The XC2S200-6FGG614C is a powerful field-programmable gate array from AMD’s proven Spartan-II FPGA family. This versatile programmable logic device delivers exceptional performance, reliability, and cost-effectiveness for demanding digital design applications. Engineers worldwide choose the XC2S200-6FGG614C for embedded systems, telecommunications, automotive electronics, and industrial automation projects.

XC2S200-6FGG614C Key Features and Benefits

The XC2S200-6FGG614C combines advanced programmable logic architecture with industrial-grade reliability. This Xilinx FPGA offers significant advantages over traditional mask-programmed ASICs, including faster development cycles, lower initial costs, and field-upgradable functionality.

Core Logic Resources

The XC2S200-6FGG614C provides substantial logic capacity for complex digital designs:

Speed Grade and Performance Characteristics

The “-6” speed grade designation indicates the highest performance tier available in the commercial temperature range for the Spartan-II family. This speed grade delivers optimized timing characteristics for demanding applications requiring fast signal propagation and high-frequency operation up to 263MHz.

XC2S200-6FGG614C Package Specifications

FGG614 Fine-Pitch Ball Grid Array Package

The XC2S200-6FGG614C utilizes a 614-ball Fine-Pitch Ball Grid Array (FBGA) package designed for optimal board space utilization and excellent electrical performance. The “G” designation indicates RoHS-compliant Pb-free packaging, making this device suitable for environmentally conscious manufacturing processes.

Package Characteristics

The FGG614 package offers several advantages for PCB designers and manufacturing engineers:

• High Pin Density: Maximizes available I/O connections for complex system integration
• Superior Signal Integrity: Ball grid array construction minimizes parasitic inductance
• Enhanced Thermal Performance: Efficient heat dissipation for reliable operation
• Manufacturing Compatibility: Compatible with standard SMT assembly processes

XC2S200-6FGG614C Technical Architecture

Configurable Logic Block Structure

The Spartan-II architecture features a regular, flexible array of Configurable Logic Blocks surrounded by programmable Input/Output Blocks. Each CLB contains four logic cells capable of implementing combinatorial and sequential logic functions.

Delay-Locked Loop Technology

The XC2S200-6FGG614C incorporates four Delay-Locked Loops positioned at each corner of the die. These DLLs provide advanced clock management capabilities including clock deskewing, frequency synthesis, and phase adjustment for timing-critical applications.

Block RAM Memory Architecture

Two columns of dedicated block RAM extend along opposite edges of the die, providing 56 Kbits of synchronous dual-port memory. Each block RAM cell offers independent control signals for both ports with configurable data widths for flexible memory implementations.

XC2S200-6FGG614C Operating Specifications

Voltage Requirements

Temperature Range

The “C” suffix indicates commercial temperature range operation with junction temperatures from 0°C to +85°C, suitable for most industrial and commercial applications.

XC2S200-6FGG614C Configuration Options

Supported Configuration Modes

The XC2S200-6FGG614C supports multiple configuration modes for design flexibility:

Configuration Memory Requirements

The XC2S200-6FGG614C requires 1,335,840 configuration bits for complete device programming. Compatible configuration PROMs and flash memory devices are available for standalone operation.

XC2S200-6FGG614C Application Areas

Telecommunications Infrastructure

The XC2S200-6FGG614C excels in telecommunications equipment including network switches, routers, and base station controllers where programmable logic enables protocol flexibility and rapid feature updates.

Industrial Control Systems

Manufacturing automation, motor control, and process control applications benefit from the XC2S200-6FGG614C’s reliable operation and real-time processing capabilities.

Embedded Computing Platforms

System designers implement custom peripheral interfaces, co-processors, and glue logic using the XC2S200-6FGG614C’s versatile programmable architecture.

Automotive Electronics

Infotainment systems, driver assistance features, and vehicle networking applications leverage the XC2S200-6FGG614C’s robust performance and industrial-grade reliability.

XC2S200-6FGG614C Development Resources

Design Software Compatibility

The XC2S200-6FGG614C is fully supported by the ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can utilize VHDL and Verilog HDL for design capture.

Documentation and Support

Extensive technical documentation supports XC2S200-6FGG614C implementation including detailed datasheets with electrical characteristics, timing specifications, and pinout information. Application notes provide practical guidance for PCB layout, power supply design, and configuration procedures.

Why Choose the XC2S200-6FGG614C

The XC2S200-6FGG614C represents an excellent choice for engineers requiring proven FPGA technology with comprehensive documentation and worldwide availability. Key advantages include:

• Reduced Development Risk: Proven silicon and mature design tools minimize project uncertainty
• Cost-Effective Production: Competitive pricing for volume manufacturing
• Field Upgradability: In-system programming enables feature updates without hardware changes
• Long-Term Availability: Established product with extended lifecycle support

XC2S200-6FGG614C Ordering Information

When ordering the XC2S200-6FGG614C, the part number decodes as follows:

• XC2S200: Spartan-II device with 200K system gates
• -6: Highest commercial speed grade
• FGG: Fine-pitch BGA package, Pb-free
• 614: 614-ball package configuration
• C: Commercial temperature range (0°C to +85°C)