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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3190A-3PQ160C: High-Performance Field Programmable Gate Array FPGA Solution

Product Details

Overview of XC3190A-3PQ160C FPGA

The XC3190A-3PQ160C is a high-performance Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx Inc.), belonging to the renowned XC3000A family of programmable logic devices. This commercial-grade FPGA delivers exceptional programmable logic capabilities with 6,000 usable gates and 320 configurable logic blocks, making it an ideal solution for complex digital design applications requiring flexible, reprogrammable architecture.

As part of the legacy Xilinx FPGA portfolio, the XC3190A-3PQ160C continues to serve critical applications in telecommunications, industrial control systems, and legacy system maintenance where proven reliability and specific performance characteristics are essential.

Key Technical Specifications

Core Performance Features

Specification Value
Part Number XC3190A-3PQ160C
Manufacturer AMD (Xilinx Inc.)
FPGA Family XC3000A/L Series
Logic Gates 6,000 gates (equivalent)
Configurable Logic Blocks (CLBs) 320 CLBs
Logic Cells 320 cells
Speed Grade -3 (high-performance grade)
Operating Frequency Up to 227 MHz
Package Type 160-Pin BQFP (Bumpered Quad Flat Pack)
I/O Pins 138 user I/O pins
Supply Voltage 5V nominal
Operating Temperature Commercial: 0°C to +70°C
Technology CMOS static memory technology

Detailed Product Features

Architecture and Design Capabilities

The XC3190A-3PQ160C features Xilinx’s proven programmable architecture comprising three essential configurable elements:

Configuration Program Store: Internal static memory cells that determine logic functions and interconnections, enabling unlimited reprogrammability for design iteration and in-system logic modifications.

I/O Blocks (IOBs): Perimeter array of input/output blocks providing flexible interface capabilities with TTL or CMOS input thresholds, supporting various signal standards for seamless system integration.

Configurable Logic Blocks (CLBs): Core array of 320 CLBs offering extensive register, combinatorial, and I/O capabilities, enabling implementation of complex digital functions ranging from simple gates to sophisticated state machines.

Interconnect Resources: Enhanced routing architecture with high fan-out signal distribution and low-skew clock networks, supporting internal 3-state bus capabilities for efficient data transfer.

Performance Characteristics

Performance Metric Specification
Maximum Toggle Rate 227 MHz guaranteed flip-flop toggle rate
Propagation Delay Low logic delays optimized for speed grade -3
System Clock Speed Supports system clock rates exceeding 85 MHz
Power Consumption Low quiescent and active power consumption
Output Current 8 mA sink current, 8 mA source current

Package and Pin Configuration

160-Pin BQFP Package Details

Package Feature Description
Package Type BQFP (Bumpered Quad Flat Pack)
Total Pins 160 pins
User I/O Available 138 I/O pins
Mounting Type Surface Mount Technology (SMT)
Form Factor Quad flat pack with bumpered corners
Pin Pitch Standard BQFP spacing

The 160-pin BQFP package provides excellent thermal characteristics and robust mechanical protection, making it suitable for high-reliability applications requiring secure board-level connections.

Application Areas and Use Cases

Industrial Control Systems

The XC3190A-3PQ160C excels in industrial automation applications requiring programmable control logic, sensor interfacing, and real-time signal processing capabilities.

Telecommunications Equipment

With high-speed performance and flexible I/O configuration, this FPGA serves legacy telecommunications infrastructure, protocol conversion, and signal routing applications.

Digital Signal Processing

The device’s 320 CLBs enable implementation of custom DSP algorithms, filter designs, and data acquisition systems requiring configurable processing pipelines.

Legacy System Maintenance

For systems designed with XC3000A family devices, the XC3190A-3PQ160C provides critical replacement components, ensuring continued operation of existing hardware platforms.

Design and Development Support

Compatible Development Tools

Tool Category Supported Software
Schematic Capture XACT development system
Place and Route Auto place-and-route capabilities
Simulation Logic and timing simulation tools
Verification In-circuit emulation options
Design Editor Interactive design optimization
Modern Tools ISE Design Suite (for legacy support)

Design Advantages

Unlimited Reprogrammability: Modify designs in-system without hardware changes, enabling rapid prototyping and field updates.

Standard Off-the-Shelf Availability: Factory pre-tested devices with proven reliability record, reducing project risk and time-to-market.

Architecture Compatibility: Pin-out and software compatible with other XC3000 family members, facilitating design migration and scalability.

Comprehensive Documentation: Extensive datasheets, application notes, and design guidelines available for XC3000A series implementation.

Ordering Information and Availability

Part Number Breakdown

XC3190A-3PQ160C nomenclature explained:

  • XC3190A: Device family and gate count designation
  • -3: Speed grade (high-performance variant)
  • PQ160: Package type (BQFP) and pin count
  • C: Commercial temperature range (0°C to +70°C)

Sourcing Considerations

As a legacy component, the XC3190A-3PQ160C availability varies by distributor and market conditions. Key sourcing factors include:

  • Stock availability through authorized distributors and specialty obsolete component suppliers
  • Condition verification (new original stock vs. refurbished units)
  • Lead time considerations for volume orders
  • Authenticity certification from reputable sources

Competitive Advantages

Why Choose XC3190A-3PQ160C

Proven Technology: Decades of field-proven performance in demanding applications worldwide.

High Integration Density: 6,000 gates eliminate multiple discrete logic components, reducing board space and system complexity.

Flexible Architecture: Configurable logic and I/O resources adapt to changing system requirements without hardware redesign.

Cost-Effective Solution: Avoids NRE costs, time delays, and risks associated with conventional masked gate arrays.

Reliable Supply: Continued availability through specialized distributors ensures long-term system support.

Technical Comparison Table

XC3190A vs. Similar Devices

Feature XC3190A-3PQ160C XC3090A-7PQ160C XC3195A-3PQ160C
Logic Gates 6,000 4,000 7,500
CLB Count 320 256 400
Speed Grade -3 (fast) -7 (slower) -3 (fast)
I/O Pins 138 138 138
Package 160-BQFP 160-BQFP 160-BQFP
Voltage 5V 5V 5V

Quality and Reliability

Manufacturing Standards

All XC3190A-3PQ160C devices undergo rigorous factory testing:

  • 100% functional testing at production
  • Parametric validation across temperature range
  • Quality assurance per Xilinx/AMD manufacturing standards
  • RoHS compliance status varies by production date

Reliability Features

  • Static memory configuration for excellent data retention
  • ESD protection on all I/O pins
  • Proven CMOS technology with low failure rates
  • Suitable for critical applications requiring high uptime

Installation and Implementation Guidelines

PCB Design Recommendations

When integrating the XC3190A-3PQ160C into your design:

  1. Power Supply Decoupling: Place 0.1μF ceramic capacitors near each power pin
  2. Signal Integrity: Maintain controlled impedance for high-speed signals
  3. Thermal Management: Ensure adequate airflow for ambient temperatures
  4. Ground Plane: Implement solid ground plane for noise reduction
  5. Configuration Interface: Design proper JTAG or serial configuration circuits

Programming and Configuration

The device supports multiple configuration modes:

  • Master serial mode
  • Slave serial mode
  • Peripheral mode
  • JTAG boundary scan for testing and programming

Frequently Asked Questions

Q: Is the XC3190A-3PQ160C still in production? A: This is a legacy/obsolete component. New stock availability depends on distributor inventory and surplus markets.

Q: What voltage does the XC3190A-3PQ160C require? A: The device operates at 5V nominal supply voltage (VCC).

Q: Can I replace an XC3190A with a modern FPGA? A: While modern alternatives exist, direct replacement requires design migration due to different architectures and I/O standards.

Q: What is the maximum operating frequency? A: The -3 speed grade supports toggle rates up to 227 MHz, with system clock speeds exceeding 85 MHz.

Q: Where can I find the complete datasheet? A: The official XC3000A family datasheet is available through AMD’s documentation portal and electronic component distributors.

Environmental and Compliance

  • RoHS Status: Varies by manufacturing date; verify with supplier
  • Operating Temperature: 0°C to +70°C (commercial grade)
  • Storage Temperature: -65°C to +150°C
  • Moisture Sensitivity: MSL (Moisture Sensitivity Level) per JEDEC standards

Conclusion

The XC3190A-3PQ160C represents a mature, reliable FPGA solution from AMD’s (Xilinx) legendary XC3000A family. With 6,000 gates, 320 configurable logic blocks, and high-speed performance characteristics, this device continues to serve critical applications in industrial, telecommunications, and legacy system maintenance markets. Its proven architecture, comprehensive development tool support, and availability through specialized distributors make it an excellent choice for systems requiring specific XC3000A family characteristics.

For current FPGA projects, consider evaluating modern AMD Xilinx alternatives while maintaining the XC3190A-3PQ160C for legacy system support and proven design continuity.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.