The XC2S200-6FGG591C is a high-performance Field Programmable Gate Array (FPGA) from the AMD Xilinx Spartan-II family. This programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, and embedded system applications. The -6 speed grade designation ensures maximum performance for timing-critical designs.
XC2S200-6FGG591C Key Features and Benefits
The XC2S200-6FGG591C combines flexibility, reliability, and cost-effectiveness in a single programmable solution. Engineers choose this FPGA as a superior alternative to mask-programmed ASICs due to its field-reprogrammable architecture and reduced development risk.
High-Density Logic Architecture
The XC2S200-6FGG591C features a robust core architecture built on proven 0.18μm CMOS technology. This FPGA provides substantial programmable resources for implementing complex digital designs across diverse applications.
Advanced I/O Flexibility
With support for 16 selectable I/O standards and multivolt interface capabilities, the XC2S200-6FGG591C ensures seamless integration with various system components operating at different voltage levels.
XC2S200-6FGG591C Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| Manufacturer |
AMD (Xilinx) |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Delay-Locked Loops (DLLs) |
4 |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Fastest) |
| Process Technology |
0.18μm CMOS |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
591 |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Yes (Pb-Free) |
XC2S200-6FGG591C Functional Block Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG591C incorporates 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains programmable look-up tables (LUTs), flip-flops, and routing resources that enable implementation of complex combinational and sequential logic functions.
Embedded Block RAM
This FPGA includes 56 Kbits of dedicated block RAM for efficient on-chip data storage. The embedded memory supports synchronous read and write operations, enabling high-speed data buffering and local storage applications.
Distributed RAM Architecture
Beyond block RAM, the XC2S200-6FGG591C provides 75,264 bits of distributed RAM implemented within the CLB fabric. This distributed memory architecture supports both synchronous and asynchronous configurations for maximum design flexibility.
Delay-Locked Loop Technology
Four integrated Delay-Locked Loops (DLLs) provide precise clock management and distribution. These DLLs eliminate clock skew, multiply and divide clock frequencies, and ensure precise phase-shift capabilities for high-performance timing applications.
Input/Output Block Features
The XC2S200-6FGG591C includes advanced IOBs supporting multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. SelectI/O technology enables programmable output drive strength, slew rate control, and selectable pull-up/pull-down resistors.
XC2S200-6FGG591C Application Areas
Telecommunications Infrastructure
The XC2S200-6FGG591C excels in telecommunications applications including base station controllers, network routers, switches, and protocol converters. High-speed signal processing capabilities enable complex modulation and demodulation schemes.
Industrial Control Systems
For industrial automation, this FPGA supports motor control algorithms, process automation, PLC implementations, and real-time sensor processing. The commercial temperature range ensures reliable operation in factory environments.
Medical Device Electronics
The XC2S200-6FGG591C finds applications in medical imaging systems, patient monitoring equipment, diagnostic instruments, and laboratory automation. Field reprogrammability enables firmware updates without hardware modifications.
Automotive Electronics
Automotive infotainment systems, advanced driver-assistance features, and vehicle network interfaces benefit from the XC2S200-6FGG591C’s reliable performance and flexible I/O configurations.
Consumer Electronics
Digital video processing, audio equipment, gaming systems, and smart home devices utilize this FPGA for custom digital signal processing and interface bridging functions.
XC2S200-6FGG591C Design Support and Development Tools
ISE Design Suite Compatibility
The XC2S200-6FGG591C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Both VHDL and Verilog HDL design flows are supported.
Configuration Options
Multiple configuration modes including JTAG, SelectMAP, and serial configuration enable flexible system integration. In-system programmability supports field updates and design modifications.
Development Resources
Engineers working with the XC2S200-6FGG591C have access to reference designs, application notes, and comprehensive technical documentation. Evaluation boards and starter kits accelerate the development process.
Why Choose the XC2S200-6FGG591C FPGA
Cost-Effective Programmable Solution
The XC2S200-6FGG591C eliminates NRE costs associated with custom ASICs while providing comparable logic density and performance for medium-volume production applications.
Reduced Time-to-Market
Field programmability and instant silicon availability significantly shorten product development cycles compared to conventional ASIC design flows.
Design Flexibility
The ability to implement design changes without hardware modifications reduces risk and enables continuous product improvements throughout the device lifecycle.
Proven Reliability
Built on AMD Xilinx’s mature Spartan-II architecture with extensive field deployment history, the XC2S200-6FGG591C delivers consistent, reliable performance.
XC2S200-6FGG591C Ordering Information
The part number XC2S200-6FGG591C decodes as follows:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade -6 (highest performance, commercial only)
- FGG: Fine-pitch Ball Grid Array, Pb-free (RoHS compliant)
- 591: Pin count
- C: Commercial temperature range (0°C to +85°C)
Related Products and Resources
For additional Xilinx FPGA products, development boards, and technical resources, explore our complete programmable logic portfolio. Contact our technical team for application support, pricing inquiries, and volume availability.