The AMD XC2S200-6FGG625C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional programmable logic capabilities for industrial, commercial, and embedded applications. This advanced FPGA features 200,000 system gates, 5,292 logic cells, and operates at speeds up to 263MHz, making it an ideal solution for engineers seeking cost-effective, high-density programmable logic solutions. As a proven Xilinx FPGA technology now under AMD, this device continues to serve mission-critical applications worldwide.

XC2S200-6FGG625C Key Features and Benefits

The XC2S200-6FGG625C FPGA stands out as a superior alternative to mask-programmed ASICs, offering unlimited reprogrammability and eliminating the high initial costs associated with traditional ASIC development. Engineers benefit from shortened development cycles and reduced time-to-market without sacrificing performance or reliability.

High-Density Logic Architecture

The XC2S200-6FGG625C provides substantial logic resources that support complex digital designs:

• 5,292 Logic Cells for implementing custom digital functions
• 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 array
• 200,000 System Gates combining logic and memory resources
• 284 Maximum User I/Os for extensive interface connectivity

Advanced Memory System

This FPGA incorporates a hierarchical SelectRAM memory architecture:

• 56K bits Block RAM organized as 14 dedicated 4K-bit blocks
• 75,264 bits Distributed RAM using 16 bits per Look-Up Table
• Dual-port RAM capability with independent read/write access
• Configurable aspect ratios from 4096×1 to 256×16

XC2S200-6FGG625C Technical Specifications

XC2S200-6FGG625C Architecture Overview

Configurable Logic Block Structure

The XC2S200-6FGG625C CLB architecture provides flexible logic implementation through a hierarchical structure. Each CLB contains four Logic Cells organized into two identical slices, with each slice featuring:

• Two 4-input Look-Up Tables (LUTs) functioning as function generators
• Two storage elements configurable as D-type flip-flops or level-sensitive latches
• Dedicated carry logic for high-speed arithmetic operations
• F5/F6 multiplexers enabling 5-input and 6-input functions

Arithmetic and Multiplier Support

The dedicated carry logic in the XC2S200-6FGG625C enables efficient implementation of:

• High-speed adders and subtractors
• Accumulators and counters
• Multiply-accumulate (MAC) units
• Wide comparators

Input/Output Block Capabilities

The XC2S200-6FGG625C IOBs support 16 high-performance interface standards, organized into 8 I/O banks:

Each IOB includes:

• Three registers for input, output, and 3-state control
• Programmable slew rate control for reduced bus transients
• Configurable pull-up/pull-down resistors
• Optional weak-keeper circuits
• ESD protection on all pads

XC2S200-6FGG625C Clock Management

Delay-Locked Loop Technology

The XC2S200-6FGG625C incorporates four fully digital DLLs providing:

• Zero propagation delay clock distribution
• Minimal clock skew across all clock loads
• Clock multiplication (2× frequency doubling)
• Clock division by factors of 1.5, 2, 2.5, 3, 4, 5, 8, or 16
• Quadrature phase outputs (0°, 90°, 180°, 270°)
• Duty cycle correction for 50/50 output

Global Clock Distribution

Four dedicated global clock networks ensure low-skew clock distribution throughout the device, critical for:

• Synchronous design implementation
• High-frequency operation
• Multi-clock domain designs
• System timing optimization

XC2S200-6FGG625C Configuration Options

The XC2S200-6FGG625C supports multiple configuration modes for flexible system integration:

Configuration Modes

Configuration Memory Requirements

XC2S200-6FGG625C Boundary Scan Support

Full IEEE 1149.1 JTAG boundary scan compliance enables:

• EXTEST for external interconnect testing
• SAMPLE/PRELOAD for system state capture
• BYPASS for chain optimization
• INTEST for internal testing
• USERCODE for device identification
• CFG_IN/CFG_OUT for JTAG configuration and readback

XC2S200-6FGG625C Applications

The XC2S200-6FGG625C FPGA excels in numerous application domains:

Industrial Automation

• Programmable logic controllers (PLCs)
• Motor control systems
• Industrial communication interfaces
• Process control equipment

Telecommunications

• Protocol conversion
• Channel coding/decoding
• Digital filtering
• Baseband processing

Consumer Electronics

• Video processing
• Audio signal processing
• Display controllers
• Interface bridging

Embedded Systems

• Microcontroller peripherals
• Custom I/O expansion
• Hardware acceleration
• Protocol emulation

Medical Devices

• Patient monitoring equipment
• Diagnostic instrumentation
• Medical imaging systems
• Laboratory equipment

XC2S200-6FGG625C Development Tools

Software Support

The XC2S200-6FGG625C is fully supported by development tools including:

• Xilinx ISE Design Suite for complete design flow
• Automatic mapping, placement, and routing
• Timing-driven implementation
• Comprehensive simulation support
• Static timing analysis

Design Resources

• Library of 400+ primitives and macros
• Arithmetic functions and accumulators
• Counters, decoders, and encoders
• Multiplexers and shift registers
• Boolean functions and I/O primitives

XC2S200-6FGG625C Ordering Information

Part Number Breakdown

XC2S200 - 6 - FGG625 - C
   │      │     │      │
   │      │     │      └── Temperature: C = Commercial (0°C to +85°C)
   │      │     └── Package: Fine-Pitch BGA, Pb-Free
   │      └── Speed Grade: -6 (Higher Performance)
   └── Device: Spartan-II, 200K Gates

Speed Grade Options

XC2S200-6FGG625C Absolute Maximum Ratings

Why Choose the XC2S200-6FGG625C FPGA

Cost-Effective Solution

The XC2S200-6FGG625C delivers exceptional value through:

• Elimination of ASIC NRE costs
• Reduced development time
• Lower inventory requirements
• Field upgrade capability

Design Flexibility

Engineers benefit from:

• Unlimited reprogrammability
• In-system reconfiguration
• Design portability
• Platform standardization

Proven Reliability

The Spartan-II architecture provides:

• Mature 0.18 µm process technology
• Extensive field deployment history
• Comprehensive quality testing
• Long-term availability

XC2S200-6FGG625C Design Considerations

Power Supply Requirements

• Connect all VCCINT pins to 2.5V supply
• Connect VCCO pins according to I/O standard requirements
• Ensure proper decoupling capacitors near power pins
• Follow recommended power sequencing

PCB Layout Guidelines

• Use controlled impedance traces for high-speed signals
• Provide adequate ground planes
• Minimize stub lengths
• Consider signal integrity for LVDS and differential signals

Thermal Management

• Calculate power dissipation based on design utilization
• Provide adequate airflow for commercial temperature operation
• Consider thermal vias under BGA package
• Monitor junction temperature in critical applications

XC2S200-6FGG625C Summary

The AMD XC2S200-6FGG625C Spartan-II FPGA represents a proven, cost-effective solution for designers requiring high-density programmable logic with extensive I/O capabilities. With 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and support for 16 I/O standards, this device addresses a broad spectrum of industrial, commercial, and embedded applications. The mature architecture, comprehensive development tool support, and field-proven reliability make the XC2S200-6FGG625C an excellent choice for both new designs and legacy system maintenance.