MIL-HDBK-263: ESD Control Handbook & Implementation Guide

When MIL-STD-1686 tells you what ESD control requirements to meet, MIL-HDBK-263 tells you how to actually meet them. This handbook is the practical companion to military ESD standards, providing the technical background, implementation guidance, and design considerations that engineers need to build effective ESD protection into their programs and products.

I’ve referenced MIL-HDBK-263 countless times when designing ESD-protected workstations, developing handling procedures, and troubleshooting ESD-related failures. While it’s officially a handbook rather than a mandatory standard, the information it contains is invaluable for anyone serious about protecting sensitive electronics from electrostatic discharge.

What Is MIL-HDBK-263?

MIL-HDBK-263 is the U.S. Department of Defense handbook titled “Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assemblies, and Equipment.” The handbook provides comprehensive technical guidance for understanding ESD phenomena, implementing control programs, designing ESD-protected facilities, and integrating ESD protection into electronic designs.

The current version, MIL-HDBK-263B, serves as a companion document to MIL-STD-1686 (the mandatory ESD control program standard). While MIL-STD-1686 establishes requirements, MIL-HDBK-263 explains the science behind those requirements and provides practical implementation guidance.

Purpose of MIL-HDBK-263

Function	Description
Technical background	Explains ESD physics and damage mechanisms
Implementation guidance	How to meet MIL-STD-1686 requirements
Design information	Facility and circuit-level ESD protection
Best practices	Industry-proven methods and techniques
Reference data	Component sensitivities, material properties

Relationship to Other ESD Documents

Document	Role	Relationship to MIL-HDBK-263
MIL-STD-1686	Mandatory requirements	MIL-HDBK-263 provides implementation guidance
ANSI/ESD S20.20	Commercial standard	Similar scope, MIL-HDBK-263 is more detailed
ESD TR53	Test methods	MIL-HDBK-263 references for verification
MIL-HDBK-263	Implementation guidance	Primary handbook

MIL-HDBK-263 ESD Fundamentals

The handbook provides essential background on electrostatic phenomena that every engineer handling sensitive electronics should understand.

How Static Electricity Is Generated

Generation Mechanism	Description	Common Sources
Triboelectric charging	Contact and separation of materials	Walking, material handling, tape removal
Induction	Charge redistribution from nearby field	Approaching charged objects
Conduction	Direct charge transfer	Touching charged surfaces
Corona discharge	Ionization from high fields	High-voltage equipment

Triboelectric Series

MIL-HDBK-263 includes the triboelectric series showing which materials tend to charge positive or negative when contacted:

Material	Charge Tendency
Human hands	Strong positive
Glass	Positive
Nylon	Positive
Wool	Positive
Paper	Slightly positive
Cotton	Near neutral
Steel	Near neutral
Wood	Slightly negative
Rubber	Negative
PVC	Strong negative
Teflon	Strong negative
Silicone	Strong negative

Materials farther apart on the series generate more charge when contacted. This explains why handling electronics while wearing synthetic clothing creates significant ESD risk.

Charge Generation Examples

Activity	Typical Voltage Generated
Walking across carpet	1,500 – 35,000V
Walking across vinyl floor	250 – 12,000V
Worker at bench	700 – 6,000V
Picking up bag from bench	1,200 – 20,000V
Removing tape from PCB	5,000 – 20,000V
Foam cushion (sitting/rising)	1,800 – 18,000V

Note that humidity significantly affects these values—low humidity (10-20% RH) produces the higher voltages, while higher humidity (65-90% RH) produces the lower values.

ESD Damage Mechanisms

Mechanism	Description	Result
Oxide punch-through	Gate oxide breakdown	Permanent short
Junction damage	PN junction degradation	Leakage increase
Metallization melt	Conductor vaporization	Open circuits
Contact spiking	Metal migration through junction	Shorts, leakage
Latent defect	Partial damage weakening device	Delayed failure

MIL-HDBK-263 ESD Models and Testing

The handbook explains the ESD models used to characterize component sensitivity and test ESD protection.

Human Body Model (HBM)

The HBM simulates a person discharging through a device:

Parameter	HBM Specification
Capacitance	100 pF
Resistance	1500 ohms
Rise time	2-10 ns
Decay time	~150 ns
Peak current (2kV)	~1.33 A

Machine Model (MM)

The MM simulates discharge from equipment or tools:

Parameter	MM Specification
Capacitance	200 pF
Resistance	~0 ohms (low)
Rise time	<1 ns
Peak current (200V)	~3.5 A

Charged Device Model (CDM)

The CDM simulates a charged device discharging to ground:

Parameter	CDM Specification
Capacitance	Device-dependent
Resistance	Very low
Rise time	<400 ps
Duration	<2 ns
Peak current	Very high (>10A possible)

CDM events are particularly damaging because of their extremely fast rise times and high peak currents. Modern ICs with thin gate oxides are increasingly susceptible to CDM damage.

Component Sensitivity Classifications

HBM Class	Voltage Range	Handling Requirements
Class 0	<250V	Maximum control, continuous monitoring
Class 1A	250V – <500V	Enhanced controls
Class 1B	500V – <1000V	Standard military controls
Class 1C	1000V – <2000V	Standard controls
Class 2	2000V – <4000V	Basic controls
Class 3	≥4000V	Minimal controls needed

MIL-HDBK-263 Facility Design Guidance

The handbook provides detailed guidance for designing ESD-protected areas.

EPA Design Elements

Element	Purpose	MIL-HDBK-263 Guidance
Flooring	Personnel grounding	Static dissipative, <10⁹ ohms to ground
Work surfaces	Safe handling area	Static dissipative or conductive
Grounding	Common reference	Single-point ground system
Ionization	Neutralize insulators	Where grounding isn’t possible
Humidity	Reduce charge generation	40-60% RH optimal
Air flow	Minimize particle charging	Control velocity and filtration

Grounding System Design

Component	Requirement	Purpose
Equipment ground	<1 ohm to building ground	Safety and ESD reference
Common point ground	<25 ohms to equipment ground	ESD reference point
Work surface ground	<10⁹ ohms to common point	Controlled dissipation
Personnel ground	<35 megohms to common point	Safe personnel discharge
Floor ground	<10⁹ ohms to common point	Mobile worker grounding

Workstation Configuration

MIL-HDBK-263 recommends specific workstation configurations:

Component	Specification	Verification
Work surface mat	10⁶ – 10⁹ ohms surface resistance	Weekly measurement
Wrist strap	750K – 35M ohms total path	Each use or continuous
Common point ground	Connection to building ground	Annual verification
Tool grounding	All metal tools grounded	Periodic check
Ionizer (if used)	Balanced within ±50V	Per manufacturer spec

MIL-HDBK-263 Handling Procedures

The handbook provides comprehensive guidance for handling ESDS items throughout their lifecycle.

Receiving and Inspection

Step	Procedure	Purpose
Verify packaging	Check for ESD labels, damage	Ensure protection integrity
Open in EPA	Remove from outer packaging in EPA only	Prevent exposure
Inspect contents	Verify inner ESD packaging	Confirm protection
Document	Record lot, date, condition	Traceability
Store properly	ESD-protective containers	Continued protection

Assembly and Manufacturing

Requirement	Implementation
Personnel grounding	Verified before each operation
Work surface grounding	Continuous connection
Tool grounding	Soldering irons, tweezers, etc.
Component handling	Minimize contact with leads
Board handling	Touch edges only, use fixtures
Ionization	For operations involving insulators

Testing and Inspection

Consideration	Guidance
Test equipment	Grounded, ESD-safe probes
Fixtures	Static dissipative materials
Handler/prober	Grounded contact points
Visual inspection	Non-charging lighting, surfaces
Automated handling	Ionization at charge-generating points

Storage Requirements

Storage Type	Requirements
Short-term (in EPA)	Covered, dissipative containers
Long-term	Shielding bags, humidity control
Warehouse	Climate controlled, ESD packaging
Field storage	Original or equivalent packaging

MIL-HDBK-263 Circuit Design for ESD Protection

Beyond handling procedures, the handbook addresses designing ESD protection into circuits themselves.

Input Protection Strategies

Protection Method	Application	Considerations
Diode clamps	Input pins	Forward drop, capacitance
Zener diodes	Voltage limiting	Clamping voltage selection
TVS diodes	Transient suppression	Response time, capacitance
Resistor limiting	Current reduction	Signal impact
Spark gaps	High-energy events	Breakdown voltage

PCB Layout for ESD Protection

Technique	Purpose	Implementation
Guard rings	Prevent surface arcing	Ground ring around sensitive nodes
Spacing	Voltage standoff	Minimum creepage distances
Routing	Minimize coupling	Keep sensitive traces short
Ground planes	Provide discharge path	Solid planes under I/O areas
Protection placement	Minimize protected area	Clamps near connectors

Connector and I/O Protection

Guideline	Rationale
Protect all external connections	Entry points for ESD events
Place protection close to connector	Minimize protected trace length
Use low-capacitance devices	Preserve signal integrity
Consider surge requirements	ESD + other transients
Test to appropriate levels	Verify protection effectiveness

MIL-HDBK-263 Training Guidance

The handbook emphasizes training as fundamental to ESD control effectiveness.

Training Program Elements

Element	Content
Basic awareness	What ESD is, why it matters
Damage mechanisms	How ESD damages components
Program requirements	Facility-specific procedures
Hands-on practice	Equipment use, proper techniques
Verification methods	Self-checking, compliance
Refresher training	Periodic updates and reinforcement

Training Effectiveness Indicators

Indicator	Target	Measurement
Audit findings	Decreasing trend	Audit results
ESD-related rejects	Declining rate	Quality data
Training compliance	100% current	Training records
Employee awareness	High knowledge	Assessments

MIL-HDBK-263 Verification and Measurement

The handbook provides guidance on verifying ESD control effectiveness.

Measurement Requirements

Item	Measurement	Acceptable Range
Work surface resistance	Point-to-point, point-to-ground	10⁶ – 10⁹ ohms
Floor resistance	Point-to-point, point-to-ground	<10⁹ ohms
Wrist strap resistance	Strap plus cord	750K – 35M ohms
Heel strap resistance	Through footwear/floor	<35M ohms
Garment resistance	Point-to-point	<10¹¹ ohms
Ionizer balance	Offset voltage	±50V or better
Ionizer discharge time	1000V to 100V decay	<20 seconds typical

Test Equipment Requirements

Equipment	Purpose	Calibration
Megohmmeter	Resistance measurements	Annual minimum
Wrist strap tester	Personnel grounding	Annual minimum
Charged plate monitor	Ionizer verification	Annual minimum
Surface resistivity meter	Material qualification	Annual minimum
Electrostatic fieldmeter	Voltage measurement	Annual minimum

Verification Schedule Recommendations

Item	Frequency	Rationale
Wrist straps	Each use or continuous	High failure rate, critical control
Work surfaces	Weekly to monthly	Contamination effects
Flooring	Monthly to quarterly	Slower degradation
Ionizers	Per manufacturer	Performance drift
Grounding system	Annually	Stable if properly installed
Packaging materials	Incoming	Verify supplier compliance

MIL-HDBK-263 Packaging Guidance

The handbook provides extensive guidance on ESD-protective packaging.

Packaging Material Selection

Material Type	Resistance	Application
Conductive	<10⁴ ohms	Shielding, Faraday cage
Static dissipative	10⁴ – 10¹¹ ohms	Handling, work surfaces
Antistatic	Low charging	Cushioning, void fill
Shielding	Attenuates fields	External protection

Package Design Principles

Principle	Implementation
Inner protection	Device in direct ESD protection
Shielding	Faraday cage effect for field isolation
Cushioning	Mechanical protection (antistatic material)
Moisture barrier	Humidity control where needed
Identification	Clear ESD sensitivity labeling

Packaging Verification

Test	Purpose	Method
Surface resistance	Material qualification	Per ESD STM11.11
Shielding effectiveness	Protection verification	Per ESD STM11.31
Charge decay	Dissipation rate	Per ESD STM11.11
Triboelectric charging	Charge generation	Per ESD STM11.11

MIL-HDBK-263 Resources

Government Resources

Resource	URL	Description
DLA ASSIST	https://quicksearch.dla.mil/	Military standards database
DTIC	https://discover.dtic.mil/	Defense technical information
NASA NEPP	https://nepp.nasa.gov/	NASA parts and ESD guidance

Industry Resources

Resource	URL	Description
ESD Association	https://www.esda.org/	Standards, training, certification
JEDEC	https://www.jedec.org/	Semiconductor standards
IPC	https://www.ipc.org/	Electronics assembly standards

Related Documents

Document	Description
MIL-HDBK-263B	ESD Control Handbook (primary)
MIL-STD-1686	ESD Control Program Requirements
ANSI/ESD S20.20	Commercial ESD program standard
ESD TR53	Test methods
JEDEC JESD625	ESD sensitivity testing
IEC 61340-5-1	International ESD standard

MIL-HDBK-263 FAQs

What is the difference between MIL-HDBK-263 and MIL-STD-1686?

MIL-STD-1686 is the mandatory standard that establishes ESD control program requirements for military contracts—it tells you what you must do. MIL-HDBK-263 is a non-mandatory handbook that provides technical background, implementation guidance, and best practices—it tells you how to do it and why. When a military contract requires ESD control, MIL-STD-1686 compliance is mandatory. MIL-HDBK-263 supports that compliance by providing the detailed technical information needed to implement an effective program. Think of MIL-STD-1686 as the “what” and MIL-HDBK-263 as the “how.” Engineers designing ESD programs should use both documents together.

How does humidity affect ESD risk according to MIL-HDBK-263?

MIL-HDBK-263 extensively discusses humidity’s role in ESD control. Higher humidity (above 40-50% RH) reduces charge generation because moisture on surfaces provides a conductive path that allows charges to dissipate. However, the handbook cautions against relying solely on humidity for ESD control because charges can still generate and damage components even at high humidity, humidity varies with weather and HVAC systems creating inconsistent protection, sensitive components can be damaged by charges that develop even in humid conditions, and many production environments cannot maintain high humidity. The handbook recommends maintaining 40-60% RH as part of a comprehensive ESD program, but emphasizes that humidity control supplements rather than replaces other controls like grounding, ionization, and proper handling procedures.

What guidance does MIL-HDBK-263 provide for automated handling equipment?

MIL-HDBK-263 addresses automated equipment ESD risks extensively. Key guidance includes grounding all conductive parts of equipment that contact devices, using ionization at points where devices separate from surfaces (which generates CDM events), selecting materials carefully for handlers, chutes, and contact surfaces, controlling air flow velocity to minimize triboelectric charging, verifying equipment grounding and ionizer function regularly, and considering CDM protection since automated equipment often causes CDM events. The handbook emphasizes that automated equipment can create more severe ESD events than manual handling because of the rapid movement and separation of devices from surfaces. Equipment qualification should include ESD testing to verify that handling doesn’t generate damaging discharges.

How should ESD-sensitive items be marked according to MIL-HDBK-263?

MIL-HDBK-263 provides guidance on ESD sensitivity marking to ensure proper handling throughout the supply chain. The standard ESD susceptibility symbol (the hand with the line through it and triangle) should appear on packages containing ESDS items, containers and bags used for storage, documents and paperwork accompanying shipments, and EPA entrances and workstations. Marking should include the sensitivity classification when practical so handlers understand the protection level required. The handbook also addresses situations where component size prevents direct marking—in these cases, the immediate packaging must be marked. Clear, consistent marking throughout the supply chain ensures that everyone handling the items understands ESD precautions are required.

Does MIL-HDBK-263 address ESD protection in field maintenance environments?

Yes, MIL-HDBK-263 includes guidance for field and depot maintenance environments where permanent EPA infrastructure may not be available. Key recommendations include using portable ESD control kits containing work surface mats, wrist straps, grounding cords, and portable ionizers, establishing temporary EPAs with defined boundaries and grounding points, training field personnel on ESD awareness and portable equipment use, maintaining ESD-protective packaging until items reach the controlled work area, verifying grounding effectiveness before beginning work, and using field-appropriate test equipment to verify ESD controls. The handbook acknowledges that field conditions can’t match permanent facility controls, so emphasis is placed on personnel training, portable equipment, and maintaining packaging protection as long as possible.

Practical Application of MIL-HDBK-263

The real value of MIL-HDBK-263 comes from applying its guidance to your specific situation:

Use it for program development. When building an ESD control program, the handbook provides the technical foundation for understanding why each control element matters.

Reference it for facility design. The grounding system design, workstation configuration, and material selection guidance helps create effective EPAs.

Apply it to troubleshooting. When ESD-related failures occur, the handbook’s explanation of damage mechanisms helps identify root causes.

Support training development. The technical background sections provide content for training programs that go beyond “follow the rules.”

Guide design decisions. Circuit designers benefit from the protection strategy and layout guidance.

MIL-HDBK-263 bridges the gap between ESD standards requirements and practical implementation. For engineers responsible for protecting sensitive military electronics, it’s an essential reference that transforms mandatory requirements into effective protection programs.