The XC2S200-6FGG679C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family. This high-density programmable logic device delivers exceptional performance for demanding industrial, telecommunications, and embedded system applications. Engineers seeking cost-effective ASIC alternatives will find the XC2S200-6FGG679C an ideal solution for rapid prototyping and production deployment.

XC2S200-6FGG679C Key Features and Benefits

The XC2S200-6FGG679C combines advanced programmable architecture with robust performance specifications. This FPGA offers unlimited in-system reprogrammability, enabling field upgrades without hardware replacement.

Core Architecture Specifications

Memory Resources

XC2S200-6FGG679C Technical Architecture

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG679C features a regular, flexible programmable architecture. Configurable Logic Blocks form the central logic structure with full access to versatile routing channels. Each CLB contains four Logic Cells (LCs), providing 4-input function generators, storage elements, and dedicated carry logic.

Input/Output Block (IOB) Capabilities

Programmable Input/Output Blocks surround the CLB array, offering versatile connectivity options. The XC2S200-6FGG679C supports multiple I/O voltage standards:

• 3.3V LVTTL/LVCMOS
• 2.5V LVCMOS
• 1.5V LVCMOS
• SSTL, GTL, HSTL interface standards

Each IOB includes three registers functioning as edge-triggered D-type flip-flops or level-sensitive latches with independent Clock Enable signals.

Delay-Locked Loop (DLL) Technology

Four Delay-Locked Loops positioned at each die corner provide precise clock management. DLL features include:

• Clock deskewing for board-level synchronization
• Clock mirroring capabilities
• Frequency synthesis functions
• Low-jitter clock distribution

XC2S200-6FGG679C Block RAM Architecture

The XC2S200-6FGG679C integrates substantial block RAM resources organized in two columns along vertical edges. Each 4,096-bit block RAM cell provides:

• Fully synchronous dual-port operation
• Independent control signals per port
• Configurable data widths (1, 2, 4, 8, or 16 bits)
• Built-in width conversion

This architecture enables efficient implementation of FIFOs, buffers, and lookup tables.

XC2S200-6FGG679C Operating Conditions

Electrical Specifications

Package Information

The FGG679 package features a fine-pitch ball grid array configuration optimized for high-density PCB designs. This package provides:

• Excellent thermal dissipation
• Superior signal integrity
• Reliable solder joint connections
• Lead-free (Pb-free) compliance

XC2S200-6FGG679C Configuration Modes

The XC2S200-6FGG679C supports multiple configuration modes for flexible system integration:

XC2S200-6FGG679C Target Applications

The XC2S200-6FGG679C excels in numerous application domains:

Industrial Automation

• Motor control systems
• PLC implementations
• Sensor interface processing
• Industrial communication protocols

Telecommunications

• Protocol conversion
• Data encryption/decryption
• Signal processing
• Network interface controllers

Consumer Electronics

• Video processing
• Audio codec implementation
• Display controllers
• USB/interface bridges

Embedded Systems

• Microcontroller peripherals
• Custom processor implementations
• Memory controllers
• DMA engines

Why Choose XC2S200-6FGG679C Over ASICs?

The XC2S200-6FGG679C provides significant advantages compared to mask-programmed ASICs:

1. Zero NRE Costs – No upfront tooling expenses
2. Rapid Time-to-Market – Immediate prototyping capability
3. Design Flexibility – Field-upgradeable without hardware changes
4. Risk Mitigation – Design modifications possible throughout product lifecycle
5. Lower Volume Pricing – Cost-effective for low-to-medium production volumes

XC2S200-6FGG679C Development Support

Software Tools

The XC2S200-6FGG679C receives full support from Xilinx ISE Design Suite, including:

• HDL synthesis (VHDL/Verilog)
• Automatic placement and routing
• Static timing analysis
• Simulation and verification tools
• Bitstream generation

Documentation Resources

Comprehensive documentation supports successful XC2S200-6FGG679C implementation:

• Complete datasheet (DS001)
• User guide and application notes
• Pinout tables and package drawings
• Reference designs

XC2S200-6FGG679C Ordering Information

Part Number Breakdown

XC2S200 - 6 - FGG679 - C
   │      │     │      │
   │      │     │      └── Temperature: C = Commercial (0°C to +85°C)
   │      │     └── Package: FGG679 = Fine-Pitch BGA, 679 Pins
   │      └── Speed Grade: -6 (Fastest Performance)
   └── Device: Spartan-II, 200K System Gates

The “G” designation indicates Pb-free (RoHS compliant) packaging.

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XC2S200-6FGG679C Summary Specifications

The XC2S200-6FGG679C represents an excellent balance of performance, flexibility, and cost-effectiveness for programmable logic applications requiring high gate density and substantial I/O resources.