Overview of the XC2S400E-6FTG256I FPGA
The XC2S400E-6FTG256I is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s Spartan-IIE family, designed to deliver exceptional performance for embedded systems, digital signal processing, and industrial automation applications. This industrial-grade FPGA features 400,000 gates, 10,800 cells, and operates at speeds up to 357 MHz, making it an ideal choice for demanding real-time applications.
As part of the renowned Xilinx FPGA product line, the XC2S400E-6FTG256I combines reliability with advanced programmability, supporting unlimited reprogramming cycles for flexible design iterations.
Key Technical Specifications
Core Features Table
| Parameter |
Specification |
| Part Number |
XC2S400E-6FTG256I |
| Manufacturer |
AMD Xilinx |
| Product Family |
Spartan-IIE |
| Logic Gates |
400,000 Gates |
| Logic Cells |
10,800 Cells |
| Maximum Frequency |
357 MHz |
| Technology Node |
0.15µm (150nm) CMOS |
| Core Voltage |
1.8V |
| Package Type |
256-Pin FTBGA (Fine-Pitch BGA) |
| Total I/O Pins |
182 User I/O |
| Operating Temperature |
-40°C to +100°C (Industrial) |
Memory and Configuration
| Memory Feature |
Details |
| Block RAM |
20 KB embedded memory |
| RAM Columns |
4 block RAM columns |
| Configuration |
Unlimited reprogramming cycles |
| Configuration Modes |
Master Serial, Slave Serial, Slave Parallel, Boundary Scan |
| Dual-Port RAM |
Yes, available in block RAM |
Architecture and Design Features
Configurable Logic Blocks (CLBs)
The XC2S400E-6FTG256I features an advanced CLB architecture that provides:
- High-density logic implementation with 10,800 configurable cells
- Four logic slices per CLB, each containing multiple Look-Up Tables (LUTs)
- Fast carry logic for efficient arithmetic operations
- Embedded multiplexers for flexible data routing
- Register-rich design with D-type flip-flops and level-sensitive latches
Advanced I/O Capabilities
| I/O Feature |
Specification |
| Total User I/O |
182 pins |
| I/O Standards |
LVTTL, LVCMOS, PCI 33/66, GTL+, SSTL, HSTL |
| Differential I/O |
Supported for high-speed interfaces |
| Hot-Swap Support |
Yes, with controlled voltage ramping |
| ESD Protection |
Built-in protection on all pins |
Clock Management System
The XC2S400E-6FTG256I incorporates sophisticated clock management features:
- Delay-Locked Loop (DLL) technology for precise clock control
- Four primary global clock buffers for low-skew distribution
- Clock mirroring capability for synchronized off-chip communication
- VersaRing routing for enhanced pin-swapping flexibility
Performance Characteristics
Speed Grade and Timing
| Performance Metric |
Value |
| Speed Grade |
-6 (Commercial/Industrial) |
| Maximum System Frequency |
357 MHz |
| Logic Delay |
Optimized for speed-critical paths |
| Clock-to-Output |
Fast propagation delays |
| Setup/Hold Times |
Industry-leading specifications |
Power Consumption Profile
The XC2S400E-6FTG256I is engineered for efficient power management:
- Low static power consumption through advanced 0.15µm CMOS process
- Dynamic power scaling based on logic utilization
- 1.8V core voltage for reduced power requirements
- Multiple I/O voltage banks supporting 1.5V to 3.3V standards
Application Use Cases
Industrial Automation and Control
The XC2S400E-6FTG256I excels in industrial environments with:
- Motor control systems requiring real-time feedback processing
- PLC replacement for flexible manufacturing systems
- Industrial protocol converters (Modbus, Profibus, EtherCAT)
- Sensor fusion applications with multiple input channels
Digital Signal Processing
Ideal DSP applications include:
- Image and video processing pipelines
- Audio processing and filtering systems
- Radar and sonar signal processing
- Software-defined radio (SDR) implementations
Communication Systems
Perfect for communication infrastructure:
- Protocol bridging between different standards
- Data encryption/decryption engines
- Network packet processing
- Telecommunications equipment interfaces
Medical and Healthcare
Suitable for medical device applications:
- Patient monitoring systems
- Medical imaging equipment processing
- Diagnostic instrument controllers
- Portable medical device interfaces
Package and Pin Configuration
256-Pin FTBGA Package Details
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FTBGA) |
| Pin Count |
256 pins total |
| Package Size |
17mm × 17mm nominal |
| Ball Pitch |
1.0mm center-to-center |
| RoHS Compliance |
Yes, Lead-Free |
| Moisture Sensitivity |
MSL 3 (Moisture Sensitivity Level 3) |
The FTBGA package provides excellent thermal performance and signal integrity for high-speed applications, with dedicated power and ground pins strategically distributed throughout the package.
Design and Development Tools
Xilinx ISE Design Suite Compatibility
The XC2S400E-6FTG256I is fully supported by:
- ISE Design Suite for FPGA implementation
- Hardware Description Languages: VHDL and Verilog
- Timing analysis tools for meeting performance requirements
- ChipScope Pro for in-system debugging
- iMPACT for device programming
Configuration and Programming
| Programming Feature |
Details |
| Configuration Memory |
External PROM or direct programming |
| Programming Interface |
JTAG Boundary Scan (IEEE 1149.1) |
| Configuration Time |
Fast configuration in milliseconds |
| Bitstream Encryption |
Optional security features |
| Partial Reconfiguration |
Not supported in Spartan-IIE |
Ordering and Product Variants
Part Number Breakdown
XC2S400E-6FTG256I decodes as follows:
- XC2S = Spartan-II family designation
- 400E = 400K gate Extended family (Spartan-IIE)
- -6 = Speed grade (industrial temperature range)
- FTG256 = 256-pin Fine-pitch BGA package
- I = Industrial temperature grade (-40°C to +100°C)
Related Part Numbers
| Part Number |
Key Difference |
| XC2S400E-6FT256C |
Commercial temperature (0°C to +85°C) |
| XC2S400E-7FTG256I |
Faster -7 speed grade, industrial temp |
| XC2S400E-6FG456I |
Larger 456-pin package with more I/O |
| XC2S400E-6FG676I |
Premium 676-pin package for maximum I/O |
Quality and Reliability
Environmental and Quality Standards
The XC2S400E-6FTG256I meets stringent quality requirements:
- Industrial temperature rating: -40°C to +100°C ambient
- RoHS compliant: Lead-free construction
- ESD protection: Human Body Model (HBM) rated
- Latch-up immunity: CMOS latch-up resistant design
- Long-term reliability: Designed for extended operational life
Testing and Validation
Each device undergoes comprehensive testing:
- Functional testing at wafer and package level
- Boundary scan testing via JTAG interface
- Thermal cycling verification
- Burn-in testing for high-reliability applications
Competitive Advantages
Why Choose XC2S400E-6FTG256I?
- Proven reliability with decades of field deployment history
- Cost-effective solution for high-volume production
- Comprehensive tool support with mature design ecosystem
- Flexible I/O standards supporting legacy and modern interfaces
- Industrial-grade temperature range for harsh environments
- Unlimited reprogrammability for design iterations
Comparison with Modern FPGAs
| Feature |
XC2S400E-6FTG256I |
Modern FPGAs |
| Technology |
Proven 0.15µm |
Advanced 7nm-28nm nodes |
| Power Efficiency |
Good for era |
Superior efficiency |
| Cost |
Very competitive |
Higher pricing |
| Tool Maturity |
Extremely mature |
Still evolving |
| Long-term Availability |
Established supply |
May vary |
| Design Migration |
Well-documented |
Vendor-dependent |
Technical Support and Resources
Documentation Available
- Complete datasheet with electrical specifications
- Application notes for common design patterns
- Reference designs for quick-start development
- Errata documentation listing known issues and workarounds
- Package thermal models for thermal simulation
Design Considerations
When implementing designs with the XC2S400E-6FTG256I:
- Power supply sequencing: Follow recommended power-up sequence
- Decoupling capacitors: Place close to power pins as per guidelines
- Clock distribution: Use global buffers for low-skew clocking
- I/O banking: Group I/O by voltage standards
- Thermal management: Ensure adequate airflow for sustained operation
Conclusion
The XC2S400E-6FTG256I represents a mature, reliable FPGA solution ideal for industrial, embedded, and signal processing applications requiring proven performance. With 400,000 gates, industrial temperature ratings, and comprehensive design tool support, this Spartan-IIE family member continues to serve in mission-critical applications worldwide.
For organizations seeking cost-effective programmable logic solutions with extensive legacy support and proven reliability, the XC2S400E-6FTG256I offers an excellent balance of performance, features, and value. Whether you’re designing industrial controllers, communication interfaces, or custom signal processing systems, this FPGA provides the flexibility and capability needed for successful implementation.
To learn more about AMD Xilinx FPGA solutions and access design resources, visit the official Xilinx FPGA product page for comprehensive technical documentation and support.
