The AMD XC2S200-6FGG621C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional performance and reliability for demanding digital design applications. This cost-effective programmable logic device combines 200,000 system gates with advanced 0.18μm CMOS technology, making it an ideal choice for telecommunications, industrial automation, automotive electronics, and embedded system designs.
XC2S200-6FGG621C Key Features and Benefits
The XC2S200-6FGG621C FPGA offers engineers a comprehensive set of features that distinguish it from conventional ASICs and competing programmable logic solutions. This device provides unlimited in-system reprogrammability, eliminating the high initial costs and lengthy development cycles associated with mask-programmed ASICs.
Superior Alternative to ASIC Technology
The Spartan-II XC2S200-6FGG621C architecture delivers significant advantages over traditional ASIC implementations:
- Zero NRE Costs: Eliminate expensive non-recurring engineering expenses
- Rapid Time-to-Market: Reduce development cycles from months to weeks
- Field Upgradability: Implement design modifications without hardware replacement
- Risk Mitigation: Prototype and validate designs before production commitment
Advanced Programmable Logic Architecture
The XC2S200-6FGG621C features a highly flexible architecture built around Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). Four Delay-Locked Loops (DLLs) positioned at each die corner provide precise clock management, while dual block RAM columns offer high-density on-chip memory resources.
XC2S200-6FGG621C Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II FPGA |
| Manufacturer |
AMD (formerly Xilinx) |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 (Fastest) |
| Process Technology |
0.18μm CMOS |
| Core Voltage |
2.5V |
| I/O Voltage |
1.5V to 3.3V |
| Maximum Frequency |
263 MHz |
| Package Type |
621-Ball Fine-Pitch BGA (FGG621) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Status |
Pb-Free Compliant |
XC2S200-6FGG621C Package Information
621-Ball Fine-Pitch BGA Package Details
The FGG621 package configuration provides engineers with optimal board space utilization while maintaining excellent thermal performance and signal integrity characteristics.
Package Mechanical Specifications
| Specification |
Value |
| Package Style |
Fine-Pitch Ball Grid Array |
| Total Balls |
621 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
27 × 27 mm |
| Ball Height |
2.60 mm (max) |
| Mounting Type |
Surface Mount (SMD/SMT) |
| Lead-Free |
Yes (Pb-Free) |
High-Density I/O Capabilities
The XC2S200-6FGG621C supports multiple I/O standards for seamless integration with diverse system components, including LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL interfaces.
XC2S200-6FGG621C Memory Architecture
SelectRAM™ Hierarchical Memory System
The XC2S200-6FGG621C incorporates a dual-tier memory architecture combining distributed and block RAM resources for maximum design flexibility.
Distributed RAM Specifications
- Total Capacity: 75,264 bits
- Configuration: 16 bits per Look-Up Table (LUT)
- Implementation: Synchronous single-port or dual-port RAM
- Access: Zero wait-state, high-speed operation
Block RAM Specifications
- Total Capacity: 56 Kbits
- Block Size: 4 Kbits per block
- Configuration: True dual-port architecture
- Modes: Single-port, dual-port, and ROM configurations
XC2S200-6FGG621C Speed Grade Performance
The -6 speed grade designation indicates the highest performance tier available for the Spartan-II XC2S200 device family. This speed grade offers:
Timing Performance Characteristics
| Parameter |
-6 Speed Grade |
| Maximum System Frequency |
263 MHz |
| CLB Flip-Flop Toggle Rate |
263 MHz |
| Block RAM Speed |
263 MHz |
| DLL Output Frequency |
Up to 320 MHz |
| Pin-to-Pin Delay |
5 ns (typical) |
XC2S200-6FGG621C Target Applications
The versatile XC2S200-6FGG621C FPGA addresses a wide range of application requirements across multiple industries.
Industrial and Automation Applications
- Programmable Logic Controllers (PLCs)
- Motor drive control systems
- Industrial networking equipment
- Process automation interfaces
- Machine vision preprocessing
Telecommunications and Networking
- Network interface controllers
- Protocol conversion bridges
- Digital signal processing
- Encryption/decryption engines
- Base station equipment
Consumer Electronics
- Digital video processing
- Audio signal processing
- Gaming and multimedia systems
- Set-top box controllers
Automotive Electronics
- Infotainment system controllers
- Advanced driver assistance systems (ADAS)
- Vehicle network gateways
- Sensor interface modules
XC2S200-6FGG621C Configuration Modes
The XC2S200-6FGG621C supports multiple configuration modes to accommodate various system architectures and boot requirements.
Supported Configuration Methods
| Mode |
Data Width |
CCLK Direction |
Description |
| Master Serial |
1-bit |
Output |
FPGA generates clock, reads serial PROM |
| Slave Serial |
1-bit |
Input |
External controller provides data and clock |
| Slave Parallel |
8-bit |
Input |
High-speed parallel configuration |
| Boundary-Scan (JTAG) |
1-bit |
N/A |
IEEE 1149.1 compliant configuration |
Configuration Memory Requirements
The XC2S200-6FGG621C requires approximately 1,335,840 bits (167 KB) of configuration data, compatible with Xilinx Platform Flash PROMs and third-party serial flash devices.
XC2S200-6FGG621C Development Tools and Resources
Software Design Environment
The XC2S200-6FGG621C is fully supported by the Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities.
Supported Design Entry Methods
- VHDL and Verilog HDL
- Schematic capture
- IP core integration
- Mixed design methodology
Documentation and Technical Support
Comprehensive technical resources are available for the XC2S200-6FGG621C:
- Datasheet: Complete electrical and timing specifications (DS001)
- User Guide: Implementation guidelines and best practices
- Application Notes: Design examples and reference implementations
- Pinout Diagrams: Package-specific pin assignments
For additional Xilinx FPGA products, development boards, and technical resources, authorized distributors provide complete design support services.
XC2S200-6FGG621C Ordering Information
Part Number Decoding
XC2S200-6FGG621C
│ │ │ │ │
│ │ │ │ └── Temperature Range: C = Commercial (0°C to +85°C)
│ │ │ └──── Pin Count: 621
│ │ └─────── Package: FGG = Fine-Pitch BGA, Pb-Free
│ └───────── Speed Grade: -6 (Fastest)
└────────────── Device: XC2S200 (200K System Gates)
Quality and Compliance
| Standard |
Status |
| RoHS Directive |
Compliant |
| Lead-Free |
Yes |
| Moisture Sensitivity |
MSL-3 |
| ESD Protection |
Class 2 |
Why Choose the XC2S200-6FGG621C FPGA?
The AMD XC2S200-6FGG621C represents an excellent balance of performance, logic density, and cost-effectiveness for mid-range FPGA applications. Key advantages include:
- Proven Technology: Based on the mature and reliable Spartan-II architecture with extensive deployment history
- Optimal Logic Density: 200,000 system gates provide sufficient resources for complex digital designs
- Fastest Speed Grade: The -6 designation ensures maximum performance for timing-critical applications
- Flexible I/O: Support for multiple voltage standards enables seamless system integration
- Comprehensive Memory: Combined distributed and block RAM architecture addresses diverse memory requirements
- Field Programmability: Unlimited reconfiguration capability supports design iterations and field upgrades
- Environmental Compliance: Pb-free packaging meets global environmental regulations
XC2S200-6FGG621C Equivalent and Compatible Parts
Engineers seeking alternative solutions may consider these related Spartan-II family devices:
| Part Number |
System Gates |
Package |
Speed Grade |
| XC2S150 |
150,000 |
Various |
-5, -6 |
| XC2S200 |
200,000 |
Various |
-5, -6 |
| XC2S200E |
200,000 |
Various |
-6, -7 |
Frequently Asked Questions
What development tools support the XC2S200-6FGG621C?
The XC2S200-6FGG621C is supported by Xilinx ISE Design Suite (versions 14.7 and earlier), which provides complete synthesis, implementation, and verification tools for VHDL and Verilog designs.
Is the XC2S200-6FGG621C suitable for new designs?
While the Spartan-II family remains in production, engineers starting new designs may also consider the Spartan-6 or Spartan-7 families for enhanced features and longer product availability.
What configuration PROMs are compatible?
The XC2S200-6FGG621C is compatible with Xilinx XC18V01, XC18V02, XC18V04 Platform Flash PROMs, as well as standard SPI flash devices through appropriate configuration circuits.
What is the power consumption of the XC2S200-6FGG621C?
Typical power consumption ranges from 0.5W to 1.5W depending on design complexity, operating frequency, and I/O utilization. Detailed power analysis is available through Xilinx XPower tools.
