The XC2S200-6FGG650C is a powerful field-programmable gate array (FPGA) from AMD’s proven Spartan-II family, delivering exceptional performance and reliability for demanding digital design applications. This versatile programmable logic device combines 200,000 system gates with advanced architecture, making it an ideal choice for telecommunications, industrial automation, and embedded system designs. Engineers seeking a cost-effective alternative to mask-programmed ASICs will find the XC2S200-6FGG650C offers the flexibility of unlimited reprogrammability with professional-grade performance. Explore our complete selection of Xilinx FPGA solutions for your next project.
XC2S200-6FGG650C Technical Specifications
The XC2S200-6FGG650C delivers comprehensive technical specifications designed to meet the most demanding application requirements. This AMD Spartan-II FPGA provides engineers with substantial programmable resources for implementing complex digital circuits.
Core Architecture and Logic Resources
The XC2S200-6FGG650C incorporates AMD’s proven Spartan-II architecture with the following core specifications:
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Configurable Logic Blocks (CLBs) |
1,176 |
| Maximum User I/Os |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Delay-Locked Loops (DLLs) |
4 |
Speed Grade and Performance Characteristics
The “-6” speed grade designation indicates enhanced timing performance with optimized signal propagation delays:
- Maximum system frequency: Up to 263 MHz
- Low propagation delays for time-critical applications
- Optimized routing architecture for high-speed designs
- Dedicated carry logic for high-speed arithmetic operations
Package Information
| Specification |
Details |
| Package Type |
FGG650 Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
650 pins |
| Ball Pitch |
1.0 mm |
| Mounting Style |
Surface Mount |
| Lead-Free Option |
Available (Pb-free packaging) |
XC2S200-6FGG650C Key Features and Benefits
Advanced Memory Architecture
The XC2S200-6FGG650C features AMD’s SelectRAM hierarchical memory system:
- Distributed RAM: 16 bits per Look-Up Table (LUT) for fast, shallow memory structures
- Block RAM: Configurable 4K-bit synchronous dual-ported RAM modules
- Flexible Configuration: Memory blocks support single-port RAM, dual-port RAM, and ROM configurations
- Fast External RAM Interface: Optimized connectivity for high-bandwidth memory applications
Flexible I/O Standards Support
The XC2S200-6FGG650C supports multiple I/O signaling standards for seamless system integration:
- LVTTL and LVCMOS outputs
- PCI-compliant interfaces
- GTL and GTL+ support
- Multiple voltage bank configurations
- Programmable slew rate control
- Configurable pull-up and pull-down resistors
System-Level Integration Features
- Full PCI Compliance: Direct compatibility with PCI bus specifications
- VersaRing Routing: Enhanced pin-swapping and pin-locking capabilities
- Boundary Scan (JTAG): Full IEEE 1149.1 support for in-system testing
- Low-Power Architecture: Segmented routing reduces dynamic power consumption
XC2S200-6FGG650C Electrical Characteristics
Power Supply Requirements
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V (2.375V – 2.625V) |
| I/O Voltage (VCCO) |
2.5V or 3.3V (bank-dependent) |
| Process Technology |
0.18 µm CMOS |
Operating Temperature Ranges
| Grade |
Temperature Range |
| Commercial (C) |
0°C to +85°C |
| Industrial (I) |
-40°C to +100°C |
XC2S200-6FGG650C Application Areas
The XC2S200-6FGG650C excels in diverse application domains:
Telecommunications and Networking
- Protocol conversion and bridging
- Data packet processing
- Network interface controllers
- Base station equipment
- Fiber optic communication systems
Industrial Automation
- Programmable logic controllers (PLCs)
- Motor drive control systems
- Process automation equipment
- Machine vision processing
- Industrial robotics interfaces
Embedded Systems
- Digital signal processing (DSP) applications
- Custom peripheral interfaces
- Co-processor implementations
- Real-time control systems
- Prototyping and development platforms
Consumer Electronics
- Set-top boxes
- Display controllers
- Audio/video processing
- Gaming peripherals
- Smart home devices
XC2S200-6FGG650C Development Tools and Resources
Software Development Environment
The XC2S200-6FGG650C is fully supported by the AMD ISE Design Suite, providing:
- HDL design entry (VHDL and Verilog)
- Schematic capture
- Synthesis and implementation tools
- Timing analysis and verification
- Bitstream generation and programming
Design Resources
- Comprehensive datasheets with electrical specifications
- Application notes and design guidelines
- Reference designs and IP cores
- PCB layout recommendations
- Configuration memory solutions
XC2S200-6FGG650C Configuration Options
Configuration Modes
The XC2S200-6FGG650C supports multiple configuration methods:
| Mode |
Description |
| Serial (Master/Slave) |
Low pin-count configuration using serial PROMs |
| Parallel (SelectMAP) |
High-speed 8-bit parallel configuration |
| JTAG/Boundary Scan |
In-system programming and debugging |
Configuration Features
- Automatic configuration on power-up
- In-system reconfigurability for field updates
- Full readback capability for verification
- CRC error detection
- Multi-boot support for design redundancy
Why Choose the XC2S200-6FGG650C FPGA
Cost-Effective ASIC Alternative
The XC2S200-6FGG650C eliminates the high NRE costs, lengthy development cycles, and risks associated with conventional mask-programmed ASICs. Engineers benefit from:
- Zero NRE Costs: No mask charges or minimum order quantities
- Rapid Prototyping: Immediate design verification and iteration
- Field Upgradability: Hardware updates without board modifications
- Reduced Time-to-Market: Shorter development cycles versus custom silicon
Proven Reliability
Built on AMD’s mature 0.18 µm CMOS process technology, the XC2S200-6FGG650C delivers:
- Excellent yield and reliability metrics
- Extended product lifecycle support
- Comprehensive quality certifications
- Global distributor availability
Design Flexibility
- Unlimited reprogramming cycles
- Hardware-level customization
- IP reuse across projects
- Scalability within the Spartan-II family
XC2S200-6FGG650C Ordering Information
Part Number Breakdown
XC2S200-6FGG650C decodes as follows:
| Segment |
Meaning |
| XC2S |
Spartan-II FPGA Family |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade 6 (High Performance) |
| FGG |
Fine-Pitch Ball Grid Array (Lead-Free) |
| 650 |
650-Pin Package |
| C |
Commercial Temperature Grade |
Availability
Contact authorized AMD/Xilinx distributors for current pricing, lead times, and volume discount programs. The XC2S200-6FGG650C is available through major electronic component distributors worldwide.
Conclusion
The XC2S200-6FGG650C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its robust Spartan-II architecture, comprehensive I/O capabilities, and extensive development ecosystem make it a trusted choice for engineers developing next-generation electronic systems across telecommunications, industrial, automotive, and consumer applications. Whether you’re building prototypes or production systems, the XC2S200-6FGG650C provides the flexibility and performance needed for successful programmable logic implementations.
