The AMD XC2S200-6FGG605C is a high-performance programmable logic device from the renowned Spartan-II FPGA family. This versatile XC2S200-6FGG605C FPGA delivers exceptional value for cost-sensitive applications requiring advanced logic density, embedded memory, and reliable I/O performance. Engineers and designers worldwide trust this device for industrial control, telecommunications, consumer electronics, and embedded system applications.
XC2S200-6FGG605C Product Overview
The AMD XC2S200-6FGG605C represents the optimal balance between performance, power efficiency, and cost-effectiveness within the Spartan-II product line. Built on advanced CMOS process technology, this FPGA provides 200,000 system gates with flexible configuration options.
Key Product Information
| Parameter |
Specification |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XC2S200-6FGG605C |
| Product Family |
Spartan-II FPGA |
| Logic Capacity |
200,000 System Gates |
| Package Type |
FGG605C (605-Ball Fine-Pitch BGA) |
| Speed Grade |
-6 (Commercial High Performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Process Technology |
0.18/0.22 µm CMOS |
XC2S200-6FGG605C Technical Specifications
Logic Resources and Architecture
The XC2S200-6FGG605C FPGA architecture is built around configurable logic blocks (CLBs), providing exceptional flexibility for complex digital designs.
| Logic Resource |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
56 × 28 (1,568 CLBs) |
| Flip-Flops |
5,292 |
| 4-Input LUTs |
5,292 |
| Maximum Distributed RAM |
73,728 bits |
Each CLB contains four logic cells (LCs), with every LC featuring one 4-input look-up table (LUT) and one dedicated flip-flop. This architecture enables efficient implementation of combinational and sequential logic functions.
Embedded Memory (Block SelectRAM+)
The XC2S200-6FGG605C includes dedicated Block SelectRAM+ memory resources for high-bandwidth data storage requirements.
| Memory Feature |
Specification |
| Block RAM Blocks |
14 |
| Total Block RAM |
56 Kb (57,344 bits) |
| Single-Port RAM |
4,096 × 1 to 256 × 16 |
| Dual-Port RAM |
4,096 × 1 to 256 × 16 |
| ROM Support |
Yes |
| Synchronous Operation |
Yes |
XC2S200-6FGG605C I/O Capabilities
The FGG605C package provides extensive I/O resources with support for multiple interface standards.
| I/O Specification |
Value |
| Maximum User I/O Pins |
284 |
| I/O Banks |
4 |
| SelectIO Standards |
LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, SSTL, CTT, AGP |
| Differential I/O |
LVDS, BLVDS, LVPECL (input only) |
| Hot-Swap Compliance |
3.3V PCI |
XC2S200-6FGG605C Clock Management
Digital Clock Manager (DCM) Features
Advanced clock management capabilities ensure optimal timing performance across complex designs.
| Clock Feature |
Specification |
| Delay-Locked Loops (DLLs) |
4 |
| Clock Multiplication |
1.5×, 2×, 2.5×, 3×, 3.5×, 4×, 4.5×, 5× |
| Clock Division |
1.5, 2, 2.5, 3, 4, 5, 8, 16 |
| Input Frequency Range |
24 MHz to 200 MHz |
| Output Frequency Maximum |
400 MHz |
| Global Clock Networks |
4 |
Speed Grade -6 Performance Characteristics
The -6 speed grade designation indicates the highest performance tier for commercial applications, delivering superior timing specifications.
Timing Performance
| Performance Parameter |
-6 Speed Grade |
| System Clock Frequency |
Up to 200 MHz |
| Logic Delay (Tilo) |
0.95 ns typical |
| Block RAM Access Time |
2.4 ns |
| I/O Standard Support |
Full compliance |
FGG605C Package Specifications
The Fine-Pitch Ball Grid Array (FGG605C) package offers optimal thermal performance and board-level reliability.
Physical Dimensions
| Package Parameter |
Specification |
| Package Type |
FBGA (Fine-Pitch BGA) |
| Ball Count |
605 |
| Ball Pitch |
1.0 mm |
| Package Body Size |
27 mm × 27 mm |
| Package Height |
2.3 mm (maximum) |
| Ball Material |
Pb-free SAC305 solder (RoHS compliant) |
Thermal Characteristics
| Thermal Parameter |
Value |
| θJA (Junction-to-Ambient) |
18°C/W |
| θJC (Junction-to-Case) |
5°C/W |
| Maximum Junction Temperature |
125°C |
XC2S200-6FGG605C Power Supply Requirements
Recommended Operating Voltages
| Power Rail |
Voltage |
Tolerance |
| VCCINT (Core) |
2.5V |
±5% |
| VCCO (I/O Bank) |
1.5V to 3.3V |
±5% |
| VREF (Reference) |
Dependent on I/O standard |
±2% |
Power Consumption Guidelines
Typical power consumption varies based on design complexity, clock frequency, and I/O utilization. The XC2S200-6FGG605C offers excellent power efficiency for battery-powered and thermally constrained applications.
Configuration and Programming Options
Supported Configuration Modes
| Configuration Mode |
Description |
| Master Serial |
FPGA controls external PROM |
| Slave Serial |
External processor controls FPGA |
| Master Parallel |
8-bit parallel from PROM |
| Slave Parallel (SelectMAP) |
8-bit parallel from processor |
| Boundary Scan (JTAG) |
IEEE 1149.1/1532 compliant |
Configuration Data
| Configuration Parameter |
Specification |
| Bitstream Size |
1,335,840 bits |
| Configuration Time (JTAG) |
< 500 ms typical |
| Encryption Support |
No |
Target Applications for XC2S200-6FGG605C
The AMD XC2S200-6FGG605C FPGA excels in diverse application domains:
Industrial and Automation
- Programmable logic controllers (PLCs)
- Motor drive control systems
- Industrial Ethernet interfaces
- Sensor data acquisition
Telecommunications
- Protocol conversion bridges
- Baseband signal processing
- Network interface cards
- SDH/SONET framing
Consumer Electronics
- Digital display controllers
- Audio/video processing
- Gaming peripherals
- Set-top box interfaces
Embedded Systems
- Microprocessor bus interfaces
- Custom peripheral controllers
- ASIC prototyping platforms
- Legacy system integration
Design Resources and Development Tools
AMD/Xilinx Software Support
The XC2S200-6FGG605C is fully supported by Xilinx ISE Design Suite, which includes:
- ISE WebPACK: Free license for Spartan-II devices
- HDL Synthesis: VHDL and Verilog support
- IP Core Generator: Pre-verified logic modules
- ChipScope Pro: Real-time debugging
- Timing Analyzer: Static timing verification
For comprehensive Xilinx FPGA solutions, development boards, and technical documentation, trusted distribution partners provide worldwide availability and engineering support.
Quality and Compliance Standards
Certifications
| Standard |
Compliance |
| RoHS |
2011/65/EU Compliant |
| REACH |
Compliant |
| MSL (Moisture Sensitivity Level) |
Level 3 |
| Lead-Free |
SAC305 Ball Alloy |
Reliability Data
| Reliability Metric |
Specification |
| MTBF |
> 1,000,000 hours |
| Qualification Standard |
JEDEC JESD47 |
| Electrostatic Discharge (ESD) |
2kV HBM, 200V CDM |
Ordering Information
Part Number Breakdown
XC2S200-6FGG605C
| Code |
Meaning |
| XC |
Xilinx Commercial |
| 2S |
Spartan-II Family |
| 200 |
200K System Gates |
| -6 |
Speed Grade (Fastest Commercial) |
| FG |
Fine-pitch BGA Package |
| G605 |
605-Ball Configuration |
| C |
Commercial Temperature (0°C to +85°C) |
Summary
The AMD XC2S200-6FGG605C FPGA combines proven Spartan-II architecture with high-density packaging to deliver outstanding value for cost-conscious designs. With 200,000 system gates, 14 Block RAM modules, 284 user I/O pins, and the fastest commercial speed grade, the XC2S200-6FGG605C addresses demanding requirements across industrial, telecommunications, and embedded applications.
Key advantages include mature silicon reliability, comprehensive EDA tool support, flexible configuration options, and worldwide supply chain availability. The FGG605C package offers excellent thermal management in a compact 27mm × 27mm form factor, making it ideal for space-constrained PCB designs.
Engineers selecting the XC2S200-6FGG605C benefit from AMD’s extensive documentation library, application notes, and reference designs that accelerate time-to-market while minimizing development risk.
