Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S600E-7FG456C: High-Performance Spartan-IIE FPGA for Digital Design Applications

Product Details

Overview of XC2S600E-7FG456C FPGA

The XC2S600E-7FG456C is a powerful field-programmable gate array (FPGA) from the Spartan-IIE family, manufactured by Xilinx (now AMD). This advanced programmable logic device delivers exceptional performance with 600,000 system gates and 15,552 logic cells, making it an ideal solution for telecommunications, industrial control systems, automotive electronics, and consumer applications. With its -7 speed grade offering operation at up to 160 MHz and 456-pin FBGA package, the XC2S600E-7FG456C provides engineers with a cost-effective alternative to traditional ASICs while maintaining design flexibility and unlimited reprogrammability.

Key Specifications and Technical Features

Core Architecture Specifications

Specification Value
Part Number XC2S600E-7FG456C
Manufacturer Xilinx (AMD)
Product Family Spartan-IIE
System Gates 600,000
Logic Cells 15,552
CLBs (Configurable Logic Blocks) 3,456
Speed Grade -7 (160 MHz max frequency)
Process Technology 0.15 micron CMOS
Supply Voltage 1.71V ~ 1.89V (1.8V nominal)

Memory and I/O Capabilities

Feature Specification
Block RAM Up to 288K bits
Distributed RAM Up to 221,184 bits
Total RAM Bits 294,912 bits
User I/Os 329
I/O Standards Supported 19 selectable standards
DLLs (Delay-Locked Loops) 4

Package and Operating Conditions

Parameter Details
Package Type 456-FBGA (Fine-Pitch Ball Grid Array)
Package Dimensions 23mm × 23mm
Pin Count 456 pins
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Operating Frequency Up to 160 MHz

Advanced Features of XC2S600E-7FG456C

SelectRAM Hierarchical Memory System

The XC2S600E-7FG456C incorporates Xilinx’s innovative SelectRAM technology, providing designers with flexible memory options:

  • 16 bits per LUT distributed RAM for efficient small memory implementations
  • Configurable 4K-bit true dual-port block RAM for larger data storage requirements
  • Six columns of block RAM arranged for optimal performance
  • Hierarchical memory architecture enabling efficient resource utilization

Programmable Logic Architecture

Built on the proven Virtex-E FPGA architecture, this Xilinx FPGA delivers:

  • Four-input lookup tables (LUTs) for flexible logic implementation
  • Configurable logic blocks with four logic cells organized in two slices
  • Fast carry logic for arithmetic operations
  • Versatile routing channels ensuring predictable interconnect performance
  • Unlimited in-system reprogrammability via configuration memory

Industry-Leading I/O Standards Support

The XC2S600E-7FG456C supports 19 different I/O standards, including:

  • LVTTL and LVCMOS variants (3.3V, 2.5V, 1.8V, 1.5V)
  • SSTL (Stub Series Terminated Logic)
  • HSTL (High-Speed Transceiver Logic)
  • GTL and GTL+ standards
  • Differential signaling standards

Applications and Use Cases

Primary Application Areas

Application Domain Use Cases
Telecommunications Protocol converters, data routers, signal processing
Industrial Control Motor controllers, PLC systems, automation equipment
Automotive Electronics ECU systems, sensor interfaces, infotainment controllers
Consumer Electronics Video processing, audio systems, interface controllers
Aerospace & Defense Avionics systems, radar processing, secure communications

Advantages Over Traditional ASICs

The XC2S600E-7FG456C FPGA offers significant benefits compared to mask-programmed ASICs:

  1. Zero NRE costs – Eliminate expensive mask and tooling charges
  2. Rapid prototyping – Design iterations completed in hours, not months
  3. Field upgrades – Update functionality without hardware replacement
  4. Risk mitigation – Modify designs after deployment
  5. Lower minimum order quantities – Cost-effective for medium-volume production

Configuration and Programming Options

Flexible Configuration Modes

Configuration Mode Description
Master Serial FPGA controls configuration from serial PROM
Slave Serial External controller provides serial data stream
Slave Parallel High-speed parallel configuration interface
Boundary Scan (JTAG) IEEE 1149.1 compliant programming and testing

Configuration Memory Support

  • Platform Flash in-system programmable configuration PROMs
  • Serial PROM compatibility for cost-effective configuration storage
  • Hot-swap capability for live system insertion
  • Unlimited reconfiguration cycles without device degradation

Design Tools and Development Support

Compatible Development Environments

  • Xilinx ISE (Integrated Software Environment) for design entry and synthesis
  • FPGA Editor for detailed placement and routing
  • ChipScope Pro for in-system debugging
  • ModelSim integration for comprehensive simulation

IP Core Library Access

Designers using the XC2S600E-7FG456C gain access to:

  • Pre-verified IP cores for common functions
  • Memory controllers and interface protocols
  • DSP building blocks and filters
  • Communication protocol stacks

Performance Characteristics

Timing and Speed Performance

Performance Metric Specification
Maximum Operating Frequency 160 MHz (speed grade -7)
System Performance 400 MHz (internal clock)
Logic-to-Pin Delay Optimized for high-speed I/O
Clock-to-Output Minimal propagation delays

Power Consumption

The 0.15-micron CMOS process technology ensures:

  • Low static power consumption for energy-efficient operation
  • Dynamic power scaling based on utilization
  • 1.8V core voltage reducing overall power requirements
  • Independent I/O bank voltages for flexible interfacing

Quality and Reliability Standards

Manufacturing Quality

  • RoHS compliant lead-free package options available
  • Industrial temperature range (0°C to 85°C)
  • Automotive-qualified versions for harsh environments
  • Extended lifecycle support from AMD/Xilinx

Testing and Verification

Test Parameter Capability
JTAG Boundary Scan IEEE 1149.1 compliant testing
Built-in Self-Test Comprehensive device validation
IDCODE Register Unique device identification
Configuration Readback Verify programmed logic

Ordering Information and Package Options

Part Number Breakdown

XC2S600E-7FG456C decodes as:

  • XC2S = Spartan-II family
  • 600E = 600,000 gates, Extended version
  • 7 = Speed grade (-7, 160 MHz)
  • FG456 = Fine-pitch BGA, 456 pins
  • C = Commercial temperature range (0°C to 85°C)

Available Package Variants

Package Code Pin Count Dimensions I/O Count
FG456 456 23mm × 23mm 329
FG676 676 27mm × 27mm 408
FT256 256 17mm × 17mm 172

Design Considerations and Best Practices

Thermal Management

  • Junction temperature monitoring for reliability
  • Adequate PCB copper planes for heat dissipation
  • Thermal vias in BGA mounting area recommended
  • Ambient airflow considerations for extended operation

PCB Layout Guidelines

  1. Power supply decoupling – Multiple capacitors near device
  2. Ground plane integrity – Solid ground reference essential
  3. Signal integrity – Controlled impedance for high-speed signals
  4. JTAG chain design – Proper termination and pull-ups required

Signal Integrity Optimization

  • Differential pair routing for high-speed interfaces
  • Length matching for synchronous bus designs
  • Termination networks per I/O standard requirements
  • EMI/EMC considerations for regulatory compliance

Comparison with Other Spartan-IIE Devices

Spartan-IIE Family Options

Device System Gates Logic Cells Block RAM Max I/O
XC2S50E 50,000 1,728 32K bits 182
XC2S100E 100,000 2,700 64K bits 202
XC2S150E 150,000 3,840 96K bits 265
XC2S200E 200,000 5,292 128K bits 265
XC2S300E 300,000 6,912 160K bits 329
XC2S400E 400,000 10,800 224K bits 329
XC2S600E 600,000 15,552 288K bits 329

Storage and Handling Requirements

ESD Protection

  • Electrostatic discharge sensitivity – Handle with ESD precautions
  • Anti-static packaging – Shipped in conductive containers
  • Grounded workstations required during handling
  • Proper ESD wrist straps during assembly operations

Environmental Storage

Condition Specification
Storage Temperature -55°C to +150°C
Humidity Non-condensing environments
Shelf Life Indefinite with proper storage
Moisture Sensitivity MSL 3 (168 hours floor life)

Frequently Asked Questions

Q: Is the XC2S600E-7FG456C suitable for new designs?

While still available and fully functional, this device is from a legacy product family. AMD/Xilinx recommends considering newer Spartan-7 or Artix-7 families for new designs, though the XC2S600E remains excellent for existing product updates and cost-sensitive applications.

Q: What is the difference between -6 and -7 speed grades?

The -7 speed grade (XC2S600E-7FG456C) operates at 160 MHz maximum frequency, while the -6 speed grade reaches 357 MHz. The -7 designation indicates a slower speed grade, suitable for applications not requiring maximum performance, potentially at lower cost.

Q: Can this FPGA be programmed multiple times?

Yes, the XC2S600E-7FG456C features unlimited in-system reprogrammability. The SRAM-based configuration memory can be rewritten countless times without degradation, enabling field updates and design iterations.

Q: What development boards are compatible?

Various third-party development boards support the XC2S600E, including custom evaluation platforms. However, newer Xilinx development kits focus on current product families. Custom PCB designs are common for production applications.

Conclusion

The XC2S600E-7FG456C represents a proven, reliable FPGA solution for applications requiring substantial logic resources, flexible I/O capabilities, and cost-effective programmability. With 600,000 system gates, 288K bits of block RAM, and support for 19 I/O standards, this Spartan-IIE device continues to serve engineers in telecommunications, industrial, automotive, and consumer electronics applications. Its 456-pin FBGA package provides an optimal balance between I/O count and board space, while the -7 speed grade offers reliable performance for a wide range of digital design requirements.

Whether prototyping new systems, upgrading existing products, or seeking an alternative to expensive ASICs, the XC2S600E-7FG456C delivers the performance, flexibility, and value that has made Xilinx FPGAs the industry standard for programmable logic solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.