Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG599C: High-Performance Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG599C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s proven Spartan-II family. Designed to deliver exceptional performance and reliability, the XC2S200-6FGG599C offers engineers a powerful solution for demanding industrial, telecommunications, and embedded system applications. With 200,000 system gates, 5,292 logic cells, and advanced programmable logic capabilities, this FPGA provides the perfect balance of performance and cost-effectiveness for high-volume production.


XC2S200-6FGG599C Key Features and Benefits

High-Density Logic Resources

The XC2S200-6FGG599C delivers impressive computational power through its advanced architecture:

  • 200,000 System Gates for implementing complex digital designs
  • 5,292 Logic Cells providing flexibility for advanced signal processing
  • 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 x 42 array
  • 284 Maximum User I/O Pins for extensive connectivity options

Advanced Memory Architecture

Memory resources in the XC2S200-6FGG599C include:

  • 75,264 bits of Distributed RAM for flexible memory implementation
  • 56K bits of Block RAM for high-speed data buffering
  • Dual-port and single-port RAM configurations
  • Fast, predictable memory access timing

Superior Speed Performance

The -6 speed grade designation indicates the XC2S200-6FGG599C operates at the fastest speed available in the Spartan-II family:

  • System clock rates exceeding 200 MHz
  • Optimized for high-speed digital signal processing
  • Low propagation delays for timing-critical applications
  • Ideal for networking and telecommunications infrastructure

XC2S200-6FGG599C Technical Specifications

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM Bits 75,264
Block RAM Bits 56K
Speed Grade -6 (Fastest)
Core Voltage 2.5V
Process Technology 0.18µm
Package Type 599-Pin Fine Pitch BGA (FBGA)
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Yes (Pb-Free)

XC2S200-6FGG599C Package Information

599-Pin FBGA Package Specifications

The XC2S200-6FGG599C utilizes a 599-ball Fine Pitch Ball Grid Array (FBGA) package, offering:

  • Compact Form Factor for high-density PCB designs
  • Excellent Thermal Performance with optimized ball grid configuration
  • Reliable Solder Connections for industrial-grade durability
  • Pb-Free (Lead-Free) construction for RoHS compliance

The “G” designation in the part number indicates Pb-free packaging, ensuring compliance with environmental and safety standards including the Restriction of Hazardous Substances (RoHS) directive.


XC2S200-6FGG599C I/O Capabilities

SelectIO Technology

The XC2S200-6FGG599C features versatile I/O capabilities through SelectIO technology:

  • Multiple I/O Standards Support including LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, and SSTL
  • 3.3V Tolerant Inputs for mixed-voltage system compatibility
  • Programmable Output Drive Strength (2mA to 24mA)
  • Programmable Slew Rate Control for EMI reduction

Clock Management

The XC2S200-6FGG599C integrates four Delay-Locked Loops (DLLs) for advanced clock management:

  • Four DLLs positioned at each corner of the die
  • Clock Deskew capabilities for eliminating clock distribution delays
  • Clock Multiplication and Division for flexible frequency synthesis
  • Phase Shifting for precise timing adjustments

XC2S200-6FGG599C Application Areas

Industrial Applications

The XC2S200-6FGG599C excels in various industrial applications:

  • Industrial Automation and process control systems
  • Motor Control with high-speed feedback processing
  • Machine Vision and image processing systems
  • Programmable Logic Controllers (PLCs)

Telecommunications Infrastructure

Ideal for telecommunications applications including:

  • Network Switches and Routers requiring high-speed packet processing
  • Base Station Equipment for wireless infrastructure
  • Protocol Conversion and data encoding/decoding
  • Channel Coding and error correction

Consumer Electronics

The XC2S200-6FGG599C serves various consumer electronics markets:

  • Digital Video Processing and display controllers
  • Audio Processing Systems with multi-channel support
  • Gaming Console Components requiring fast logic processing
  • Set-Top Boxes and multimedia devices

Automotive Systems

Automotive applications benefit from the XC2S200-6FGG599C’s reliability:

  • Advanced Driver Assistance Systems (ADAS)
  • Infotainment System Controllers
  • Body Electronics and lighting control
  • Diagnostic and Monitoring Systems

Why Choose the XC2S200-6FGG599C?

Cost-Effective ASIC Alternative

The XC2S200-6FGG599C offers significant advantages over mask-programmed ASICs:

  1. Eliminates NRE Costs – No expensive mask development required
  2. Reduces Time-to-Market – Programmable architecture enables rapid prototyping
  3. Enables Field Upgrades – In-system reprogrammability allows design updates without hardware replacement
  4. Reduces Inventory Risk – Single device can serve multiple applications

Proven Spartan-II Architecture

Built on the mature Spartan-II platform, the XC2S200-6FGG599C delivers:

  • Predictable Performance with consistent timing across design iterations
  • Comprehensive Development Support through Xilinx ISE Design Suite
  • Extensive Documentation including datasheets, user guides, and application notes
  • Long-Term Availability for extended production lifecycles

For engineers seeking reliable programmable logic solutions, the Xilinx FPGA product line offers industry-leading performance and support.


XC2S200-6FGG599C Development Tools and Resources

Software Development Environment

Design implementation for the XC2S200-6FGG599C is supported by:

  • Xilinx ISE Design Suite for synthesis and implementation
  • Vivado Design Suite (for migration path to newer devices)
  • ModelSim and other third-party simulation tools
  • ChipScope Pro for real-time debugging and analysis

Configuration Options

Multiple configuration methods are available:

  • JTAG Boundary Scan for direct programming
  • Serial Configuration using Platform Flash PROMs
  • Parallel Configuration for faster loading
  • SelectMAP Mode for 8-bit parallel configuration

XC2S200-6FGG599C Ordering Information

Part Number Breakdown

XC2S200-6FGG599C decodes as follows:

Code Meaning
XC2S Spartan-II Family
200 200,000 System Gates
-6 Speed Grade (Fastest)
FG Fine Pitch BGA Package
G Pb-Free (Lead-Free)
599 599-Pin Package
C Commercial Temperature (0°C to +85°C)

Quality and Compliance

The XC2S200-6FGG599C meets stringent quality standards:

  • RoHS Compliant – Lead-free construction
  • Moisture Sensitivity Level (MSL) rated for reliable handling
  • 100% ESD Anti-Static Protection during shipping
  • Traceability to original manufacturer lots

XC2S200-6FGG599C Summary

The XC2S200-6FGG599C represents an excellent solution for engineers requiring high-performance FPGA capabilities in a cost-effective, reliable package. With its 200,000 system gates, 5,292 logic cells, advanced memory architecture, and versatile I/O capabilities, this Spartan-II device delivers the performance and flexibility needed for demanding industrial, telecommunications, and embedded applications.

Key advantages of the XC2S200-6FGG599C include:

  • High-speed -6 grade performance for timing-critical applications
  • Extensive I/O resources with 284 user-configurable pins
  • Robust 599-pin FBGA package for reliable PCB integration
  • Pb-free construction ensuring RoHS compliance
  • Field-programmable architecture enabling design flexibility and upgrades
  • Cost-effective alternative to custom ASIC development

Whether implementing digital signal processing algorithms, communication protocols, or complex control systems, the XC2S200-6FGG599C provides the programmable logic foundation for successful product development and high-volume manufacturing.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.