The XC2S200-6FGG665C is a high-performance Field Programmable Gate Array (FPGA) from the renowned AMD Xilinx Spartan-II family. This programmable logic device delivers exceptional value for engineers seeking a cost-effective alternative to traditional ASICs. With 200,000 system gates, advanced clock management capabilities, and comprehensive I/O support, the XC2S200-6FGG665C serves as an ideal solution for telecommunications, industrial automation, and consumer electronics applications.
XC2S200-6FGG665C Key Features and Benefits
The XC2S200-6FGG665C combines cutting-edge programmable logic technology with industry-leading reliability. Engineers worldwide trust this Xilinx FPGA for mission-critical applications requiring flexibility and performance.
High-Density Logic Architecture
The XC2S200-6FGG665C features a robust architecture built on proven 0.18-micron CMOS technology. This advanced fabrication process enables superior performance while maintaining low power consumption characteristics essential for modern electronic designs.
Comprehensive Memory Resources
Integrated memory capabilities make the XC2S200-6FGG665C exceptionally versatile for data-intensive applications. The device includes both distributed SelectRAM and dedicated block RAM resources, providing designers with flexible memory configuration options.
XC2S200-6FGG665C Technical Specifications
Understanding the complete specifications of the XC2S200-6FGG665C helps engineers make informed decisions during the design phase. Below are the detailed technical parameters for this Spartan-II FPGA.
Core Architecture Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
864 |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18 μm CMOS |
Memory Configuration Details
| Memory Type |
Capacity |
| Distributed RAM |
56 Kbits |
| Block RAM |
56 Kbits |
| Total RAM |
112 Kbits |
| RAM Configuration |
16 bits per LUT |
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Speed Grade |
-6 (Fastest) |
| Temperature Range |
Commercial (0°C to +85°C) |
I/O and Connectivity Features
| Feature |
Specification |
| Maximum User I/O |
284 |
| Delay-Locked Loops (DLLs) |
4 |
| Global Clock Networks |
4 |
| I/O Standards Supported |
LVTTL, LVCMOS, GTL, GTL+, HSTL, SSTL |
XC2S200-6FGG665C Architecture Overview
The XC2S200-6FGG665C utilizes a sophisticated programmable architecture that maximizes design flexibility. Each functional element works together to deliver outstanding performance for demanding applications.
Configurable Logic Block Structure
The CLB architecture forms the computational core of the XC2S200-6FGG665C. Each CLB contains two slices, with each slice featuring two 4-input Look-Up Tables (LUTs), dedicated carry logic, and storage elements. This arrangement supports both combinatorial and sequential logic implementations efficiently.
Input/Output Block Design
Surrounding the CLB array, Input/Output Blocks (IOBs) provide the interface between internal logic and external components. The IOBs in the XC2S200-6FGG665C support multiple I/O standards simultaneously, enabling seamless integration with diverse system components.
Block RAM Architecture
Two columns of dedicated block RAM flank the CLB array in the XC2S200-6FGG665C. Each 4,096-bit block RAM offers true dual-port functionality with independent read/write operations. Designers can configure these blocks as various memory types including single-port RAM, dual-port RAM, and ROM.
Delay-Locked Loop Features
Four DLLs positioned at each corner of the die provide advanced clock management capabilities. The DLLs in the XC2S200-6FGG665C eliminate clock distribution delays, enabling zero-delay clock buffering and frequency synthesis up to 4x multiplication.
XC2S200-6FGG665C Applications
The versatility of the XC2S200-6FGG665C makes it suitable for numerous applications across various industries. Its combination of high logic density and cost-effectiveness addresses diverse design requirements.
Telecommunications Equipment
Network routers, switches, and base station equipment frequently incorporate the XC2S200-6FGG665C. The high-speed I/O capabilities and abundant logic resources support complex protocol processing and data routing functions.
Industrial Control Systems
Factory automation, motor control, and process monitoring systems benefit from the XC2S200-6FGG665C’s reliability and reprogrammability. Engineers can update functionality in deployed systems without hardware modifications.
Consumer Electronics
Cost-sensitive consumer products leverage the XC2S200-6FGG665C to implement custom digital functions. Display controllers, audio processing systems, and gaming accessories represent common consumer applications.
Medical Devices
Diagnostic equipment and patient monitoring systems utilize the XC2S200-6FGG665C for signal processing and control functions. The commercial temperature rating ensures reliable operation in clinical environments.
XC2S200-6FGG665C Development Support
Comprehensive development tools streamline the design process for projects utilizing the XC2S200-6FGG665C. AMD Xilinx provides robust software support for this Spartan-II device.
Design Software Compatibility
The XC2S200-6FGG665C is fully supported by Xilinx ISE Design Suite. This integrated development environment provides synthesis, implementation, and verification capabilities. Designers can use industry-standard HDL languages including VHDL and Verilog for design entry.
Configuration Options
Multiple configuration modes accommodate various system requirements. The XC2S200-6FGG665C supports Master Serial, Slave Serial, Slave Parallel, and JTAG Boundary-Scan configuration methods. In-system programming capability enables field upgrades without physical intervention.
XC2S200-6FGG665C Ordering Information
When specifying the XC2S200-6FGG665C for procurement, understanding the part number structure ensures accurate ordering.
Part Number Breakdown
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade designation (fastest available)
- FGG: Fine-pitch Ball Grid Array package with Pb-free option
- 665: Pin count identifier
- C: Commercial temperature range (0°C to +85°C)
Package Specifications
The FGG package option indicates RoHS-compliant, lead-free solder ball composition. This environmentally responsible packaging meets international regulations for hazardous substance restrictions.
Why Choose the XC2S200-6FGG665C
The XC2S200-6FGG665C offers compelling advantages over both competing FPGAs and traditional ASIC solutions. Several factors make this device an excellent choice for new designs.
Cost-Effective Solution
Compared to mask-programmed ASICs, the XC2S200-6FGG665C eliminates non-recurring engineering costs and lengthy development cycles. Projects proceed faster with significantly reduced financial risk.
Design Flexibility
The reprogrammable nature of the XC2S200-6FGG665C allows design modifications throughout product lifecycles. Field upgrades enable feature enhancements and bug fixes without hardware recalls.
Proven Reliability
The Spartan-II family has demonstrated reliability across countless deployed systems worldwide. The mature 0.18-micron process technology delivers consistent, predictable performance.
Comprehensive Ecosystem
Access to development tools, reference designs, and technical documentation accelerates time-to-market. The established support infrastructure reduces design risks and development costs.
XC2S200-6FGG665C Summary
The XC2S200-6FGG665C represents an outstanding choice for designers seeking high-performance programmable logic at competitive pricing. With 200,000 system gates, 5,292 logic cells, and comprehensive memory resources, this Spartan-II FPGA addresses demanding application requirements across telecommunications, industrial, consumer, and medical markets. The combination of advanced architecture, flexible I/O support, and robust development tools makes the XC2S200-6FGG665C a trusted solution for modern electronic designs.
