Overview of XC2S300E-7FGG456C FPGA
The XC2S300E-7FGG456C represents a powerful solution in the Xilinx FPGA Spartan-IIE family, designed to deliver exceptional performance for embedded systems and digital signal processing applications. This field-programmable gate array combines 300,000 system gates with advanced 0.15-micron technology, offering engineers a cost-effective platform for complex logic implementations.
Key Features and Specifications
The XC2S300E-7FGG456C incorporates several advanced features that make it ideal for demanding applications:
- Logic Capacity: 6,912 configurable logic cells providing extensive design flexibility
- System Gates: 300,000 gates for complex digital circuit implementation
- Operating Voltage: 1.8V low-power design
- Maximum Frequency: 400MHz for high-speed data processing
- Package Type: 456-pin Fine-Pitch Ball Grid Array (FBGA)
- Speed Grade: -7 (commercial temperature range: 0°C to 85°C)
- Manufacturing Process: 0.15μm CMOS technology
Technical Specifications Table
| Specification |
Details |
| Part Number |
XC2S300E-7FGG456C |
| Manufacturer |
Xilinx (now AMD Xilinx) |
| Product Family |
Spartan-IIE 1.8V FPGA |
| Logic Cells |
6,912 cells |
| System Gates |
93,000 to 300,000 |
| CLB Array |
32 x 48 |
| Distributed RAM |
98,304 bits |
| Block RAM |
64K bits (1,536 bits total available) |
| Maximum User I/O |
329 pins |
| DLLs |
4 Delay-Locked Loops |
| Package |
456-pin FBGA |
| Operating Temperature |
0°C to 85°C (commercial) |
| Core Voltage |
1.8V |
Memory and I/O Capabilities
Memory Resources
The XC2S300E-7FGG456C provides versatile memory options for various application requirements:
| Memory Type |
Capacity |
Application |
| Block RAM |
64K bits (8KB) |
Data buffering, FIFO implementations |
| Distributed RAM |
98,304 bits |
Small memory structures, lookup tables |
| Total RAM |
1,536 bits maximum per CLB |
Flexible memory allocation |
Input/Output Features
With support for 19 selectable I/O standards, this FPGA offers exceptional connectivity options. The 329 available user I/O pins (including four global clock/user input pins) enable interfacing with diverse external devices and communication protocols.
Performance Characteristics
Speed and Timing
Operating at a maximum frequency of 400MHz, the XC2S300E-7FGG456C delivers outstanding performance for time-critical applications. The -7 speed grade indicates optimized timing characteristics suitable for high-speed digital signal processing, communications systems, and real-time control applications.
Power Efficiency
The 1.8V core voltage represents a significant advancement in power efficiency compared to previous FPGA generations, making this device ideal for portable and power-sensitive applications while maintaining high performance levels.
Application Areas
The XC2S300E-7FGG456C excels in numerous industrial and commercial applications:
Industrial Control Systems
- Factory automation controllers
- Process monitoring equipment
- Robotics control systems
- Industrial communication interfaces
Communications Equipment
- Network routers and switches
- Protocol converters
- Telecommunications infrastructure
- Wireless base station components
Digital Signal Processing
- Real-time signal filtering
- Audio/video processing
- Image recognition systems
- Software-defined radio implementations
Consumer Electronics
- Set-top boxes
- Gaming systems
- Display controllers
- Multimedia processing units
Medical Equipment
- Diagnostic imaging systems
- Patient monitoring devices
- Laboratory instrumentation
- Medical data processing
Design Features and Architecture
Configurable Logic Blocks (CLBs)
The device features a regular, flexible architecture based on configurable logic blocks surrounded by programmable Input/Output Blocks (IOBs). This structure provides designers with maximum flexibility for implementing custom logic functions.
Delay-Locked Loops (DLLs)
Four DLLs positioned at each corner of the die enable precise clock distribution and management, essential for maintaining timing integrity in high-speed designs.
Programmable Interconnect
Fast, predictable interconnect architecture ensures that successive design iterations continue to meet timing requirements, reducing development time and improving design reliability.
Package Information
| Package Details |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
456 pins |
| Package Marking |
XC2S300E-7FGG456C |
| RoHS Compliance |
Available in both standard and Pb-free versions |
| Body Dimensions |
23mm x 23mm (nominal) |
| Ball Pitch |
1.0mm |
Development and Programming
Supported Design Tools
Engineers can develop designs for the XC2S300E-7FGG456C using industry-standard Xilinx development tools:
- ISE Design Suite: Traditional design environment for Spartan-IIE devices
- Programming Software: iMPACT for device configuration
- Simulation Tools: ModelSim, ISim for design verification
- IP Cores: Extensive library of pre-verified IP blocks
Configuration Options
The device supports multiple configuration modes including:
- Master Serial mode
- Slave Serial mode
- SelectMAP mode
- JTAG programming
Comparison with Alternative Devices
| Feature |
XC2S300E-7FGG456C |
XC2S400E |
XC2S600E |
| Logic Cells |
6,912 |
10,800 |
15,552 |
| System Gates |
300,000 |
400,000 |
600,000 |
| CLB Array |
32 x 48 |
40 x 60 |
48 x 72 |
| User I/O |
329 |
410 |
514 |
| Block RAM |
64K |
160K |
288K |
| Distributed RAM |
98,304 bits |
153,600 bits |
221,184 bits |
Design Advantages
FPGA vs ASIC Benefits
The XC2S300E-7FGG456C offers several advantages over traditional ASIC solutions:
- Lower Initial Costs: No mask costs or NRE expenses
- Faster Time-to-Market: Rapid prototyping and implementation
- Design Flexibility: Reconfigurable logic for design iterations
- Field Upgradability: In-system reprogramming capability
- Reduced Risk: Design changes without hardware replacement
Reliability Features
Built on proven 0.15-micron technology, this FPGA delivers enterprise-grade reliability with extensive quality testing and validation procedures.
Ordering and Availability
Product Status
Important Note: The XC2S300E-7FGG456C is classified as “NOT RECOMMENDED for NEW DESIGN” by the manufacturer. While existing inventory remains available through authorized distributors, engineers developing new products should consider current-generation FPGA families such as Spartan-6, Spartan-7, or newer Artix devices.
Package Variants
The XC2S300E series is available in multiple package options:
- FGG456: 456-pin Fine-Pitch BGA (this variant)
- PQ208: 208-pin Plastic Quad Flat Pack
- FT256: 256-pin Fine-Pitch BGA
Frequently Asked Questions
What is the maximum operating frequency of the XC2S300E-7FGG456C?
The device operates at a maximum frequency of 400MHz, making it suitable for high-speed digital processing applications including communications and signal processing.
Can this FPGA be used in automotive applications?
The commercial temperature grade (-7) operates from 0°C to 85°C. For automotive applications requiring extended temperature ranges, consider industrial-grade variants or consult newer automotive-qualified FPGA families.
What development tools are required?
Xilinx ISE Design Suite is the primary development environment. While Vivado Design Suite supports newer devices, ISE remains the recommended toolchain for Spartan-IIE development.
How does the XC2S300E compare to modern FPGAs?
While the XC2S300E offers proven performance, modern alternatives like Spartan-7 and Artix-7 families provide significantly higher logic density, lower power consumption, advanced DSP blocks, and enhanced I/O capabilities.
Technical Support and Resources
Documentation
- Official datasheet DS077 available from AMD Xilinx
- Application notes covering design best practices
- Reference designs for common applications
- Programming guides and configuration procedures
Alternative Recommendations
For new designs, consider these modern equivalents:
- Spartan-7 Series: Direct upgrade path with compatible tools
- Artix-7 Series: Enhanced performance and power efficiency
- Zynq-7000: SoC solutions combining FPGA fabric with ARM processors
Conclusion
The XC2S300E-7FGG456C delivers reliable FPGA performance for embedded systems, communications, and digital signal processing applications. With 300,000 system gates, 6,912 logic cells, and 400MHz operation, this device provides robust capabilities for diverse industrial applications. While designated as not recommended for new designs, substantial inventory remains available for legacy system maintenance and existing product support.
Engineers seeking modern alternatives should explore current Xilinx FPGA families that offer enhanced performance, lower power consumption, and advanced features while maintaining compatibility with established development workflows.
