The XC2S200-6FGG697C is a powerful Field-Programmable Gate Array (FPGA) from the renowned Xilinx FPGA Spartan-II family. This advanced programmable logic device delivers exceptional performance for demanding digital design applications, combining high gate density with cost-effective implementation for industrial and commercial projects.

Key Features of the XC2S200-6FGG697C FPGA

The XC2S200-6FGG697C incorporates Xilinx’s proven second-generation ASIC replacement technology. This FPGA provides designers with unlimited reprogrammability, eliminating the initial costs and lengthy development cycles associated with conventional mask-programmed ASICs. Field upgrades become possible without hardware replacement, offering unmatched flexibility for product evolution.

Technical Specifications Overview

Architecture and Design Resources

The XC2S200-6FGG697C features a sophisticated architecture derived from the Virtex FPGA platform, optimized for high-volume, cost-sensitive applications.

Configurable Logic Blocks (CLBs)

The device contains 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB provides versatile logic implementation capabilities, supporting complex combinatorial and sequential designs. The abundant register and latch resources include enable, set, and reset functionality for maximum design flexibility.

Memory Architecture

SelectRAM Hierarchical Memory System

The XC2S200-6FGG697C implements Xilinx’s SelectRAM technology, offering two complementary memory solutions:

Distributed RAM: With 75,264 bits of distributed RAM, designers can implement small, fast memory blocks directly within the logic fabric. Each lookup table (LUT) provides 16 bits of RAM, enabling efficient implementation of FIFOs, register files, and small buffers.

Block RAM: The device includes 14 dedicated 4K-bit block RAM modules totaling 56K bits. These fully synchronous dual-ported memories feature independent control signals for each port, supporting simultaneous read and write operations with configurable data widths.

Clock Management with Four Delay-Locked Loops

Four dedicated Delay-Locked Loops (DLLs), positioned at each corner of the die, provide advanced clock control capabilities. The DLLs enable clock deskewing, frequency synthesis, and phase shifting, ensuring precise timing across the entire device. Clock mirroring functionality allows board-level clock synchronization among multiple Spartan-II devices.

Speed Grade -6 Performance Advantages

The -6 speed grade designation indicates the highest performance tier within the Spartan-II family. This premium speed grade delivers faster signal propagation delays and enhanced timing margins compared to -5 grade alternatives. The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C), making it ideal for performance-critical applications.

Timing Performance Highlights

The XC2S200-6FGG697C achieves superior switching characteristics through optimized routing architecture. The dedicated carry logic enables high-speed arithmetic operations, while efficient multiplier support accelerates DSP implementations. The cascade chain facilitates wide-input function implementation with minimal propagation delay.

FGG697 Package Specifications

The Fine-Pitch Ball Grid Array (FGG697) package provides optimal board-level integration for high-density designs.

Package Characteristics

The 697-ball configuration offers maximum I/O availability while maintaining excellent thermal performance and signal integrity. The Pb-free “G” designation indicates RoHS-compliant lead-free packaging, supporting environmentally responsible manufacturing practices.

Pinout and I/O Capabilities

The XC2S200-6FGG697C supports up to 284 user I/O pins, excluding four dedicated global clock input pins. The device accommodates 16 high-performance interface standards, ensuring compatibility with diverse system requirements.

I/O Standards and Interface Support

Supported I/O Voltages

The flexible I/O architecture accepts multiple voltage levels:

• VCCO options: 1.5V, 2.5V, and 3.3V
• VCCINT (core): 2.5V nominal (2.375V to 2.625V range)

Interface Compatibility

The XC2S200-6FGG697C provides native support for industry-standard interfaces including LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, SSTL, CTT, and AGP. Hot-swap Compact PCI-friendly design enables safe insertion and removal in live systems.

Design Development and Configuration

ISE Design Suite Support

The XC2S200-6FGG697C receives full support from Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Automatic mapping, placement, and routing tools streamline the development workflow, accelerating time-to-market.

Configuration Options

Multiple configuration modes accommodate various system architectures:

• Master/Slave Serial modes
• Master/Slave SelectMAP (parallel) modes
• Boundary Scan (JTAG) configuration
• Full readback capability for design verification

The device supports configuration from external PROMs, flash memory, microprocessors, or network interfaces. Zero hold time simplifies system timing requirements during configuration.

JTAG Boundary Scan Compliance

IEEE 1149.1 compatible boundary scan logic enables comprehensive board-level testing and debugging. The boundary scan architecture supports standard EXTEST, INTEST, and BYPASS instructions, facilitating automated test equipment integration.

Target Applications

The XC2S200-6FGG697C excels in numerous application domains:

Telecommunications Infrastructure

Network equipment, routers, switches, and base station controllers benefit from the device’s high I/O count and flexible logic resources. Protocol bridging and packet processing implementations leverage the abundant block RAM for buffering.

Industrial Automation and Control

Motor drives, PLCs, and process control systems utilize the FPGA’s real-time processing capabilities. The -6 speed grade ensures deterministic timing for safety-critical control loops.

Consumer Electronics

Video processing, display controllers, and audio equipment implementations benefit from the cost-effective architecture. The Spartan-II platform balances performance with competitive pricing for volume applications.

Embedded Systems and Computing

Custom peripheral interfaces, memory controllers, and co-processor designs leverage the FPGA’s flexibility. Fast interfaces to external RAM enable high-bandwidth data movement.

Automotive Electronics

Infotainment systems, body electronics, and driver assistance applications utilize the device’s robust architecture. The commercial temperature range supports typical automotive cabin environments.

Ordering Information

Part Number Breakdown

XC2S200-6FGG697C

• XC2S200: Device type (Spartan-II, 200K gates)
• -6: Speed grade (highest performance)
• FG: Fine-pitch BGA package base
• G: Pb-free (lead-free) designation
• 697: Pin count
• C: Commercial temperature range (0°C to +85°C)

Quality and Compliance

The XC2S200-6FGG697C meets stringent quality standards for commercial applications. RoHS compliance ensures environmental responsibility, while comprehensive documentation supports design verification requirements.

Why Choose the XC2S200-6FGG697C?

The XC2S200-6FGG697C delivers compelling value for digital design projects requiring:

• High Logic Density: 200,000 system gates with 5,292 logic cells
• Maximum Performance: -6 speed grade for timing-critical applications
• Flexible Memory: Combined distributed and block RAM architecture
• Extensive I/O: Up to 284 user I/O with multi-voltage support
• Advanced Clocking: Four DLLs for precise clock management
• Design Flexibility: Unlimited reprogrammability with field upgrade capability
• Cost Effectiveness: Superior alternative to mask-programmed ASICs

The XC2S200-6FGG697C represents an ideal solution for engineers seeking a reliable, high-performance FPGA platform backed by comprehensive development tools and extensive documentation.