Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3195-4PQ208C: High-Performance Field Programmable Gate Array for Custom VLSI Design Applications

Product Details

Product Overview

The XC3195-4PQ208C is a professional-grade Field Programmable Gate Array (FPGA) from the renowned XC3000 series, manufactured by Xilinx and distributed by Rochester Electronics LLC. This versatile programmable logic device delivers exceptional performance for industrial automation, telecommunications, aerospace systems, and custom embedded applications requiring flexible, high-speed digital logic integration.

As part of the legacy Xilinx FPGA family, the XC3195-4PQ208C combines proven reliability with extensive programmability, making it an ideal solution for engineers seeking to implement complex digital designs without the high costs and lengthy development cycles associated with traditional ASICs.

Technical Specifications Summary

Specification Details
Part Number XC3195-4PQ208C
Manufacturer Xilinx (Now AMD Xilinx)
Distributor Rochester Electronics LLC
Product Family XC3000 Series FPGA
Package Type 208-Pin PQFP (Plastic Quad Flat Pack)
Speed Grade -4 (Commercial Grade)
Total I/O Count Up to 176 user I/O pins
Operating Voltage 5V CMOS Technology
Temperature Range Commercial (0°C to +70°C)
Technology High-Performance CMOS Static Memory
Mounting Type Surface Mount Technology (SMT)
RoHS Compliance Contact manufacturer for current status

Key Features and Benefits

Advanced FPGA Architecture

The XC3195-4PQ208C features Xilinx’s proven field-programmable architecture consisting of:

  • Configurable Logic Blocks (CLBs): Core array of programmable logic elements for implementing custom digital functions
  • Input/Output Blocks (IOBs): Perimeter ring of configurable I/O blocks supporting multiple voltage standards
  • Programmable Interconnect: Flexible routing resources connecting CLBs and IOBs
  • Configuration Memory: On-chip SRAM-based configuration storage for rapid reprogramming

High-Performance Characteristics

Performance Metric Specification
System Gate Density Approximately 3,000 – 5,000 equivalent gates
Toggle Rate 70-325 MHz depending on design
Propagation Delay 2.2 ns to 9 ns logic delays
Maximum System Clock 80+ MHz internal operation

Extensive Package Options

The 208-pin PQFP package provides:

  • Compact surface-mount footprint
  • Excellent thermal performance
  • High pin-count for complex designs
  • Industry-standard pinout compatibility
  • Reliable mechanical connection

Design Capabilities and Applications

Configurable Logic Resources

The XC3195-4PQ208C provides extensive programmable resources:

  • Multiple CLBs with flip-flops and combinatorial logic
  • Internal 3-state bus capabilities
  • On-chip register and memory elements
  • TTL and CMOS input threshold compatibility
  • Programmable clock distribution network

Typical Application Areas

Industry Applications
Industrial Automation PLC controllers, motor control, process automation
Telecommunications Protocol converters, data routers, signal processing
Aerospace & Defense Avionics systems, radar processing, secure communications
Test & Measurement Logic analyzers, oscilloscope triggers, pattern generators
Medical Equipment Diagnostic imaging, patient monitoring, surgical instruments
Consumer Electronics Set-top boxes, digital video processing, gaming peripherals

Technical Architecture

Configurable Logic Blocks (CLBs)

Each CLB in the XC3195 contains:

  • Programmable combinational logic functions
  • Storage elements (flip-flops or latches)
  • Multiplexers for function selection
  • Fast carry logic for arithmetic operations
  • Direct interconnections between adjacent CLBs

Input/Output Block Features

I/O Feature Capability
I/O Standards TTL, CMOS, LVTTL compatible
Output Drive Programmable slew rate control
Input Protection Electrostatic discharge (ESD) protection
Pull-up/Pull-down Configurable internal resistors
Three-State Control Programmable output enable

Clock Management

The XC3195-4PQ208C includes:

  • On-chip crystal oscillator amplifier
  • Multiple global clock distribution networks
  • Regional clock routing options
  • Clock enable control for power management

Programming and Development

Design Entry Methods

Engineers can develop XC3195-4PQ208C designs using:

  • Schematic Capture: Visual logic design entry
  • Hardware Description Languages (HDL): VHDL or Verilog coding
  • High-Level Synthesis: C/C++ to hardware conversion
  • Block Diagram Entry: System-level design approach

Development Tool Support

Tool Category Supported Software
Synthesis Xilinx ISE Design Suite
Simulation ModelSim, ISim, Vivado Simulator
Place & Route Xilinx implementation tools
Programming iMPACT, JTAG programmers
Verification In-circuit emulation, FPGA Editor

Programming Interface

The device supports industry-standard configuration methods:

  • JTAG boundary scan programming
  • Serial configuration mode
  • Parallel configuration mode
  • In-system programmability (ISP)

Comparison with Other XC3000 Series Devices

Device Package I/O Pins Speed Grade Applications
XC3195-4PQ208C 208-PQFP 176 -4 High I/O count designs
XC3195-4PQ160C 160-PQFP 128 -4 Medium complexity systems
XC3195-3PQ208C 208-PQFP 176 -3 Cost-optimized solutions
XC3195-5PC84C 84-PLCC 61 -5 Compact embedded systems

Power Consumption Characteristics

Operating Power

Power Parameter Typical Value
Quiescent Power Low static current consumption
Dynamic Power Varies with toggle rate and design
I/O Power Depends on output loading
Standby Power Minimal in unpowered state

Power Management Features

  • Programmable clock gating
  • Unused logic power-down
  • Low-power CMOS technology
  • Efficient power distribution network

Mechanical and Thermal Specifications

Package Dimensions

The 208-pin PQFP package specifications:

  • Body size: 28mm x 28mm nominal
  • Package height: Thin profile for compact designs
  • Lead pitch: 0.5mm fine pitch
  • Seating plane coplanarity: ±0.10mm maximum

Thermal Characteristics

Thermal Parameter Specification
Junction Temperature 0°C to +70°C (Commercial)
Package Thermal Resistance θJA varies by PCB design
Recommended Heat Sink Optional for high-power designs
Airflow Requirements Natural or forced convection

Quality and Reliability

Manufacturing Quality

  • 100% factory pre-tested devices
  • Comprehensive functional testing
  • Burn-in screening available
  • ISO 9001 certified manufacturing

Reliability Specifications

Reliability Metric Value
Mean Time Between Failures (MTBF) >1,000,000 hours
Reprogramming Cycles Unlimited SRAM-based configuration
Data Retention Configuration held while powered
Operating Life 20+ years typical

Ordering Information

Part Number Breakdown

XC3195-4PQ208C Decoded:

  • XC3195: Device family and gate count
  • -4: Speed grade (commercial temperature)
  • PQ208: Package type (208-pin Plastic Quad Flat Pack)
  • C: Commercial temperature grade (0°C to +70°C)

Package Marking

Devices are clearly marked with:

  • Xilinx logo and part number
  • Speed grade and temperature range
  • Date code and lot traceability
  • Country of origin

Design Considerations

PCB Layout Guidelines

For optimal XC3195-4PQ208C performance:

  • Use controlled impedance traces for high-speed signals
  • Provide adequate power supply decoupling (0.1µF and 10µF capacitors)
  • Route clock signals with minimal skew
  • Maintain proper ground plane integrity
  • Follow manufacturer spacing requirements

Signal Integrity Best Practices

Design Aspect Recommendation
Power Distribution Multiple VCC/GND pairs with bypass capacitors
Clock Routing Minimize trace length and stub effects
High-Speed Signals Use series termination when appropriate
I/O Standards Match voltage levels to connected devices
EMI Reduction Proper grounding and shielding techniques

Competitive Advantages

Why Choose XC3195-4PQ208C?

  1. Proven Technology: Decades of field reliability in critical applications
  2. Design Flexibility: Unlimited reprogramming enables rapid prototyping
  3. Cost-Effective: Eliminates NRE costs and tooling expenses of ASICs
  4. Time-to-Market: Faster development compared to custom IC design
  5. Future-Proof: In-system updates allow field upgrades
  6. Extensive Support: Comprehensive development tools and documentation

Comparison: FPGA vs. Traditional ASIC

Attribute XC3195-4PQ208C FPGA Custom ASIC
Development Cost Low (tool licenses only) High (NRE $100K-$1M+)
Time to Market Weeks to months 6-18 months
Design Changes Unlimited, instant Requires new mask set
Volume Economics Better for low-medium volume Better for high volume
Risk Low (modify design anytime) High (locked after tape-out)

Support and Resources

Technical Documentation

Available resources for XC3195-4PQ208C:

  • Complete datasheet with electrical specifications
  • Application notes and design guides
  • Reference designs and example code
  • Programming file formats and tools
  • PCB footprint libraries (CAD models)

Customer Support

Rochester Electronics provides:

  • Technical engineering support
  • Sample request programs
  • Custom testing services
  • Obsolescence management
  • Global distribution network

Environmental and Compliance

Regulatory Compliance

Standard Status
RoHS Contact manufacturer for current status
REACH EU chemical regulations compliance
Conflict Minerals DRC conflict-free declaration available
WEEE Proper disposal and recycling information

Storage and Handling

  • Store in moisture barrier bags with desiccant
  • Baking required if moisture sensitivity level (MSL) rating exceeded
  • ESD precautions mandatory during handling
  • Follow IPC/JEDEC standards for PCB assembly

Frequently Asked Questions

What is the difference between speed grades?

Speed grades (-3, -4, -5) indicate the maximum operating frequency and minimum propagation delay. The XC3195-4PQ208C with speed grade -4 represents a mid-range performance option balancing speed and cost.

Can the XC3195-4PQ208C be reprogrammed?

Yes, the device uses SRAM-based configuration memory allowing unlimited reprogramming cycles. Configuration is volatile and requires reloading upon power-up.

What development tools are needed?

Xilinx ISE Design Suite (legacy version supporting XC3000 series) provides complete design entry, synthesis, implementation, and programming capabilities.

Is the XC3195-4PQ208C pin-compatible with other packages?

While the PQFP208 package has a specific pinout, Xilinx designed pin compatibility across similar package types within the XC3000 family where possible.

What is the expected lead time?

As this is a legacy device distributed by Rochester Electronics, lead times vary based on inventory availability. Contact your distributor for current stock status.

Conclusion

The XC3195-4PQ208C Field Programmable Gate Array represents a mature, reliable solution for engineers requiring programmable logic in demanding applications. With its extensive I/O capabilities, proven architecture, and flexible design methodology, this FPGA continues to serve critical roles in industrial, aerospace, telecommunications, and embedded systems.

Whether you’re upgrading legacy equipment, prototyping new designs, or seeking alternatives to custom ASICs, the XC3195-4PQ208C delivers the performance, flexibility, and reliability required for mission-critical applications. Combined with comprehensive development tool support and Rochester Electronics’ commitment to long-term device availability, this FPGA remains a trusted choice for professional engineers worldwide.

For detailed specifications, pricing, and availability of the XC3195-4PQ208C, contact Rochester Electronics LLC or authorized distributors today.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.