The XC2S200-6FGG600C is a powerful field-programmable gate array (FPGA) from the AMD/Xilinx Spartan-II family, engineered to deliver exceptional performance for cost-sensitive electronic applications. This 200,000 system gate FPGA combines high-speed processing capabilities with flexible I/O configurations, making it an ideal choice for telecommunications, industrial automation, consumer electronics, and embedded systems design.

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XC2S200-6FGG600C Technical Overview

The XC2S200-6FGG600C belongs to the renowned Spartan-II FPGA family, which provides engineers with robust logic resources, advanced memory architecture, and reliable performance at competitive pricing. This device leverages 0.18-micron CMOS process technology to achieve optimal balance between power consumption and processing speed.

Core Architecture Specifications

The internal architecture of the XC2S200-6FGG600C features a programmable, flexible arrangement of Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). This hierarchical structure enables efficient signal routing and maximum design flexibility.

Package Information

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Key Features of XC2S200-6FGG600C FPGA

Advanced Logic Cell Architecture

Each logic cell within the XC2S200-6FGG600C consists of a 4-input function generator, storage element, and dedicated carry logic. The device contains four logic cells per CLB, with each CLB providing access to all routing structures for maximum design flexibility.

The function generators can implement any arbitrarily defined Boolean function of four inputs, or can be configured as high-speed synchronous RAM. This dual-functionality provides designers with versatile options for both logic implementation and distributed memory allocation.

SelectRAM Hierarchical Memory System

The XC2S200-6FGG600C incorporates AMD’s SelectRAM hierarchical memory architecture, offering two distinct memory resources:

Distributed RAM

The distributed RAM capability provides 16 bits per Look-Up Table (LUT), totaling 75,264 bits across the device. This memory type offers:

• Single-clock-cycle synchronous write operations
• Asynchronous read access for minimal latency
• Flexible configuration as single-port or dual-port RAM
• Ideal for register files, FIFOs, and small lookup tables

Block RAM

The device includes 56K bits of dedicated block RAM organized in columns along each vertical edge of the die. Each 4,096-bit block RAM cell features:

• Fully synchronous dual-port operation
• Independent control signals for each port
• Configurable data widths (1, 2, 4, 8, or 16 bits)
• Support for RAM, ROM, and FIFO implementations
• Fast interface capabilities for external memory connections

Delay-Locked Loop (DLL) Technology

Four Delay-Locked Loops (DLLs) are positioned at each corner of the XC2S200-6FGG600C die, providing advanced clock management capabilities:

• Clock deskewing for synchronous designs
• Clock multiplication and division
• Phase shifting for precise timing control
• Clock mirroring for board-level clock distribution
• Elimination of clock distribution delays

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XC2S200-6FGG600C I/O Standards and Capabilities

Flexible I/O Voltage Support

The XC2S200-6FGG600C supports multiple I/O voltage standards, enabling seamless integration with various system components:

• 3.3V LVTTL/LVCMOS
• 2.5V LVCMOS
• 1.8V LVCMOS
• 1.5V LVCMOS
• PCI (33MHz and 66MHz)
• GTL and GTL+
• SSTL3 Class I and II
• SSTL2 Class I and II
• HSTL Class I, III, and IV
• CTT

I/O Banking Architecture

The device organizes I/O pins into multiple banks, allowing different voltage standards to be applied to separate groups of pins. This banking structure supports:

• Independent VCCO power supplies per bank
• Mixed voltage design integration
• Flexible peripheral interfacing
• Reduced external level-shifting requirements

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Configuration Options for XC2S200-6FGG600C

Multiple Configuration Modes

The XC2S200-6FGG600C supports various configuration modes to accommodate different system requirements:

Master Serial Mode

The FPGA generates CCLK and controls configuration from an external serial PROM, providing simple and cost-effective standalone operation.

Slave Serial Mode

An external controller provides both configuration data and clock signal, ideal for processor-controlled systems.

Master Parallel Mode

Supports byte-wide configuration from parallel flash memory for faster configuration times.

Slave Parallel Mode

Enables high-speed configuration from microprocessors or microcontrollers with 8-bit parallel data transfer.

Boundary Scan (JTAG) Mode

Full IEEE 1149.1 JTAG support for configuration, debugging, and in-system programming.

Configuration Data Storage

Configuration data can be stored in various non-volatile memory devices:

• Xilinx Platform Flash PROMs
• Third-party serial and parallel flash memories
• System processors with embedded flash
• Network-based configuration for remote updates

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XC2S200-6FGG600C Application Areas

Telecommunications and Networking

The high logic density and fast clock speeds make the XC2S200-6FGG600C ideal for:

• Protocol conversion and bridging
• Packet processing engines
• Network interface controllers
• DSP co-processing
• Channel encoding/decoding

Industrial Automation

Industrial applications benefit from the device’s reliability and flexibility:

• Programmable logic controllers (PLC)
• Motor control systems
• Process automation
• Sensor interface and signal conditioning
• Machine vision preprocessing

Consumer Electronics

Cost-effective performance supports consumer product development:

• Digital display controllers
• Audio/video processing
• Gaming systems
• Set-top boxes
• Home automation controllers

Embedded Systems

The XC2S200-6FGG600C serves as an excellent embedded platform for:

• Custom peripheral development
• Hardware acceleration
• System-on-chip prototyping
• Legacy system replacement
• Custom interface implementations

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Design Development Support

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG600C is fully supported by the Xilinx ISE Design Suite, providing:

• Comprehensive design entry (HDL and schematic)
• Advanced synthesis optimization
• Automatic place-and-route algorithms
• Timing analysis and simulation
• Configuration file generation

Development Resources

Engineers working with the XC2S200-6FGG600C have access to extensive documentation:

• Complete datasheet with DC/AC specifications
• User guides and application notes
• Reference designs and IP cores
• PCB layout guidelines
• Power estimation tools

For comprehensive information about Xilinx FPGA products and related development resources, explore our detailed product catalog.

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XC2S200-6FGG600C Ordering Information

Part Number Nomenclature

Understanding the XC2S200-6FGG600C part number:

Speed Grade Options

The Spartan-II family offers multiple speed grades:

• -4: Standard performance
• -5: Enhanced performance
• -6: Maximum performance (as in XC2S200-6FGG600C)

The -6 speed grade provides the highest clock frequencies and fastest propagation delays, making it suitable for performance-critical applications.

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Quality and Compliance

Environmental Compliance

The XC2S200-6FGG600C meets stringent environmental regulations:

• RoHS Compliant: Lead-free packaging meets EU RoHS directive requirements
• REACH Compliant: Adheres to European chemical safety standards
• MSL Rating: Appropriate moisture sensitivity level for automated assembly

Reliability Standards

• Automotive AEC-Q100 qualification available for specific variants
• JEDEC standard qualification procedures
• Extensive reliability testing including:
  • Temperature cycling
  • Humidity resistance
  • Electrostatic discharge (ESD) protection
  • Latch-up immunity

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Technical Comparison Within Spartan-II Family

The XC2S200-6FGG600C represents the highest-density option in the Spartan-II family, providing maximum logic resources and memory capacity.

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Advantages Over Traditional ASICs

The XC2S200-6FGG600C offers significant benefits compared to mask-programmed ASICs:

Reduced Development Risk

• No NRE Costs: Eliminate expensive non-recurring engineering fees
• Short Development Cycles: Start production without lengthy ASIC fabrication
• Design Flexibility: Make changes without costly mask modifications
• Rapid Prototyping: Verify designs before committing to production

Field Upgrade Capability

The programmable nature of FPGAs enables:

• In-field firmware updates
• Feature additions post-deployment
• Bug fixes without hardware replacement
• Customer-specific customization

Time-to-Market Advantage

• Immediate availability of standard devices
• Parallel hardware/software development
• Iterative design refinement
• Quick response to market changes

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Summary

The XC2S200-6FGG600C delivers a compelling combination of high logic density, flexible memory architecture, and robust I/O capabilities in a lead-free 600-pin FBGA package. With 200,000 system gates, 5,292 logic cells, and comprehensive development tool support, this Spartan-II FPGA provides an excellent platform for telecommunications, industrial automation, consumer electronics, and embedded systems applications.

The -6 speed grade ensures maximum performance for timing-critical designs, while the commercial temperature rating supports standard operating environments. Whether replacing custom ASICs or implementing new digital designs, the XC2S200-6FGG600C offers the flexibility, reliability, and cost-effectiveness that modern electronic product development demands.