MIL-PRF-19500: Military Semiconductor Device Specification Explained

When you’re working on military electronics, integrated circuits get most of the attention. But discrete semiconductors—transistors, diodes, rectifiers, thyristors—form the backbone of power systems, protection circuits, and analog designs that keep defense systems running. MIL-PRF-19500 is the specification that governs these critical components, and understanding it matters for anyone designing or procuring military-grade discrete devices.

I’ve lost count of how many times a seemingly simple diode or transistor selection turned into a deep dive through MIL-PRF-19500 slash sheets. This guide breaks down what engineers actually need to know about the specification, from quality levels to testing requirements to practical procurement considerations.

What Is MIL-PRF-19500?

MIL-PRF-19500 is the U.S. Department of Defense performance specification covering discrete semiconductor devices for military and aerospace applications. The specification establishes requirements for diodes, transistors, thyristors, and other discrete semiconductor components used in high-reliability systems.

Unlike MIL-PRF-38535 (integrated circuits) or MIL-PRF-38534 (hybrid microcircuits), MIL-PRF-19500 focuses on individual semiconductor elements—single-function devices that serve as fundamental building blocks in electronic circuits. These components might seem basic compared to complex ICs, but when your power supply fails because of a substandard rectifier, you appreciate why military specifications exist.

Scope of MIL-PRF-19500 Coverage

The specification covers an extensive range of discrete semiconductor devices:

Device Category	Examples	Common Applications
Diodes	Signal, switching, Zener, Schottky	Rectification, protection, voltage reference
Rectifiers	Standard, fast recovery, bridge	Power supplies, motor drives
Transistors	BJT (NPN, PNP), JFET	Amplification, switching
MOSFETs	N-channel, P-channel	Power switching, signal processing
Thyristors	SCR, TRIAC	Power control, motor drives
Voltage regulators	Fixed, adjustable	Power management
Optoelectronics	Optocouplers, LEDs	Isolation, indication

Why MIL-PRF-19500 Matters for Your Designs

From a practical engineering standpoint, MIL-PRF-19500 compliance provides several assurances that commercial parts don’t offer:

Guaranteed parameter limits: Every device meets specified electrical parameters across the full military temperature range, not just at room temperature.

Consistent quality: Lot-to-lot variation is controlled through statistical process control and screening requirements.

Complete traceability: Manufacturing records allow tracking from wafer through final test—essential for failure analysis.

Environmental robustness: Devices are tested for temperature extremes, humidity, mechanical stress, and other environmental factors.

Long-term availability: QPL (Qualified Products List) status means suppliers commit to maintaining production capability.

MIL-PRF-19500 Quality Levels and Classifications

The specification defines quality levels that indicate screening intensity and reliability requirements. Selecting the appropriate level balances cost against application criticality.

JANS, JANTXV, JANTX, JAN: Understanding the Quality Hierarchy

Quality Level	Designation	Screening Intensity	Typical Applications
JANS	Space grade	Maximum	Satellites, spacecraft, strategic missiles
JANTXV	Extended reliability	Very high	Aircraft avionics, critical systems
JANTX	High reliability	High	Shipboard, tactical systems
JAN	Standard military	Moderate	Support equipment, ground systems

The naming convention dates back decades—”JAN” originally stood for Joint Army-Navy. While the terminology feels dated, the quality distinctions remain meaningful.

JANS (Space Grade) Requirements

JANS represents the highest reliability level under MIL-PRF-19500. These devices undergo the most extensive screening:

Requirement	JANS Specification
100% screening	All tests performed on every device
Burn-in	Extended duration at elevated temperature
Hermeticity	Fine and gross leak testing (hermetic packages)
External visual	100% inspection per MIL-STD-750
Radiographic	X-ray inspection for internal defects
PIND	Particle impact noise detection
Serialization	Individual device traceability

JANTXV Level Requirements

JANTXV adds the “V” designation for additional screening beyond standard JANTX:

Screening	JANTXV Additions
100% burn-in	Required at elevated temperature
Pre/post burn-in	Delta parameter measurements
Extended temperature cycling	Additional thermal stress
Enhanced visual inspection	Per TM 2072 requirements

JANTX Level Requirements

JANTX provides solid military reliability without space-grade costs:

Requirement	JANTX Level
Group A testing	100% electrical verification
Group B testing	Sample-based package integrity
Group C testing	Periodic life and environmental
Burn-in	Optional or reduced duration

JAN (Standard) Level

JAN level represents minimum military quality:

Requirement	JAN Level
Basic screening	Per device specification
Reduced sampling	Lower LTPD requirements
Standard testing	Core electrical parameters

MIL-PRF-19500 Testing Requirements

The testing requirements under MIL-PRF-19500 follow a group structure similar to other military semiconductor specifications. Each group addresses different aspects of device quality.

Group A Testing (Electrical Verification)

Group A tests verify electrical parameters on production lots. These tests confirm devices meet their specified characteristics.

Subgroup	Test Type	Parameters
A1	Static DC at 25°C	Forward voltage, leakage, breakdown
A2	Static DC at high temperature	Hot parameters (+125°C or +150°C)
A3	Static DC at low temperature	Cold parameters (-55°C)
A4	Dynamic/switching	Turn-on time, turn-off time, recovery
A5	Functional	Device-specific performance

Group B Testing (Die and Package Integrity)

Group B evaluates the physical construction of the device.

Test	Method	Purpose
Solderability	MIL-STD-750 TM 2026	Verify lead solder acceptance
Terminal strength	MIL-STD-750 TM 2036	Lead attachment integrity
Internal visual	MIL-STD-750 TM 2072/2074	Die and bond inspection
Bond strength	MIL-STD-750 TM 2037	Wire bond pull strength
Die attach	MIL-STD-750 TM 2017	Die-to-header shear strength

Group C Testing (Package and Environmental)

Group C tests evaluate package integrity and environmental resistance.

Test	Conditions	Acceptance
Hermetic seal (fine)	Helium leak detection	Per TM 1071
Hermetic seal (gross)	Fluorocarbon bubble	No visible bubbles
Thermal shock	-65°C to +150°C liquid	No parameter degradation
Temperature cycling	-65°C to +200°C	No mechanical damage
Moisture resistance	10 cycles per TM 1021	Electrical compliance
Shock	Per TM 2016	No physical damage
Vibration	Per TM 2046	No failures
Constant acceleration	Per TM 2006	No internal damage
Salt atmosphere	Per TM 1041	No corrosion

Group D Testing (Endurance/Life)

Group D tests evaluate long-term reliability through accelerated life testing.

Test	Conditions	Duration
Operating life	Max junction temp, rated current	1000 hours minimum
High temperature storage	+150°C to +200°C	1000 hours
Intermittent operating life	Power cycling	Per device spec
Forward bias	Rated current, elevated temp	1000 hours
Reverse bias	Rated voltage, elevated temp	1000 hours

MIL-PRF-19500 Screening Flows

Understanding the screening sequence helps when estimating lead times and troubleshooting lot rejections.

JANS Screening Flow (Diodes/Transistors)

Wafer Level:

1. Wafer acceptance testing (electrical probing)
2. Visual inspection of wafer
3. Die separation and sort

Assembly Level: 4. Die attach to package header 5. Wire bonding 6. Pre-cap visual inspection (100%) 7. Stabilization bake (+150°C, 24 hours) 8. Temperature cycling (-65°C to +200°C, 10 cycles) 9. Constant acceleration (for applicable packages) 10. Pre-seal visual inspection (100%) 11. Seal package (weld or braze) 12. Gross and fine leak test (100%) 13. Radiographic inspection (X-ray) 14. PIND testing (hermetic packages) 15. Burn-in (240 hours minimum) 16. Final electrical (25°C, hot, cold) 17. External visual inspection (100%) 18. Serialization and marking

JANTX Screening Flow

The JANTX flow is similar but with reduced requirements:

Step	JANS	JANTX	Difference
Burn-in	240 hours	96-168 hours	Shorter duration
X-ray	100%	Sample	Reduced coverage
PIND	100%	When specified	Optional
Serialization	Required	Not required	Less traceability

MIL-PRF-19500 Slash Sheets Explained

The MIL-PRF-19500 specification uses a slash sheet system to define specific device types. Understanding this structure is essential for procurement.

Slash Sheet Number Format

Each device type has a unique slash sheet that defines its specific requirements:

MIL-PRF-19500/XXX

Where XXX is the slash sheet number identifying the device type.

Example Slash Sheet Categories

Slash Sheet Range	Device Type	Examples
/100-/199	General purpose diodes	1N914, 1N4148 equivalents
/200-/299	Voltage regulators	Reference diodes
/300-/399	Switching transistors	2N2222, 2N2907 families
/400-/499	RF transistors	High frequency devices
/500-/599	Power transistors	High current switching
/600-/699	FETs	JFET and MOSFET
/700-/799	Rectifiers	Power rectifier diodes

Reading a Complete MIL-PRF-19500 Part Number

A full part number contains all information needed to specify the device:

JANTXV1N6642U-1

Element	Meaning
JANTXV	Quality level (extended reliability)
1N	Device type prefix (diode)
6642	Base device number
U	Package type (per slash sheet)
-1	Dash number variant

Common Device Prefixes

Prefix	Device Type
1N	Diodes (one junction)
2N	Transistors (two junctions)
3N	FETs (three terminals, different technology)
4N	Optocouplers

MIL-PRF-19500 Package Types

Package selection affects thermal performance, reliability, and board layout. MIL-PRF-19500 devices come in various package configurations.

Common Military Semiconductor Packages

Package	Description	Thermal Resistance	Applications
DO-35	Axial glass	300-400°C/W	Small signal diodes
DO-41	Axial glass, larger	50-100°C/W	Medium power diodes
DO-204	Metal can	30-50°C/W	Power diodes, rectifiers
TO-18	Metal can, 3-lead	150-200°C/W	Small signal transistors
TO-39	Metal can, larger	100-150°C/W	Medium power transistors
TO-3	Large metal	1-3°C/W	Power transistors
TO-5	Metal can, 8-10 lead	100-150°C/W	Precision transistors
JEDEC DO-214	SMD	Varies	Surface mount

Hermetic vs. Plastic Packages

Characteristic	Hermetic	Plastic
Moisture protection	Excellent	Limited
Temperature range	-55°C to +200°C	-55°C to +150°C
Long-term reliability	Superior	Good
Cost	Higher	Lower
Availability	MIL-PRF-19500 standard	Typically commercial
Weight	Heavier	Lighter

Most MIL-PRF-19500 qualified parts use hermetic packages (glass-to-metal or ceramic-to-metal seals) for maximum reliability. Some newer slash sheets include plastic packages for less demanding applications.

Comparing MIL-PRF-19500 to Commercial Semiconductor Specs

Engineers often ask whether commercial parts can substitute for MIL-PRF-19500 devices. Here’s an honest comparison:

Parameter Comparison

Parameter	Commercial	Industrial	Automotive	MIL-PRF-19500
Temperature range	0°C to +70°C	-40°C to +85°C	-40°C to +150°C	-55°C to +175°C
Burn-in	None	Rare	Sometimes	Required (JANTX+)
Lot traceability	None	Limited	Partial	Complete
Screening	AQL sampling	Enhanced	100% typical	100% + groups
Life testing	168-1000 hrs	1000 hrs	1000+ hrs	1000-4000 hrs
Data retention	Limited	5-10 years	15 years	Indefinite
Hermeticity	Plastic typical	Mixed	Automotive grade	Hermetic standard

When MIL-PRF-19500 Parts Are Essential

You should use MIL-PRF-19500 qualified parts when:

• Contract requirements mandate them
• Operating temperature exceeds +125°C or drops below -40°C
• High-altitude or vacuum operation requires hermetic packaging
• Radiation tolerance is required
• Field failure has mission-critical consequences
• Long service life (20+ years) is expected
• Full traceability for failure analysis is needed

When Alternatives Might Work

Commercial or industrial parts might suffice for:

• Prototype development
• Ground support equipment
• Redundant non-critical functions
• Applications with benign environments
• Programs allowing Source Control Drawings

However, upscreening commercial discretes to military specs is problematic. The die, bonding, and package materials differ from the start in QPL-listed parts.

Procuring MIL-PRF-19500 Components

Discrete semiconductors seem simple, but military procurement has nuances that can trip up inexperienced buyers.

Qualified Products List (QPL) Sources

Unlike QML-based specifications, MIL-PRF-19500 maintains a Qualified Products List for each slash sheet. Only QPL-listed manufacturers and distributors may supply parts marked with JAN designations.

Manufacturer	Specialties	Notable Product Lines
Microsemi (Microchip)	Power discretes, rectifiers	JAN diodes, transistors
Central Semiconductor	Small signal devices	Full JAN line
Solid State Inc.	General purpose	Standard JAN devices
Sensitron	High reliability	JANS devices
M/A-COM (MACOM)	RF transistors	High-frequency JAN
Semicoa	Specialty discretes	Space-grade
API Technologies	Specialty devices	Radiation hardened

Lead Time Expectations

Quality Level	Typical Lead Time	Notes
JAN	8-16 weeks	Standard stock
JANTX	12-20 weeks	Enhanced screening
JANTXV	16-26 weeks	Extended screening
JANS	26-52 weeks	Full space screening

Plan procurement early. Lead times for military discretes often exceed those for commercial equivalents by 3-5x.

Documentation Requirements

Document	Content	When Required
Certificate of Conformance	QPL compliance statement	Every shipment
Test data summary	Group A results	Per lot
Traceability records	Lot/date code history	Upon request
Failure analysis reports	Root cause documentation	Any rejects
GIDEP alerts	Known issues	Check before procurement

Counterfeit Prevention

Military discretes are counterfeiting targets because they’re expensive and have long lead times. Protect yourself by:

1. Buying only from QPL-listed sources
2. Verifying date codes are plausible
3. Inspecting incoming lots (visual, X-ray if hermetic)
4. Testing samples electrically
5. Using SAE AS6171 methods for suspect parts
6. Avoiding gray market and broker sources

MIL-PRF-19500 Resources and Databases

Official Government Resources

Resource	URL	Description
DLA Land and Maritime	https://landandmaritimeapps.dla.mil/Programs/Milspec/	Specifications and QPL
QPL-19500	https://landandmaritimeapps.dla.mil/Programs/Milspec/ListSearch.aspx	Qualified products search
ASSIST QuickSearch	https://quicksearch.dla.mil/	Specification database
GIDEP	https://www.gidep.org/	Problem alerts
DSCC Drawings	https://landandmaritimeapps.dla.mil/Downloads/MilSpec/	Slash sheet downloads

Industry Standards

Document	Description
MIL-PRF-19500	Primary specification
MIL-STD-750	Test methods for semiconductors
MIL-HDBK-217	Reliability prediction
JEDEC standards	Commercial reference methods
SAE AS6171	Counterfeit detection
SAE AS6496	Counterfeit avoidance

Manufacturer Resources

Manufacturer	Resource Type	URL
Microchip/Microsemi	Military products	microchip.com/design-centers/space-harsh-environment
Central Semiconductor	JAN catalog	centralsemi.com
Solid State Inc.	Product database	solstateinc.com
Sensitron	Space grade	sensitron.com

MIL-PRF-19500 FAQs

What is the difference between JAN, JANTX, JANTXV, and JANS quality levels?

These designations indicate increasing levels of screening and reliability assurance under MIL-PRF-19500. JAN is the baseline military quality with standard screening. JANTX adds enhanced testing including mandatory burn-in. JANTXV includes everything in JANTX plus additional screening like 100% electrical testing at temperature extremes and tighter parameter limits. JANS (space grade) represents maximum reliability with full serialization, extended burn-in (240+ hours), 100% radiographic inspection, and complete traceability. Each step up increases cost but provides additional assurance for critical applications. For most military ground and airborne applications, JANTX provides adequate reliability, while JANS is typically reserved for space missions and strategic systems.

Can I substitute a commercial semiconductor for a MIL-PRF-19500 qualified part?

Generally, no—at least not without explicit program approval and documentation. MIL-PRF-19500 qualified parts are manufactured using controlled processes, specified materials, and hermetic packaging that commercial equivalents don’t match. Even if the electrical specifications appear identical, commercial parts lack the screening, traceability, and environmental robustness that military applications require. Some programs allow commercial parts under Source Control Drawings with additional testing, but this requires engineering analysis, customer approval, and often 100% screening. The cost savings from commercial parts frequently disappears when you add the screening, documentation, and qualification effort required for military applications.

How do I find the correct slash sheet for a MIL-PRF-19500 device?

Start with the DLA Land and Maritime website (landandmaritimeapps.dla.mil/Programs/Milspec/) and use their search function. Enter the base device number (for example, “1N6642” for a Zener diode) to find the applicable slash sheet. Each slash sheet defines the device family’s electrical characteristics, test requirements, package options, and qualified manufacturers. You can also search the ASSIST database (quicksearch.dla.mil) using the full specification number (MIL-PRF-19500) and browse available slash sheets. If you’re trying to find a military equivalent for a commercial part, cross-reference databases from major manufacturers can help identify corresponding MIL-PRF-19500 slash sheet numbers.

Why are MIL-PRF-19500 devices so much more expensive than commercial equivalents?

The cost difference comes from three main factors: screening, materials, and volume. Screening alone can add weeks of testing including burn-in (running every device at elevated temperature under bias for hundreds of hours), 100% electrical testing at multiple temperatures, hermeticity testing, and visual inspection. These aren’t automated processes—they require skilled technicians and expensive equipment. Materials differ too: hermetic packages cost more than plastic, and the die themselves may be from dedicated military wafer lots with tighter process controls. Finally, volumes are lower, spreading the fixed costs of qualification, documentation, and manufacturing setup across fewer units. A commercial diode might ship millions per year while its JANTX equivalent ships thousands, dramatically affecting per-unit economics.

What happens if a MIL-PRF-19500 part I need becomes obsolete?

Obsolescence is an ongoing challenge with military discretes as manufacturers consolidate and older processes are retired. When you receive a GIDEP obsolescence notice or last-time-buy notification, act quickly. First, calculate lifetime requirements including spares and attrition. Execute a lifetime buy if economically feasible—this is often the lowest-risk solution. Second, identify potential alternates from QPL sources and begin qualification testing. Third, if no QPL alternates exist, work with your program office to qualify a replacement, potentially using Source Control Drawings. Some programs bank die or wafers for future assembly. Document everything, because qualification data and rationale will be needed throughout the program’s life. Start obsolescence monitoring early rather than reacting to notifications—proactive programs track manufacturer roadmaps and plan transitions before parts become unavailable.

Practical Guidance for Working with MIL-PRF-19500

After years of specifying and troubleshooting military discretes, here are lessons learned:

Don’t underestimate lead times. Military discrete lead times routinely exceed estimates. Build margin into your procurement schedule, especially for JANTXV and JANS parts.

Verify QPL status before design commitment. Manufacturers lose and gain QPL qualification. Check current QPL listings before finalizing your design around a specific supplier’s part.

Understand your temperature requirements. If your actual operating environment stays within -40°C to +85°C, you might not need the full -55°C to +175°C capability (and cost) of military parts. But verify with thermal analysis, not assumptions.

Keep slash sheets on file. The detailed specifications in slash sheets matter when troubleshooting or qualifying alternates. Maintain a technical data package for every military discrete in your design.

Test incoming lots. Even from authorized sources, verify critical parameters on incoming parts. Simple curve tracer tests catch gross failures and deter counterfeiters.

Plan for obsolescence. Monitor GIDEP and manufacturer notifications. Build obsolescence management into your program from the start, not as a crisis response.

MIL-PRF-19500 discrete semiconductors remain essential building blocks for military electronics. The specification ensures these fundamental components meet the reliability demands of defense applications—demands that commercial parts simply cannot satisfy. Understanding the quality levels, testing requirements, and procurement considerations outlined here positions you to design and build systems that perform when they must.