The XC2S200-6FGG642C is a high-performance field-programmable gate array (FPGA) from AMD’s proven Spartan-II family. This powerful programmable logic device delivers 200,000 system gates, 5,292 logic cells, and advanced features that make it an excellent choice for industrial automation, telecommunications, and embedded systems applications. With its lead-free (Pb-free) FGG642 package and commercial temperature rating, the XC2S200-6FGG642C provides exceptional reliability for demanding electronic design projects.
Key Features of the XC2S200-6FGG642C FPGA
The XC2S200-6FGG642C stands out in the Xilinx FPGA market with its comprehensive feature set designed for cost-effective, high-volume applications.
Logic Resources and System Gates
The XC2S200-6FGG642C integrates substantial programmable logic resources:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
On-Chip Memory Architecture
The XC2S200-6FGG642C features a hierarchical SelectRAM memory system optimized for diverse application requirements:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks × 4,096 bits) |
| Block RAM Configuration |
Single-port and dual-port modes |
The configurable 4K-bit block RAM modules support multiple aspect ratios from 4096×1 to 256×16, providing flexible data width conversion for various interface requirements.
Technical Specifications for XC2S200-6FGG642C
Speed Grade and Performance
The “-6” speed grade designation indicates higher performance operation, enabling system clock rates up to 200 MHz for demanding signal processing and control applications.
Power Supply Requirements
| Parameter |
Voltage |
| Core Logic (VCCINT) |
2.5V |
| I/O Banks (VCCO) |
1.5V, 2.5V, or 3.3V |
| Process Technology |
0.18 micron CMOS |
Temperature and Package Information
| Attribute |
Specification |
| Temperature Range |
Commercial (0°C to +85°C) |
| Package Type |
Fine-Pitch Ball Grid Array (FGG) |
| Lead-Free Compliance |
Yes (Pb-free) |
| RoHS Status |
Compliant |
I/O Standards Supported by XC2S200-6FGG642C
The XC2S200-6FGG642C supports 16 high-performance interface standards, providing versatile connectivity options for modern electronic systems:
Single-Ended Standards
- LVTTL (2-24 mA drive strength)
- LVCMOS 2.5V
- PCI 3.3V/5V (33 MHz and 66 MHz compliant)
Differential and High-Speed Standards
- GTL and GTL+
- HSTL Class I, III, and IV
- SSTL2 Class I and II
- SSTL3 Class I and II
- CTT
- AGP-2X
I/O Banking Configuration
The device organizes I/O pins into eight independent banks, each with configurable VCCO and VREF voltages. This architecture enables mixed-voltage interfacing within a single design while maintaining signal integrity.
Clock Distribution and DLL Features
Delay-Locked Loop Capabilities
The XC2S200-6FGG642C includes four fully digital Delay-Locked Loops (DLLs) positioned at each corner of the die:
| DLL Feature |
Capability |
| Clock Deskew |
Zero propagation delay |
| Phase Outputs |
0°, 90°, 180°, 270° |
| Clock Multiplication |
2× frequency doubling |
| Clock Division |
÷1.5, ÷2, ÷2.5, ÷3, ÷4, ÷5, ÷8, ÷16 |
| Global Clock Networks |
4 primary, 24 secondary |
Clock Distribution Benefits
- Eliminates clock distribution delay throughout the device
- Provides low-skew global clock routing
- Supports board-level clock deskewing (clock mirroring)
- Enables startup sequence synchronization with DLL lock
Configuration Options for XC2S200-6FGG642C
Supported Configuration Modes
| Mode |
Data Width |
CCLK Direction |
| Master Serial |
1-bit |
Output |
| Slave Serial |
1-bit |
Input |
| Slave Parallel |
8-bit |
Input |
| Boundary Scan (JTAG) |
1-bit |
N/A |
Configuration File Size
The XC2S200-6FGG642C requires approximately 1,335,840 bits of configuration data, compatible with standard Xilinx PROM devices or external configuration sources.
IEEE 1149.1 Boundary Scan Support
Full JTAG compliance enables:
- In-system programming and verification
- Board-level interconnect testing (EXTEST)
- Internal device testing (INTEST)
- Daisy-chain configuration with multiple FPGAs
Applications for XC2S200-6FGG642C FPGA
The XC2S200-6FGG642C excels in applications requiring flexible, reprogrammable logic:
Industrial and Automation
- Motor control systems
- PLC and industrial controller designs
- Sensor interface and data acquisition
- Real-time process control
Communications and Networking
- Protocol conversion bridges
- Serial communication interfaces
- Network packet processing
- Baseband signal processing
Consumer Electronics
- Video and image processing
- Audio signal processing
- Display controllers
- Consumer device interfaces
Embedded Systems
- Custom peripheral controllers
- ASIC prototyping and emulation
- Glue logic replacement
- Microcontroller expansion
Design Resources and Development Tools
Software Support
The XC2S200-6FGG642C is fully supported by the Xilinx ISE Design Suite, providing:
- Schematic and HDL design entry (VHDL, Verilog)
- Automatic synthesis, mapping, and place-and-route
- Timing-driven implementation
- Comprehensive simulation and verification
- In-circuit debugging with readback capability
Documentation Available
- Complete datasheet (DS001)
- Configuration and readback application notes
- Pinout tables and package drawings
- Design guidelines and reference designs
Why Choose XC2S200-6FGG642C Over ASICs
The XC2S200-6FGG642C offers significant advantages compared to mask-programmed ASICs:
Development Benefits
- Zero NRE Costs: Eliminates expensive mask charges and setup fees
- Rapid Prototyping: Designs functional in hours, not months
- Risk Reduction: Validate functionality before production commitment
- Unlimited Reprogrammability: Field upgrades without hardware changes
Production Advantages
- Cost-effective for low to medium volumes
- Reduced inventory risk with single-SKU flexibility
- Future-proof designs with firmware upgrade capability
- Shorter time-to-market for new product introductions
Ordering Information
Part Number Breakdown: XC2S200-6FGG642C
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II 200K gate device |
| -6 |
Higher performance speed grade |
| FGG |
Fine-pitch BGA, Pb-free (lead-free) |
| 642 |
Pin count |
| C |
Commercial temperature (0°C to +85°C) |
Availability
The XC2S200-6FGG642C is available through authorized AMD/Xilinx distributors and electronic component suppliers worldwide. Contact your preferred distributor for current pricing, lead times, and volume discount information.
Summary
The XC2S200-6FGG642C delivers exceptional value for designers requiring a high-performance, cost-effective FPGA solution. With 200,000 system gates, advanced clock management, comprehensive I/O standards support, and lead-free packaging, this Spartan-II device addresses the demanding requirements of industrial, communications, and embedded applications. Its proven architecture, combined with unlimited reprogrammability and full development tool support, makes the XC2S200-6FGG642C an ideal choice for both new designs and ASIC replacement projects.
