Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG687C: High-Performance Spartan-II FPGA for Cost-Effective Embedded Solutions

Product Details

XC2S200-6FGG687C: High-Performance Spartan-II FPGA for Cost-Effective Embedded Solutions

The XC2S200-6FGG687C is a high-density Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. This powerful device delivers 200,000 system gates, 5,292 logic cells, and up to 284 user I/O pins in a compact 687-ball Fine Pitch BGA package. Ideal for high-volume, cost-sensitive applications, the XC2S200-6FGG687C offers exceptional value with advanced features including on-chip block RAM, distributed RAM, and four Delay-Locked Loops (DLLs).


XC2S200-6FGG687C Key Features and Benefits

High Logic Density with 200,000 System Gates

The XC2S200-6FGG687C provides outstanding logic capacity for complex digital designs. With 5,292 logic cells organized in a 28 x 42 CLB array (1,176 Configurable Logic Blocks), this FPGA handles demanding applications while maintaining low power consumption.

Advanced Memory Architecture

This Xilinx FPGA features a powerful SelectRAM hierarchical memory system:

  • 56 Kbits Block RAM – 14 dedicated 4K-bit dual-port RAM blocks
  • 75,264 bits Distributed RAM – 16 bits per LUT for flexible memory configurations
  • Fast External RAM Interfaces – Optimized for high-speed memory communication

Superior I/O Capabilities

The XC2S200-6FGG687C supports 16 high-performance I/O standards, including:

  • LVTTL and LVCMOS (1.5V, 2.5V, 3.3V)
  • PCI (3.3V/5V, 33MHz/66MHz compliant)
  • SSTL2 and SSTL3 for DDR memory interfaces
  • GTL and GTL+ for high-speed signaling
  • HSTL Class I, III, and IV
  • AGP-2X support

XC2S200-6FGG687C Technical Specifications

Core Specifications

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42 (1,176 CLBs)
Maximum User I/O 284
Block RAM 56 Kbits (14 blocks)
Distributed RAM 75,264 bits

Electrical Characteristics

Parameter Value
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V / 2.5V / 3.3V
Process Technology 0.18μm CMOS
Maximum System Frequency Up to 200 MHz

Package Information

Parameter Value
Package Type FGG687 (Fine Pitch BGA, Pb-Free)
Pin Count 687 Balls
Speed Grade -6 (Higher Performance)
Temperature Range Commercial (0°C to +85°C)

XC2S200-6FGG687C Architecture Overview

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG687C contains four Logic Cells (LCs) organized in two slices. Every Logic Cell includes:

  • 4-input Look-Up Table (LUT) for combinatorial logic
  • Dedicated carry logic for high-speed arithmetic
  • D-type flip-flop or latch with clock enable
  • Synchronous/asynchronous set and reset controls

Delay-Locked Loops (DLLs)

The XC2S200-6FGG687C integrates four DLLs positioned at each corner of the die. These provide:

  • Zero-delay clock buffering
  • Clock multiplication (2x) and division (÷1.5 to ÷16)
  • Four quadrature clock phases (0°, 90°, 180°, 270°)
  • Board-level clock deskewing capability

Block RAM Memory

The dual-port Block RAM supports configurable aspect ratios:

Width Depth Address Bus Data Bus
1-bit 4,096 ADDR[11:0] DATA[0]
4-bit 1,024 ADDR[9:0] DATA[3:0]
8-bit 512 ADDR[8:0] DATA[7:0]
16-bit 256 ADDR[7:0] DATA[15:0]

XC2S200-6FGG687C Configuration Options

Supported Configuration Modes

The XC2S200-6FGG687C supports multiple configuration methods for maximum design flexibility:

  • Master Serial Mode – Internal oscillator drives configuration from external PROM
  • Slave Serial Mode – External clock source controls configuration timing
  • Slave Parallel Mode – Fastest 8-bit byte-wide configuration
  • Boundary Scan (JTAG) – IEEE 1149.1 compliant programming

Configuration File Size

The complete configuration bitstream requires 1,335,840 bits (approximately 163 KB). This supports storage in serial PROMs, parallel flash, or system-based configuration from processors.


XC2S200-6FGG687C Part Number Breakdown

Understanding the XC2S200-6FGG687C ordering code:

Code Segment Meaning
XC2S Xilinx Spartan-II Family
200 200,000 System Gates
-6 Speed Grade (Higher Performance)
FGG Fine Pitch BGA, Pb-Free Package
687 687-Ball Package
C Commercial Temperature (0°C to +85°C)

XC2S200-6FGG687C Typical Applications

Industrial Automation

The XC2S200-6FGG687C excels in industrial control systems requiring real-time processing, motor control interfaces, and sensor data acquisition.

Telecommunications Equipment

With high-speed I/O standards and abundant logic resources, this FPGA supports networking equipment, protocol conversion, and signal processing applications.

Consumer Electronics

Cost-effective pricing and low power consumption make the XC2S200-6FGG687C ideal for high-volume consumer products including display controllers and audio/video processing.

Prototyping and Development

The reprogrammable nature of the XC2S200-6FGG687C enables rapid prototyping, allowing engineers to iterate designs without hardware modifications.


XC2S200-6FGG687C Development Support

Design Software

The XC2S200-6FGG687C is fully supported by Xilinx ISE Design Suite, providing:

  • Automatic mapping, placement, and routing
  • Timing-driven implementation tools
  • Static timing analysis
  • In-circuit debugging capabilities

IP Core Library

Access to over 400 optimized primitives and macros including:

  • Arithmetic functions and multipliers
  • Counters and shift registers
  • Multiplexers and decoders
  • Memory controllers

Why Choose the XC2S200-6FGG687C?

Cost-Effective ASIC Alternative

The XC2S200-6FGG687C eliminates NRE costs, lengthy development cycles, and production risks associated with traditional ASICs. Field-programmable updates enable product improvements without hardware changes.

Proven Reliability

Built on mature 0.18μm CMOS technology, the Spartan-II family delivers consistent, reliable performance across commercial temperature ranges.

Design Flexibility

Unlimited reprogrammability allows design changes throughout the product lifecycle, from prototyping through volume production and field upgrades.


XC2S200-6FGG687C Summary

The XC2S200-6FGG687C Spartan-II FPGA delivers an optimal balance of performance, features, and cost for embedded system designers. With 200,000 system gates, advanced memory options, and comprehensive I/O standard support, this device addresses a wide range of applications from industrial automation to consumer electronics.

Contact us today to learn more about the XC2S200-6FGG687C and other Xilinx Spartan-II FPGA solutions for your next project.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.