The XC2S200-6FGG693C is a powerful field-programmable gate array from the renowned Xilinx FPGA Spartan-II family. This advanced programmable logic device delivers exceptional performance for demanding digital design applications, combining 200,000 system gates with industry-leading speed and reliability in a compact 693-ball Fine-Pitch BGA package.
XC2S200-6FGG693C Key Features and Specifications
The XC2S200-6FGG693C FPGA offers engineers a comprehensive solution for complex programmable logic requirements. This device features robust architecture designed for high-speed digital signal processing, telecommunications equipment, industrial automation systems, and embedded computing applications.
Core Architecture Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Package Type |
FGG693 (Fine-Pitch BGA) |
| Ball Count |
693 |
| Speed Grade |
-6 (Fastest) |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm |
Memory Resources and Capabilities
The XC2S200-6FGG693C integrates substantial on-chip memory resources that eliminate the need for external RAM in many applications:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks) |
| Block RAM Configuration |
Dual-port 4,096-bit cells |
Each block RAM cell operates as a fully synchronous dual-ported memory with independent control signals for each port. Engineers can configure data widths independently, supporting aspect ratios from 1-bit x 4096 deep to 16-bit x 256 deep.
XC2S200-6FGG693C Technical Performance
Speed Grade -6 Advantages
The -6 speed designation indicates the fastest performance tier available for the Spartan-II family. This speed grade delivers optimal signal propagation delays and supports system performance up to 200 MHz, making the XC2S200-6FGG693C ideal for timing-critical applications requiring maximum throughput.
Clock Management with Delay-Locked Loops
The XC2S200-6FGG693C incorporates four dedicated Delay-Locked Loops (DLLs), positioned at each corner of the die. These DLLs provide:
- Advanced clock control and distribution
- Clock deskewing across board-level designs
- Zero-delay clock buffering
- Clock multiplication and division capabilities
- Four primary low-skew global clock distribution networks
I/O Standards and Interface Compatibility
Supported I/O Standards
The XC2S200-6FGG693C supports 16 high-performance interface standards, enabling seamless integration with diverse system components:
| Standard |
Description |
5V Tolerant |
| LVTTL |
Low-Voltage TTL |
Yes |
| LVCMOS2 |
Low-Voltage CMOS (2.5V) |
Yes |
| LVCMOS33 |
Low-Voltage CMOS (3.3V) |
No |
| PCI33_3 |
33 MHz PCI (3.3V) |
No |
| PCI33_5 |
33 MHz PCI (5V) |
Yes |
| PCI66_3 |
66 MHz PCI (3.3V) |
No |
| GTL |
Gunning Transceiver Logic |
– |
| GTL+ |
Gunning Transceiver Logic Plus |
– |
| HSTL I |
High-Speed Transceiver Logic Class I |
No |
| HSTL III |
High-Speed Transceiver Logic Class III |
No |
| HSTL IV |
High-Speed Transceiver Logic Class IV |
No |
| SSTL2 I |
Stub-Series Terminated Logic Class I |
No |
| SSTL2 II |
Stub-Series Terminated Logic Class II |
No |
| SSTL3 I |
Stub-Series Terminated Logic Class I |
No |
| SSTL3 II |
Stub-Series Terminated Logic Class II |
No |
| AGP-2X |
Accelerated Graphics Port 2X |
No |
Voltage Specifications
- Core Logic: 2.5V (VCCINT)
- I/O Banks: Configurable at 1.5V, 2.5V, or 3.3V (VCCO)
- Four independent I/O banks for flexible voltage mixing
XC2S200-6FGG693C Package Information
FGG693 Fine-Pitch BGA Package Details
The FGG693 package provides maximum I/O connectivity while maintaining excellent thermal performance and signal integrity. The “G” designation indicates Pb-free (lead-free) packaging, ensuring RoHS compliance for environmentally conscious manufacturing.
| Package Parameter |
Value |
| Package Style |
Fine-Pitch Ball Grid Array |
| Total Balls |
693 |
| Ball Pitch |
1.0mm |
| RoHS Compliant |
Yes (Pb-free) |
Temperature Range
| Version |
Temperature Range |
| Commercial (C) |
0°C to +85°C |
Note: The -6 speed grade is exclusively available in the Commercial temperature range.
Configurable Logic Block Architecture
CLB Structure and Functionality
Each Configurable Logic Block in the XC2S200-6FGG693C contains four Logic Cells (LCs) organized in two slices. The CLB architecture provides:
- 4-input Look-Up Tables (LUTs) functioning as function generators
- Storage elements (flip-flops or latches) with clock enable
- Dedicated carry logic for high-speed arithmetic operations
- F5 multiplexers for 5-input function implementation
- Cascade chains for wide-input functions
- Two 3-state drivers (BUFTs) per CLB for on-chip bus implementation
SelectRAM Distributed Memory
The distributed RAM capability allows each LUT to function as a 16 x 1-bit synchronous RAM, providing 75,264 bits of fast, flexible memory distributed throughout the device.
XC2S200-6FGG693C Applications
The XC2S200-6FGG693C FPGA excels in numerous industrial and commercial applications:
Industrial Applications
- Industrial automation and control systems
- Motor drive controllers
- Process control equipment
- Factory automation systems
- Programmable logic controllers
Telecommunications
- Network interface cards
- Protocol converters
- Data encryption/decryption
- Base station equipment
- VoIP processing
Consumer Electronics
- Digital video processing
- Audio signal processing
- Display controllers
- Gaming systems
Automotive Systems
- Advanced driver assistance systems
- Infotainment systems
- Vehicle networking
- Sensor fusion processing
Medical Equipment
- Medical imaging systems
- Patient monitoring devices
- Diagnostic equipment
- Laboratory instrumentation
Development Tools and Software Support
Xilinx ISE Design Suite
The XC2S200-6FGG693C is fully supported by Xilinx ISE Design Suite, providing comprehensive design capabilities:
- Schematic capture and HDL design entry
- VHDL and Verilog synthesis
- Automatic placement and routing
- Timing analysis and optimization
- In-system debugging with ChipScope
- Bitstream generation and configuration
IEEE 1149.1 Boundary Scan
The device includes IEEE 1149.1 compliant boundary scan logic for:
- In-system programming via JTAG interface
- Board-level testing and verification
- Full readback capability for design verification
Configuration Options
The XC2S200-6FGG693C supports multiple configuration modes:
- Serial configuration using Xilinx Platform Flash PROMs
- Parallel configuration for faster programming
- JTAG configuration for development and debugging
- Daisy-chain configuration for multi-FPGA systems
Why Choose XC2S200-6FGG693C
Cost-Effective ASIC Alternative
The XC2S200-6FGG693C provides a superior alternative to mask-programmed ASICs. Engineers benefit from:
- Elimination of NRE (Non-Recurring Engineering) costs
- Shortened development cycles
- Reduced design risk through field programmability
- In-field upgrade capability without hardware replacement
- Rapid prototyping and design iteration
Proven Reliability
Built on mature 0.18µm process technology, the XC2S200-6FGG693C delivers consistent, reliable performance backed by extensive qualification testing and field-proven operation in demanding applications worldwide.
Ordering Information
Part Number Breakdown
XC2S200-6FGG693C
| Code |
Meaning |
| XC2S200 |
Spartan-II 200K device |
| -6 |
Speed grade (fastest) |
| FG |
Fine-pitch BGA base package |
| G |
Pb-free (RoHS compliant) |
| 693 |
693-ball count |
| C |
Commercial temperature (0°C to +85°C) |
Technical Documentation
Comprehensive documentation is available for the XC2S200-6FGG693C:
- Complete datasheet (DS001)
- Pinout tables and package drawings
- Application notes and design guides
- User guides for ISE software
- Reference designs and IP cores
Summary
The XC2S200-6FGG693C represents an excellent choice for engineers requiring high-performance programmable logic in a robust, RoHS-compliant package. With 200,000 system gates, 5,292 logic cells, extensive memory resources, and support for 16 I/O standards, this Spartan-II FPGA delivers the flexibility and performance needed for successful digital design implementation across telecommunications, industrial, automotive, and consumer applications.
