Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3195-3PG223C: High-Performance Field Programmable Gate Array for Advanced Digital Design

Product Details

Product Overview: XC3195-3PG223C FPGA

The XC3195-3PG223C is a sophisticated Field Programmable Gate Array manufactured by Rochester Electronics LLC, originally designed by Xilinx. This versatile FPGA belongs to the acclaimed XC3000 Series and delivers exceptional performance for complex digital circuit applications. Engineers and designers seeking reliable programmable logic solutions will find this component ideal for telecommunications, industrial control systems, and embedded computing applications.

Technical Specifications and Features

Core Architecture Specifications

The XC3195-3PG223C represents a pinnacle of Logic Cell Array technology, offering designers a comprehensive platform for implementing custom digital logic. This CMOS-based FPGA integrates configurable logic blocks with programmable interconnects, enabling flexible circuit design and rapid prototyping.

Specification Details
Part Number XC3195-3PG223C
Manufacturer Rochester Electronics LLC (Original: Xilinx)
Product Family XC3000 Series FPGAs
Package Type PG223 (223-pin Plastic Grid Array)
Speed Grade -3 (Standard Performance)
Technology CMOS Logic Cell Array (LCA)
Operating Temperature Commercial Grade (0°C to +70°C)
Mounting Type Surface Mount Technology (SMT)

Key Features and Capabilities

The XC3195-3PG223C FPGA incorporates several advanced features that make it suitable for demanding applications:

  • High-Density Logic Integration: Thousands of configurable logic blocks provide extensive design flexibility
  • Programmable Interconnect Architecture: Flexible routing resources enable efficient signal distribution
  • Input/Output Block Configuration: Multiple I/O standards support for versatile interface requirements
  • User-Programmable Design: Reconfigurable architecture allows for design iterations and updates
  • Commercial Temperature Range: Reliable operation across standard industrial environments

Package Information and Physical Characteristics

Parameter Value
Package Style PG (Plastic Grid Array)
Total Pin Count 223 pins
Mounting Technology Surface Mount
Moisture Sensitivity Level MSL 3
Lead-Free Status RoHS Compliant Options Available

Applications and Use Cases

Industrial Applications

The XC3195-3PG223C excels in industrial automation environments where programmable logic provides critical control functions. Manufacturing equipment, process control systems, and robotics platforms benefit from the FPGA’s adaptable architecture.

Telecommunications Systems

Digital signal processing applications in telecommunications infrastructure leverage the high-speed logic capabilities of this FPGA. Protocol converters, network switches, and communication interfaces utilize its flexible design architecture.

Embedded Computing Solutions

Embedded systems requiring custom logic implementation find this Xilinx FPGA particularly valuable for hardware acceleration, peripheral interfacing, and real-time data processing tasks.

Testing and Measurement Equipment

Laboratory instrumentation and automated test equipment benefit from the reconfigurable nature of this FPGA, allowing for adaptive measurement algorithms and flexible signal processing.

Performance Characteristics

Speed Grade Analysis

Performance Metric Specification
Speed Grade -3 (Standard Commercial)
Maximum Operating Frequency Device-dependent, see datasheet
Propagation Delay Varies by configuration
Setup and Hold Times Configuration-specific

Power Consumption

The XC3195-3PG223C demonstrates efficient power characteristics suitable for battery-operated and power-conscious applications. Actual consumption depends on utilization, switching frequency, and implemented logic complexity.

Design and Development Resources

Development Tools Compatibility

Engineers working with the XC3195-3PG223C can utilize comprehensive development environments including:

  • Xilinx XACT Development System: Original design suite for schematic capture and place-and-route
  • Modern EDA Tools: Compatible with contemporary FPGA design software
  • Simulation Environments: Support for logic and timing verification
  • Programming Solutions: In-circuit configuration and debugging capabilities

Integration Guidelines

Successful implementation of the XC3195-3PG223C requires attention to several design considerations:

  1. Power Supply Design: Proper decoupling and voltage regulation for core and I/O supplies
  2. Configuration Storage: External memory for bitstream storage and initialization
  3. Clock Distribution: Clean clock signals with appropriate buffering
  4. Signal Integrity: Controlled impedance routing for high-speed signals
  5. Thermal Management: Adequate cooling for high-utilization applications

Comparison Table: XC3195 Variants

Part Number Speed Grade Package Temperature Range Application Focus
XC3195-3PG223C -3 (Standard) PG223 Commercial (0°C to 70°C) General Purpose
XC3195-4PG223C -4 (Enhanced) PG223 Commercial High-Performance
XC3195-5PG223C -5 (Premium) PG223 Commercial Maximum Speed

Quality and Reliability

Manufacturing Standards

Rochester Electronics LLC maintains stringent quality control processes ensuring each XC3195-3PG223C meets original equipment manufacturer specifications. Components undergo comprehensive testing including:

  • Electrical parameter verification
  • Functional logic testing
  • Temperature cycling validation
  • Visual inspection and quality assurance

Long-Term Availability

As part of Rochester Electronics’ semiconductor continuance program, the XC3195-3PG223C remains available for legacy system maintenance and long-lifecycle applications where original Xilinx production has ceased.

Ordering Information and Availability

Package Marking and Identification

Each XC3195-3PG223C device features clear part number marking for traceability and inventory management. Date codes and lot identification ensure proper revision tracking.

Storage and Handling Recommendations

To maintain component reliability:

  • Store in moisture-barrier packaging until ready for use
  • Follow ESD precautions during handling and assembly
  • Observe baking requirements for moisture-sensitive devices
  • Use proper soldering profiles for surface mount assembly

Frequently Asked Questions

What makes the XC3195-3PG223C suitable for legacy system support?

This FPGA provides critical replacement capability for systems originally designed with Xilinx XC3000 Series devices, ensuring continued operation of equipment where redesign would be impractical or cost-prohibitive.

Can the XC3195-3PG223C replace earlier XC3195 variants?

While pin-compatible within the same package type, designers should verify speed grade requirements and timing specifications to ensure the -3 speed grade meets application performance needs.

What development tools support XC3195-3PG223C programming?

Original Xilinx XACT tools provide comprehensive support, while modern FPGA development environments may offer compatibility through legacy device libraries.

Is the XC3195-3PG223C suitable for new designs?

While available for new applications, engineers should consider current-generation FPGAs for designs requiring extended lifecycle support and access to contemporary development tools.

Conclusion

The XC3195-3PG223C Field Programmable Gate Array represents a proven solution for programmable logic applications across industrial, telecommunications, and embedded systems domains. Its robust architecture, comprehensive I/O capabilities, and reliable performance characteristics make it valuable for both legacy system maintenance and specialized new applications. Engineers seeking a dependable FPGA with established design methodologies will find the XC3195-3PG223C an excellent choice for their programmable logic requirements.

For comprehensive information about implementing Xilinx FPGA solutions in your next project, explore advanced design techniques and application examples from industry experts.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.