The XC2S200-6FGG634C is a high-performance Field Programmable Gate Array (FPGA) from the AMD/Xilinx Spartan-II family. This advanced programmable logic device delivers 200,000 system gates with exceptional speed and reliability for industrial and commercial applications. Engineers seeking a cost-effective ASIC alternative will find this Xilinx FPGA ideal for rapid prototyping and high-volume production.
Key Features of the XC2S200-6FGG634C FPGA
The XC2S200-6FGG634C represents the flagship device in the Spartan-II product line. It combines substantial logic resources with advanced I/O capabilities in a robust Fine-Pitch Ball Grid Array package.
High-Density Logic Architecture
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks × 4,096 bits) |
| Total On-Chip Memory |
131,264 bits |
XC2S200-6FGG634C Part Number Breakdown
Understanding the part number helps engineers select the correct device variant for their specific application requirements.
Decoding the Model Number
- XC2S200: Spartan-II family device with 200K system gates
- -6: Speed grade designation (higher performance tier)
- FGG: Fine-Pitch Ball Grid Array with Pb-free packaging
- 634: Pin count configuration
- C: Commercial temperature range (0°C to +85°C)
Technical Specifications
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V, 2.5V, or 3.3V |
| Process Technology |
0.18 µm |
| Maximum System Frequency |
200 MHz |
| Configuration File Size |
1,335,840 bits |
Package Information
| Attribute |
Details |
| Package Type |
Fine-Pitch BGA (Pb-Free) |
| Pin Count |
634 |
| Mounting |
Surface Mount |
| RoHS Status |
Compliant |
Supported I/O Standards
The XC2S200-6FGG634C provides versatile interface compatibility through its programmable I/O blocks. This flexibility enables seamless integration with various system architectures.
Compatible Interface Protocols
| Standard |
Reference Voltage |
Output Voltage |
| LVTTL |
N/A |
3.3V |
| LVCMOS2 |
N/A |
2.5V |
| PCI (3.3V/5V) |
N/A |
3.3V |
| GTL |
0.8V |
N/A |
| GTL+ |
1.0V |
N/A |
| HSTL Class I |
0.75V |
1.5V |
| HSTL Class III/IV |
0.9V |
1.5V |
| SSTL2 Class I/II |
1.25V |
2.5V |
| SSTL3 Class I/II |
1.5V |
3.3V |
| CTT |
1.5V |
3.3V |
| AGP-2X |
1.32V |
3.3V |
Advanced Clock Management
Delay-Locked Loop (DLL) Features
The XC2S200-6FGG634C incorporates four dedicated DLL circuits positioned at each corner of the die. These provide sophisticated clock control capabilities.
| DLL Capability |
Description |
| Zero Delay Distribution |
Eliminates clock-to-output propagation delay |
| Clock Multiplication |
2× frequency doubling |
| Clock Division |
Divide by 1.5, 2, 2.5, 3, 4, 5, 8, or 16 |
| Phase Shifting |
0°, 90°, 180°, 270° quadrature outputs |
| Global Clock Nets |
4 primary low-skew networks |
Configuration Modes
The XC2S200-6FGG634C supports multiple configuration options for flexible system integration.
Available Programming Methods
| Mode |
CCLK Direction |
Data Width |
Description |
| Master Serial |
Output |
1-bit |
FPGA drives PROM directly |
| Slave Serial |
Input |
1-bit |
External controller provides clock |
| Slave Parallel |
Input |
8-bit |
Fastest configuration option |
| Boundary Scan (JTAG) |
N/A |
1-bit |
IEEE 1149.1 compliant |
Block RAM Architecture
The XC2S200-6FGG634C contains 14 dedicated block RAM modules arranged in two columns along the device edges.
Block RAM Specifications
| Configuration |
Depth |
Width |
Address Bus |
Data Bus |
| Deep Narrow |
4,096 |
1 |
ADDR[11:0] |
DATA[0] |
| Standard |
2,048 |
2 |
ADDR[10:0] |
DATA[1:0] |
| Medium |
1,024 |
4 |
ADDR[9:0] |
DATA[3:0] |
| Byte-Wide |
512 |
8 |
ADDR[8:0] |
DATA[7:0] |
| Word-Wide |
256 |
16 |
ADDR[7:0] |
DATA[15:0] |
Each block RAM supports fully synchronous dual-port operation with independent control signals for simultaneous read and write access.
Configurable Logic Block (CLB) Structure
CLB Architecture Details
Each CLB contains four Logic Cells (LCs) organized in two identical slices. This structure provides maximum design flexibility.
| Component |
Quantity per CLB |
Function |
| Look-Up Tables (LUTs) |
4 |
4-input function generators |
| Flip-Flops |
4 |
Edge-triggered D-type or latches |
| F5 Multiplexers |
2 |
5-input function generation |
| F6 Multiplexer |
1 |
6-input function generation |
| Carry Logic |
2 chains |
High-speed arithmetic |
Application Areas
The XC2S200-6FGG634C FPGA serves diverse markets requiring programmable logic solutions.
Primary Target Applications
- Telecommunications: Protocol conversion, data routing, signal processing
- Industrial Control: Motor drives, PLC replacement, automation systems
- Consumer Electronics: Video processing, display controllers, audio systems
- Networking Equipment: Packet processing, bridge/router implementations
- Medical Devices: Diagnostic equipment, imaging systems
- Aerospace and Defense: Radar processing, secure communications
Development Tool Support
Compatible Design Software
| Tool |
Purpose |
| Xilinx ISE Design Suite |
Complete FPGA development environment |
| ISE WebPACK |
Free entry-level design tools |
| ChipScope Pro |
Real-time on-chip debugging |
| ModelSim XE |
Functional and timing simulation |
The development ecosystem supports VHDL, Verilog, and schematic-based design entry methods.
Boundary Scan Support
The XC2S200-6FGG634C implements full IEEE 1149.1 JTAG boundary scan compliance.
Supported JTAG Instructions
| Instruction |
Code |
Function |
| EXTEST |
00000 |
External interconnect testing |
| SAMPLE |
00001 |
Capture I/O states |
| BYPASS |
11111 |
Single-bit bypass register |
| IDCODE |
01001 |
Device identification readout |
| CFG_IN |
00101 |
Configuration data input |
| CFG_OUT |
00100 |
Configuration readback |
| INTEST |
00111 |
Internal logic testing |
Power Supply Requirements
Recommended Operating Conditions
| Parameter |
Minimum |
Typical |
Maximum |
Unit |
| VCCINT (Core) |
2.375 |
2.5 |
2.625 |
V |
| VCCO (3.3V I/O) |
3.0 |
3.3 |
3.6 |
V |
| VCCO (2.5V I/O) |
2.375 |
2.5 |
2.625 |
V |
| VCCO (1.5V I/O) |
1.4 |
1.5 |
1.6 |
V |
Ordering Information
Available Device Variants
| Part Number |
Speed Grade |
Temperature Range |
Package |
| XC2S200-6FGG634C |
-6 (High Performance) |
Commercial (0°C to +85°C) |
634-Pin FG BGA Pb-Free |
The “-6” speed grade delivers optimized timing performance for demanding applications requiring maximum clock frequencies.
Why Choose the XC2S200-6FGG634C?
Key Advantages Over ASICs
- Zero NRE Costs: Eliminate expensive mask and tooling charges
- Rapid Prototyping: Functional hardware in hours instead of months
- Field Upgradability: Update designs without hardware replacement
- Risk Reduction: Verify functionality before volume production
- Time-to-Market: Accelerate product development cycles
Summary
The XC2S200-6FGG634C Spartan-II FPGA delivers exceptional value for designers requiring substantial logic density and comprehensive I/O flexibility. With 200,000 system gates, 5,292 logic cells, and support for 16 interface standards, this device addresses demanding embedded system requirements. The Pb-free BGA package ensures environmental compliance while maintaining robust thermal and electrical performance for commercial applications.
