Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA7A50T-1CSG324I: Automotive-Grade Artix-7 FPGA for Industrial Applications

Product Details

Product Overview: High-Performance Automotive FPGA Solution

The XA7A50T-1CSG324I is an automotive-grade Field-Programmable Gate Array (FPGA) from AMD Xilinx’s Artix-7 family, specifically designed for harsh industrial and automotive environments. This powerful FPGA combines 52,160 logic cells with advanced DSP capabilities, making it an ideal choice for demanding embedded systems, automotive electronics, and industrial control applications.

As part of AMD’s automotive Xilinx FPGA portfolio, this device meets stringent automotive quality standards while delivering exceptional performance and reliability for mission-critical applications.

Key Technical Specifications

Core FPGA Architecture

Specification Value
Part Number XA7A50T-1CSG324I
Product Family Artix-7 Automotive
Logic Cells (LAB/CLB) 52,160
Total Block RAM 2,700 Kbits
DSP Slices 120
Maximum Distributed RAM 400 Kbits
PLLs/Clock Management 5 PLLs

Package and Pin Configuration

Feature Specification
Package Type CSBGA-324 (Ball Grid Array)
Pin Count 324 pins
I/O Count 210 user I/Os
Package Dimensions 15mm × 15mm
Mounting Type Surface Mount

Operating Conditions

Parameter Rating
Operating Temperature -40°C to +100°C (Industrial)
Core Voltage (Vccint) 1.0V
Speed Grade -1 (Standard Performance)
Qualification AEC-Q100 Automotive Grade

Advanced Features and Capabilities

Processing Power and Performance

The XA7A50T-1CSG324I delivers exceptional computational performance through its integrated architecture:

  • 120 DSP48E1 Slices: Dedicated 25×18 multipliers with 48-bit accumulation for high-speed signal processing
  • Block RAM: 2.7 Mbits of dual-port memory organized in 36Kb blocks for efficient data buffering
  • Distributed RAM: 400 Kbits of flexible memory resources integrated within logic fabric
  • Clock Management: Five mixed-mode clock managers (MMCMs) supporting frequencies from 10 MHz to 464 MHz

Connectivity and I/O Capabilities

I/O Feature Specification
Total User I/Os 210 pins
High-Speed Transceivers 2 GTP transceivers
Transceiver Speed Up to 6.25 Gb/s per channel
Differential Pairs 102 pairs
Voltage Standards 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V

Memory Interface Support

The XA7A50T-1CSG324I supports industry-standard memory interfaces:

  • DDR3/DDR3L with data rates up to 1,066 Mb/s
  • DDR2 interface support
  • LPDDR2 for low-power applications
  • External memory controller with built-in calibration

Automotive-Grade Quality and Reliability

AEC-Q100 Qualification

This automotive-grade FPGA meets the rigorous requirements of AEC-Q100 Grade 2 qualification:

  • Extended temperature range operation (-40°C to +100°C)
  • Enhanced reliability testing including HTOL, TC, HAST
  • Stringent quality control and manufacturing processes
  • Full automotive documentation and support

Industrial Application Readiness

Reliability Feature Benefit
ECC Protection Built-in error correction for configuration memory
SEU Mitigation Soft error upset detection and correction
Thermal Management Advanced thermal monitoring and protection
Supply Monitoring Integrated power supply supervision

Target Applications and Use Cases

Automotive Electronics

  • Advanced Driver Assistance Systems (ADAS): Camera processing, sensor fusion, object detection
  • Infotainment Systems: Video processing, graphics acceleration, audio interfaces
  • Vehicle Networks: CAN, FlexRay, and automotive Ethernet gateways
  • Powertrain Control: Motor control, battery management, electric vehicle systems

Industrial Automation

  • Machine Vision: Real-time image processing and pattern recognition
  • Motion Control: Servo drives, robotics, and precision positioning
  • Protocol Conversion: Industrial bus interfaces (PROFINET, EtherCAT, Modbus)
  • Safety Systems: Functional safety implementations with redundancy

Communication Infrastructure

  • Software-Defined Radio: Wireless base stations and signal processing
  • Network Acceleration: Packet processing and traffic management
  • Test Equipment: High-speed data acquisition and analysis
  • Embedded Systems: Complex control and monitoring applications

Development and Design Support

Software and Tools

Tool/Resource Description
Vivado Design Suite Complete FPGA design environment with synthesis, implementation, and debugging
Vitis Embedded Platform Software development for embedded processor systems
IP Integrator Graphical design environment for system-level integration
Logic Analyzer Integrated debugging with ChipScope equivalent functionality

Design Resources

  • Comprehensive reference designs and application notes
  • Pre-verified IP cores for common interfaces (PCIe, Ethernet, USB)
  • Evaluation boards and development kits
  • Technical documentation and design guides
  • Community support through AMD Xilinx forums

Power Management and Efficiency

Power Consumption Profile

Operating Mode Typical Power
Active Processing Design-dependent (0.5W – 3W typical)
Standby Mode < 50mW
Configuration Minimal during JTAG/SPI programming

Power Optimization Features

  • Multiple voltage domains for optimized power distribution
  • Clock gating and dynamic frequency scaling
  • Intelligent block disabling for unused resources
  • Temperature-compensated performance scaling

Package Information and PCB Design

BGA Package Considerations

The CSBGA-324 package requires careful PCB design attention:

  • Ball Pitch: 0.8mm between centers
  • Recommended PCB Stack: Minimum 6-layer design for signal integrity
  • Thermal Considerations: Copper heat spreading and thermal vias required
  • Escape Routing: Microvia technology recommended for dense routing

Design Guidelines

Design Aspect Recommendation
Power Planes Separate analog and digital ground planes
Decoupling Multiple capacitor values (0.1µF, 1µF, 10µF) near power pins
Signal Integrity Controlled impedance for high-speed signals
Thermal Management Heat sink or active cooling for sustained operation

Comparison: XA7A50T vs Alternative Artix-7 Devices

Feature XA7A25T XA7A50T XA7A75T
Logic Cells 23,360 52,160 75,520
Block RAM 1,800 Kbits 2,700 Kbits 4,100 Kbits
DSP Slices 80 120 180
Transceivers 2 2 8
Best For Cost-sensitive Balanced performance High-end processing

Ordering and Availability Information

Part Number Breakdown

XA7A50T-1CSG324I decodes as:

  • XA: Automotive-grade qualification
  • 7A50T: Artix-7, 50,000 logic cell tier with transceivers
  • -1: Speed grade (standard performance)
  • CSG324: CSBGA package, 324 pins
  • I: Industrial temperature range (-40°C to +100°C)

Package Options

While this article focuses on the CSG324 package, the XA7A50T is available in multiple package options:

  • CSG324: 15×15mm, 210 I/O (Featured)
  • FTG256: Fine-pitch BGA, 170 I/O
  • FGG484: Larger package, 250 I/O

Why Choose the XA7A50T-1CSG324I?

Key Advantages

  1. Automotive-Grade Reliability: AEC-Q100 qualified for demanding automotive applications
  2. Balanced Performance: Optimal logic density and DSP resources for mid-range applications
  3. Cost-Effective: Lower cost per logic cell compared to higher-end devices
  4. Flexible I/O: 210 user I/Os with multi-standard voltage support
  5. Proven Architecture: Based on mature, well-documented Artix-7 technology

Ideal For Designers Who Need

  • Reliable FPGA solution for automotive or industrial environments
  • Moderate logic capacity with strong DSP performance
  • Compact footprint with adequate I/O resources
  • Established design ecosystem and tool support
  • Long-term product availability and automotive qualification

Technical Support and Documentation

Available Resources

  • Artix-7 FPGAs Data Sheet (DS181)
  • Automotive Artix-7 FPGAs Data Sheet (DS181A)
  • Packaging and Pinout Specifications
  • Power Supply Design Guidelines
  • PCB Design and Layout Recommendations

Getting Started

For engineers beginning development with the XA7A50T-1CSG324I:

  1. Download the latest Vivado Design Suite from AMD Xilinx
  2. Review automotive-specific design considerations
  3. Obtain evaluation boards or development kits
  4. Access reference designs for your target application
  5. Join the AMD Xilinx developer community for support

Conclusion: A Robust FPGA for Demanding Applications

The XA7A50T-1CSG324I represents an excellent choice for designers requiring automotive-grade reliability combined with solid processing capabilities. Whether you’re developing advanced driver assistance systems, industrial automation equipment, or communication infrastructure, this Xilinx FPGA delivers the performance, features, and quality needed for successful product deployment.

With its 52,160 logic cells, 120 DSP slices, and extensive I/O capabilities in a compact 15×15mm package, the XA7A50T-1CSG324I strikes an optimal balance between performance, cost, and board space—making it an ideal foundation for next-generation automotive and industrial designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.