The AMD XC2S200-6FGG593C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, originally developed by Xilinx and now under the AMD brand. This versatile programmable logic device delivers exceptional performance for digital signal processing, embedded systems, and industrial automation applications. Engineers and designers worldwide rely on the XC2S200-6FGG593C for cost-effective, reprogrammable solutions that eliminate the lengthy development cycles associated with traditional ASICs.
Key Features of the XC2S200-6FGG593C FPGA
The XC2S200-6FGG593C stands out among programmable logic devices due to its robust architecture and comprehensive feature set. This Spartan-II FPGA provides an ideal balance between performance, power efficiency, and cost-effectiveness for high-volume applications.
High-Density Logic Resources
The XC2S200-6FGG593C FPGA delivers substantial logic capacity with 200,000 system gates and 5,292 logic cells. This generous gate count enables implementation of complex digital designs, including sophisticated signal processing algorithms and intricate control systems. The device features a 28 x 42 CLB array totaling 1,176 Configurable Logic Blocks, providing maximum design flexibility for diverse application requirements.
Advanced Memory Architecture
Memory resources in the XC2S200-6FGG593C include:
- 56K bits (57,344 bits) of block RAM organized in 14 dedicated memory blocks
- 75,264 bits of distributed RAM for efficient data buffering
- Dual-port RAM capability with independent read/write access
- Configurable memory aspect ratios supporting various data widths
High-Speed -6 Speed Grade Performance
The “-6” speed grade designation indicates this is the fastest available speed grade in the Spartan-II family. The XC2S200-6FGG593C operates at frequencies up to 263MHz using 0.18μm CMOS technology, making it suitable for demanding high-speed applications. This superior speed grade ensures optimal timing margins and reliable system performance.
XC2S200-6FGG593C Technical Specifications
Below are the comprehensive technical specifications for the AMD XC2S200-6FGG593C FPGA.
| Parameter |
Specification |
| Device Family |
Spartan-II |
| Manufacturer |
AMD (formerly Xilinx) |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Block RAM |
56K bits (14 blocks) |
| Distributed RAM |
75,264 bits |
| DLLs (Delay-Locked Loops) |
4 |
| Speed Grade |
-6 (Fastest) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Maximum Frequency |
263MHz |
| Package Type |
FGG593 (Fine-Pitch BGA) |
| Pin Count |
593 |
| Operating Temperature |
0°C to +85°C (Commercial) |
| RoHS Compliant |
Yes |
XC2S200-6FGG593C Package Information
FGG593 Ball Grid Array Package
The XC2S200-6FGG593C utilizes the FGG593 Fine-Pitch Ball Grid Array (FBGA) package, offering 593 pins for maximum I/O connectivity. This package provides:
- Compact, high-density mounting solution
- Superior thermal characteristics
- Reliable solder joint connections
- Optimal signal integrity for high-speed designs
- Surface mount technology compatibility
I/O Standards and Flexibility
The XC2S200-6FGG593C supports 16 selectable I/O standards, enabling seamless interfacing with various external devices and bus architectures. The 284 available user I/O pins accommodate numerous peripheral connections, including:
- LVTTL and LVCMOS interfaces
- SSTL and HSTL for memory interfaces
- GTL and GTL+ for processor buses
- PCI local bus compliance
Applications for the XC2S200-6FGG593C FPGA
The XC2S200-6FGG593C serves diverse industries and applications where programmable logic offers advantages over fixed-function devices.
Telecommunications and Networking
In telecommunications infrastructure, the XC2S200-6FGG593C implements protocol processing, data encoding/decoding, and network switching functions. Base stations, routers, and switches benefit from the device’s high-speed I/O and flexible logic resources.
Industrial Automation and Control
Manufacturing facilities utilize the XC2S200-6FGG593C for motor control, process automation, and machine vision applications. The FPGA’s real-time processing capabilities and reprogrammability support evolving production requirements.
Consumer Electronics
Cost-sensitive consumer applications leverage the XC2S200-6FGG593C for video processing, audio systems, and smart device interfaces. The device’s competitive pricing and adequate logic density address high-volume market demands.
Medical Equipment
Medical device manufacturers employ the XC2S200-6FGG593C in imaging systems, patient monitoring equipment, and diagnostic instruments. The FPGA’s reliability and design flexibility support stringent medical industry requirements.
Automotive Systems
Advanced driver assistance systems (ADAS), infotainment platforms, and vehicle networking applications incorporate the XC2S200-6FGG593C for programmable processing and interface management.
For additional Xilinx FPGA products and comprehensive technical support, explore our complete FPGA portfolio.
XC2S200-6FGG593C Architecture Overview
Configurable Logic Blocks (CLBs)
Each CLB in the XC2S200-6FGG593C contains four Logic Cells (LCs), with each LC comprising a 4-input function generator (Look-Up Table), carry logic, and storage elements. This architecture enables efficient implementation of both combinatorial and sequential logic functions.
Input/Output Blocks (IOBs)
The device’s IOBs provide programmable interface options between internal logic and external pins. Each IOB includes input and output buffers, optional registers, and configurable pull-up/pull-down resistors for maximum design flexibility.
Delay-Locked Loops (DLLs)
Four DLLs positioned at the device corners provide clock distribution, deskewing, and frequency synthesis capabilities. These DLLs eliminate clock distribution delays and enable advanced clock management techniques.
Block RAM Organization
The 14 block RAM modules offer 4Kbit dual-ported memory cells with independent control signals for each port. Configurable aspect ratios range from 4096×1 to 256×16, accommodating various data width requirements.
Ordering Information for AMD XC2S200-6FGG593C
Part Number Breakdown
Understanding the XC2S200-6FGG593C part number:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (highest performance)
- FGG593: Fine-pitch BGA package with 593 pins
- C: Commercial temperature range (0°C to +85°C)
Development Tools
Design implementation for the XC2S200-6FGG593C utilizes AMD (Xilinx) ISE Design Suite, providing synthesis, place-and-route, and timing analysis capabilities. The toolset supports VHDL and Verilog hardware description languages.
Why Choose the XC2S200-6FGG593C FPGA?
Cost-Effective ASIC Alternative
The XC2S200-6FGG593C eliminates non-recurring engineering costs, long development cycles, and inherent risks associated with conventional ASIC development. Design modifications can be implemented quickly without hardware changes.
Field Upgradability
In-system reprogrammability enables field upgrades, bug fixes, and feature enhancements throughout the product lifecycle. This flexibility extends product relevance and reduces maintenance costs.
Proven Reliability
Spartan-II devices demonstrate extensive field deployment history, ensuring proven reliability for critical applications. The XC2S200-6FGG593C maintains consistent performance across commercial temperature ranges.
Comprehensive Ecosystem
AMD provides extensive documentation, reference designs, IP cores, and technical support for Spartan-II FPGA development. This mature ecosystem accelerates time-to-market for new designs.
XC2S200-6FGG593C vs. Alternative FPGAs
When selecting programmable logic devices, engineers often compare the XC2S200-6FGG593C with similar offerings.
Comparison with Spartan-IIE Devices
The Spartan-IIE family offers 1.8V operation versus the XC2S200-6FGG593C’s 2.5V core voltage. While Spartan-IIE provides lower power consumption, the XC2S200-6FGG593C offers proven compatibility with existing 2.5V system designs.
Migration Considerations
For designs requiring additional logic resources, larger Spartan-II devices provide seamless migration paths. The XC2S200-6FGG593C maintains pin compatibility considerations for future scalability.
Conclusion
The AMD XC2S200-6FGG593C FPGA delivers exceptional value for digital design applications requiring substantial logic resources, high-speed performance, and flexible I/O capabilities. With 200,000 system gates, 5,292 logic cells, and the fastest -6 speed grade, this Spartan-II device addresses demanding requirements across telecommunications, industrial, consumer, medical, and automotive markets. The FGG593 package provides maximum I/O density while maintaining proven reliability for production applications.
Whether developing new products or seeking reliable programmable logic for established designs, the XC2S200-6FGG593C offers the performance, features, and cost-effectiveness that engineers demand from modern FPGA solutions.
