The AMD XC2S200-6FGG639C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional digital processing capabilities for industrial, telecommunications, and embedded applications. This comprehensive guide provides detailed specifications, features, and applications for the XC2S200-6FGG639C programmable logic device.

XC2S200-6FGG639C Overview and Key Features

The XC2S200-6FGG639C represents AMD’s commitment to delivering cost-effective, high-density programmable logic solutions. Originally developed under the Xilinx brand before AMD’s acquisition, this FPGA continues to serve as a reliable alternative to mask-programmed ASICs, eliminating initial development costs and enabling field-upgradeable designs.

Core Architecture Highlights

The Spartan-II XC2S200-6FGG639C features a sophisticated architecture built on proven 0.18μm CMOS process technology. The device operates at a core voltage of 2.5V, ensuring compatibility with a wide range of system designs while maintaining optimal power efficiency.

XC2S200-6FGG639C Technical Specifications

Logic Resources and System Gates

Memory Configuration

Package and I/O Specifications

The XC2S200-6FGG639C utilizes a Fine-Pitch Ball Grid Array (FBGA) package configuration, optimized for high-density PCB mounting and reliable signal integrity.

Speed Grade and Performance Characteristics

Understanding the -6 Speed Grade

The “-6” designation indicates this device’s speed grade classification, representing the fastest available option within the Spartan-II XC2S200 series. This speed grade is exclusively offered in the commercial temperature range, making it ideal for high-performance applications where maximum clock frequencies are required.

Clock and Timing Features

The XC2S200-6FGG639C incorporates four Delay-Locked Loops (DLLs), positioned at each corner of the die, providing:

• Clock distribution optimization
• Phase alignment capabilities
• Frequency synthesis functions
• Reduced clock skew across the device

Applications for XC2S200-6FGG639C FPGA

Telecommunications Infrastructure

The high logic density and fast processing capabilities make the XC2S200-6FGG639C suitable for implementing communication protocols, network routers, base station equipment, and data transmission systems requiring real-time signal processing.

Industrial Automation and Control

Engineers deploy this FPGA in motor control systems, process automation equipment, and machinery requiring precise digital control with reliable operation under demanding conditions.

Digital Signal Processing

With 5,292 logic cells and extensive memory resources, the XC2S200-6FGG639C excels in DSP applications including audio processing, image processing algorithms, and high-speed data manipulation.

Embedded Systems Development

The device serves as an excellent platform for embedded system designs, offering flexibility for prototyping and production applications where reconfigurability provides significant advantages over fixed-function alternatives.

Medical and Scientific Equipment

Applications in imaging systems, diagnostic equipment, and patient monitoring devices benefit from the FPGA’s reliability and the ability to implement custom processing algorithms.

Advantages of Choosing XC2S200-6FGG639C

Superior ASIC Replacement Technology

The XC2S200-6FGG639C provides second-generation ASIC replacement capabilities, offering several key benefits:

• Zero initial development costs compared to custom ASICs
• Elimination of lengthy design cycles
• Reduced project risk through programmable flexibility
• Unlimited reprogrammability for field upgrades

Cost-Effective Implementation

Built on mature 0.18μm process technology, this FPGA delivers an optimal balance between performance and cost, particularly suitable for high-volume applications where unit economics are critical.

Design Flexibility

The programmable nature allows design modifications without hardware changes, enabling rapid prototyping and iterative development processes that would be impossible with traditional ASIC implementations.

Development Tools and Design Resources

Software Support

Engineers can develop designs for the XC2S200-6FGG639C using industry-standard FPGA design tools. The ISE Design Suite provides comprehensive synthesis, implementation, and verification capabilities for Spartan-II devices.

Documentation and Technical Support

Comprehensive technical documentation supports implementation, including detailed datasheets, application notes, PCB layout guidelines, and configuration procedures. For the latest resources and product information, explore our complete Xilinx FPGA catalog.

Part Number Breakdown: XC2S200-6FGG639C

Understanding the part numbering convention helps identify device specifications:

Environmental and Compliance Information

RoHS Compliance

The “G” in the FGG package designation indicates Pb-free (lead-free) packaging, confirming compliance with RoHS (Restriction of Hazardous Substances) directives for environmentally responsible manufacturing.

Operating Conditions

Comparison with Related Spartan-II Devices

The XC2S200 sits at the top of the Spartan-II family hierarchy, offering maximum logic density:

Ordering and Availability

The AMD XC2S200-6FGG639C is available through authorized electronic component distributors worldwide. When ordering, verify the complete part number to ensure correct speed grade, package type, and temperature range for your application requirements.

Conclusion

The AMD XC2S200-6FGG639C Spartan-II FPGA delivers a proven combination of high logic density, fast performance, and cost-effectiveness for demanding digital design applications. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities in a 639-ball FBGA package, this device continues to serve engineers requiring reliable, reprogrammable logic solutions across telecommunications, industrial, and embedded system applications.