Overview of XC3195-3PQ208C Field Programmable Gate Array
The XC3195-3PQ208C is a sophisticated Field Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD Xilinx), belonging to the renowned XC3000 Series FPGAs family. This high-density programmable logic device offers exceptional performance for complex digital circuit implementations across telecommunications, industrial control, aerospace, and embedded system applications.
As part of Xilinx’s legacy Logic Cell Array (LCA) architecture, the XC3195-3PQ208C delivers robust programmability, reliable signal processing, and versatile logic management capabilities that make it an ideal choice for engineers requiring customizable hardware solutions.
Technical Specifications
Key Features and Parameters
| Specification |
Value |
| Part Number |
XC3195-3PQ208C |
| Manufacturer |
Xilinx (AMD Xilinx) |
| Product Family |
XC3000 Series FPGAs |
| Package Type |
PQFP (Plastic Quad Flat Package) |
| Pin Count |
208 Pins |
| Speed Grade |
-3 (Commercial) |
| Technology |
CMOS Logic Cell Array (LCA) |
| Operating Temperature |
0°C to +70°C (Commercial) |
| Supply Voltage |
5V |
| Product Status |
Available through Rochester Electronics |
Logic Resources and Architecture
| Logic Element |
Specification |
| Configurable Logic Blocks (CLBs) |
High-density array configuration |
| I/O Blocks (IOBs) |
Perimeter-based architecture |
| Programmable Interconnect |
Flexible routing resources |
| Configuration Memory |
Non-volatile program store |
| Logic Density |
Advanced for XC3000 family |
XC3195-3PQ208C Package Information
PQFP-208 Package Dimensions and Characteristics
| Package Feature |
Details |
| Package Style |
Quad Flat Package |
| Total Pins |
208 |
| Mounting Type |
Surface Mount |
| Lead Pitch |
0.5mm typical |
| Thermal Performance |
Enhanced heat dissipation |
| Board Compatibility |
Standard PCB integration |
The 208-pin PQFP encapsulation ensures:
- Compact footprint for space-constrained designs
- Extensive I/O connectivity options
- Reliable electrical connections
- Efficient thermal management
- Industry-standard manufacturing compatibility
XC3195-3PQ208C Applications
Primary Use Cases
The XC3195-3PQ208C FPGA excels in diverse application scenarios:
Telecommunications Equipment
- Digital signal processing
- Protocol conversion systems
- Network interface controllers
- Communication infrastructure
Industrial Control Systems
- Programmable logic controllers (PLCs)
- Factory automation
- Process control applications
- Motor control systems
Aerospace and Defense
- Avionics systems
- Radar signal processing
- Mission-critical applications
- Secure communication systems
Embedded Computing
- Custom hardware acceleration
- Real-time data processing
- IoT edge computing devices
- Medical instrumentation
Performance Characteristics
Speed and Timing Parameters
| Parameter |
Specification |
| Speed Grade |
-3 (Standard commercial speed) |
| Clock Frequency |
Optimized for high-speed operations |
| Propagation Delay |
Low latency design |
| Setup/Hold Times |
Meets stringent timing requirements |
Electrical Characteristics
| Electrical Parameter |
Value |
| Supply Voltage (VCC) |
5V ±5% |
| Input Voltage (VIH) |
2.0V minimum |
| Input Voltage (VIL) |
0.8V maximum |
| Output Drive |
Configurable per I/O |
| Power Consumption |
Application-dependent |
Programming and Development
Design Tools Compatibility
The XC3195-3PQ208C is fully compatible with Xilinx development environments:
- XACT Development System: Legacy design entry and place-and-route
- ISE Design Suite: Comprehensive FPGA development platform
- Schematic Capture: Visual design entry methods
- Simulation Tools: Logic and timing verification
- In-Circuit Emulation: Real-time debugging capabilities
Programming Methods
| Programming Feature |
Description |
| Configuration Mode |
Serial or parallel programming |
| Bitstream Storage |
External PROM or direct download |
| Reconfigurability |
Multiple reprogramming cycles |
| Security Features |
Design protection options |
Quality and Reliability
Manufacturing Standards
The XC3195-3PQ208C is manufactured under stringent quality control:
- ISO-certified production facilities
- Rigorous electrical testing protocols
- Burn-in testing for enhanced reliability
- Traceability and documentation
- ESD protection standards compliance
Reliability Metrics
| Reliability Factor |
Performance |
| MTBF (Mean Time Between Failures) |
High reliability rating |
| Operating Life |
Extended operational lifespan |
| Temperature Cycling |
Qualified for demanding environments |
| Moisture Sensitivity |
MSL compliant packaging |
Comparison with Related Xilinx FPGA Devices
XC3000 Series Family Comparison
| Model |
Package |
Pins |
Key Difference |
| XC3195-3PQ208C |
PQFP |
208 |
Standard commercial grade |
| XC3195A-3PQ208C |
PQFP |
208 |
Enhanced performance variant |
| XC3195-5PQ208I |
PQFP |
208 |
Industrial temperature range |
| XC3195-2PC84C |
PLCC |
84 |
Reduced I/O configuration |
Procurement and Availability
Supply Chain Information
| Distribution Channel |
Availability |
| Primary Distributor |
Rochester Electronics LLC |
| Authorized Resellers |
Multiple global distributors |
| Lead Time |
Contact distributor for current stock |
| Minimum Order Quantity |
Varies by supplier |
| Packaging Options |
Tube, tray, or tape and reel |
Part Numbering Explanation
XC3195-3PQ208C Breakdown:
- XC: Xilinx product prefix
- 3195: Device family and logic capacity
- -3: Speed grade (commercial)
- PQ: Package type (Plastic Quad)
- 208: Pin count
- C: Commercial temperature range
Installation and PCB Design Guidelines
Recommended PCB Layout Practices
For optimal XC3195-3PQ208C performance:
- Power Distribution: Implement robust power planes with adequate decoupling
- Signal Integrity: Maintain proper trace impedance and length matching
- Thermal Management: Ensure adequate copper pour for heat dissipation
- Ground Planning: Use solid ground planes to minimize noise
- Bypass Capacitors: Place close to VCC pins (0.1µF and 10µF recommended)
Soldering Recommendations
| Soldering Parameter |
Specification |
| Reflow Profile |
Standard lead-free compatible |
| Peak Temperature |
260°C maximum |
| Time Above Liquidus |
60-90 seconds |
| Ramp Rate |
3°C/second maximum |
Technical Support and Resources
Documentation Available
- Complete datasheet with AC/DC specifications
- Application notes for common implementations
- Reference designs and example projects
- Programming guides and tutorials
- Migration guidelines from legacy devices
Engineering Support
Xilinx (AMD) and authorized distributors provide:
- Technical consultation services
- Design review assistance
- Troubleshooting support
- Training programs and workshops
- Community forums and knowledge bases
Environmental Compliance
Regulatory Standards
| Standard |
Compliance Status |
| RoHS |
Varies by manufacturing date |
| REACH |
Compliant |
| WEEE |
Compliant |
| Conflict Minerals |
Reporting available |
Why Choose XC3195-3PQ208C?
Competitive Advantages
Proven Technology: Decades of field-proven reliability in mission-critical applications
Design Flexibility: Fully programmable architecture enables rapid prototyping and iterative design improvements
Cost-Effective: Mature technology node offers competitive pricing for volume production
Supply Security: Rochester Electronics ensures long-term availability beyond original manufacturing lifecycle
Broad Ecosystem: Extensive third-party IP cores, development boards, and support resources
Migration Path: Clear upgrade paths to modern Xilinx FPGA families when needed
Frequently Asked Questions
Q: Is the XC3195-3PQ208C still in production? A: While Xilinx has moved to newer architectures, Rochester Electronics manufactures and distributes the XC3195-3PQ208C for legacy system support and new designs requiring this specific device.
Q: What development tools support the XC3195-3PQ208C? A: The device is supported by Xilinx ISE Design Suite and the legacy XACT development system. Modern designs should verify tool compatibility.
Q: Can the XC3195-3PQ208C be programmed multiple times? A: Yes, as an SRAM-based FPGA, it supports unlimited reconfiguration cycles, making it ideal for development and field updates.
Q: What is the difference between commercial (-3) and industrial (-5) grades? A: The speed grade (-3 vs -5) indicates timing performance, while the temperature suffix (C vs I) determines the operating temperature range.
Conclusion
The XC3195-3PQ208C represents a reliable, high-performance FPGA solution for engineers requiring proven programmable logic technology. Its robust architecture, extensive I/O capabilities, and continued availability through Rochester Electronics make it an excellent choice for both legacy system maintenance and new designs where its specifications align with application requirements.
Whether you’re developing telecommunications equipment, industrial control systems, aerospace applications, or embedded computing solutions, the XC3195-3PQ208C delivers the programmability, performance, and reliability needed for success.
For procurement inquiries, technical specifications, or application support for the XC3195-3PQ208C, contact authorized distributors or visit Rochester Electronics for comprehensive product information and availability.
