supported Configuration Modes

Mode Data Width CCLK Direction
Master Serial 1-bit Output
Slave Serial 1-bit Input
Slave Parallel 8-bit Input
Boundary-Scan (JTAG) 1-bit N/A

Configuration Features

  • IEEE 1149.1 Boundary-Scan compliance
  • In-System Programmability with unlimited reprogramming cycles
  • Configuration Readback for verification
  • CRC Error Detection during configuration

Applications for Spartan-II XC2S200-6FGG704C

This versatile Xilinx FPGA excels in numerous application domains:

Industrial and Commercial Applications

  • Telecommunications Equipment – Protocol processing and interface bridging
  • Networking Hardware – Packet processing and switching fabric
  • Consumer Electronics – Display controllers and media processing
  • Industrial Automation – Motor control and sensor interfaces
  • Medical Devices – Signal processing and data acquisition

Design Advantages

  • ASIC Replacement – Eliminates NRE costs and lengthy development cycles
  • Field Upgradability – Design modifications without hardware changes
  • Rapid Prototyping – Accelerated product development timelines
  • Risk Mitigation – Flexibility to address late-stage design changes

Package Information: 704-Pin FBGA

Physical Specifications

  • Package Style: Fine Pitch Ball Grid Array (FBGA)
  • Pin Count: 704 pins
  • Lead-Free (Pb-Free): RoHS compliant packaging
  • Mounting Type: Surface Mount Technology (SMT)

Pin Categories

  • User I/O Pins: Up to 284 configurable I/O
  • Global Clock Inputs: 4 dedicated clock pins
  • Configuration Pins: Mode, CCLK, PROGRAM, DONE, INIT
  • JTAG Pins: TDI, TDO, TMS, TCK
  • Power/Ground: Multiple VCCINT, VCCO, and GND connections

Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG704C is fully supported by the Xilinx ISE development environment, providing:

  • Automatic Mapping, Placement, and Routing
  • Timing-Driven Implementation algorithms
  • Static Timing Analysis tools
  • In-Circuit Debugging capabilities
  • EDIF Netlist Support for third-party synthesis tools

Design Resources

  • Over 400 Library Primitives and Macros
  • HDL Synthesis Tool Integration
  • Simulation Model Support
  • Comprehensive Documentation and Application Notes

Ordering Information

Part Number Breakdown: XC2S200-6FGG704C

Code Element Meaning
XC2S200 Spartan-II 200K gate device
-6 Higher performance speed grade
FG Fine Pitch BGA package
G Pb-free (lead-free) option
704 704-pin package
C Commercial temperature range (0°C to +85°C)

Why Choose XC2S200-6FGG704C for Your Design?

Cost-Effective Performance

The Spartan-II architecture delivers exceptional value for high-volume production, combining adequate logic density with proven reliability at competitive price points.

Design Flexibility

With extensive I/O options, configurable memory resources, and comprehensive clock management, the XC2S200-6FGG704C adapts to diverse design requirements without hardware modifications.

Long-Term Availability

As part of the established Spartan-II product family, this FPGA offers stable supply chain support for designs requiring extended production lifecycles.


Summary

The XC2S200-6FGG704C represents an optimal choice for engineers seeking a balance between performance, features, and cost in programmable logic solutions. With 200,000 system gates, robust memory resources, advanced clock management, and comprehensive I/O support, this Spartan-II FPGA delivers the capabilities needed for successful digital system implementation across industrial, commercial, and consumer applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.