Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG591C: AMD Xilinx Spartan-II FPGA – Complete Technical Specifications and Features

Product Details

The XC2S200-6FGG591C is a high-performance Field Programmable Gate Array (FPGA) from the AMD Xilinx Spartan-II family. This programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, and embedded system applications. The -6 speed grade designation ensures maximum performance for timing-critical designs.

XC2S200-6FGG591C Key Features and Benefits

The XC2S200-6FGG591C combines flexibility, reliability, and cost-effectiveness in a single programmable solution. Engineers choose this FPGA as a superior alternative to mask-programmed ASICs due to its field-reprogrammable architecture and reduced development risk.

High-Density Logic Architecture

The XC2S200-6FGG591C features a robust core architecture built on proven 0.18μm CMOS technology. This FPGA provides substantial programmable resources for implementing complex digital designs across diverse applications.

Advanced I/O Flexibility

With support for 16 selectable I/O standards and multivolt interface capabilities, the XC2S200-6FGG591C ensures seamless integration with various system components operating at different voltage levels.

XC2S200-6FGG591C Technical Specifications

Parameter Specification
Device Family Spartan-II
Manufacturer AMD (Xilinx)
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Delay-Locked Loops (DLLs) 4
Core Voltage 2.5V
Speed Grade -6 (Fastest)
Process Technology 0.18μm CMOS
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 591
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Yes (Pb-Free)

XC2S200-6FGG591C Functional Block Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG591C incorporates 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains programmable look-up tables (LUTs), flip-flops, and routing resources that enable implementation of complex combinational and sequential logic functions.

Embedded Block RAM

This FPGA includes 56 Kbits of dedicated block RAM for efficient on-chip data storage. The embedded memory supports synchronous read and write operations, enabling high-speed data buffering and local storage applications.

Distributed RAM Architecture

Beyond block RAM, the XC2S200-6FGG591C provides 75,264 bits of distributed RAM implemented within the CLB fabric. This distributed memory architecture supports both synchronous and asynchronous configurations for maximum design flexibility.

Delay-Locked Loop Technology

Four integrated Delay-Locked Loops (DLLs) provide precise clock management and distribution. These DLLs eliminate clock skew, multiply and divide clock frequencies, and ensure precise phase-shift capabilities for high-performance timing applications.

Input/Output Block Features

The XC2S200-6FGG591C includes advanced IOBs supporting multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. SelectI/O technology enables programmable output drive strength, slew rate control, and selectable pull-up/pull-down resistors.

XC2S200-6FGG591C Application Areas

Telecommunications Infrastructure

The XC2S200-6FGG591C excels in telecommunications applications including base station controllers, network routers, switches, and protocol converters. High-speed signal processing capabilities enable complex modulation and demodulation schemes.

Industrial Control Systems

For industrial automation, this FPGA supports motor control algorithms, process automation, PLC implementations, and real-time sensor processing. The commercial temperature range ensures reliable operation in factory environments.

Medical Device Electronics

The XC2S200-6FGG591C finds applications in medical imaging systems, patient monitoring equipment, diagnostic instruments, and laboratory automation. Field reprogrammability enables firmware updates without hardware modifications.

Automotive Electronics

Automotive infotainment systems, advanced driver-assistance features, and vehicle network interfaces benefit from the XC2S200-6FGG591C’s reliable performance and flexible I/O configurations.

Consumer Electronics

Digital video processing, audio equipment, gaming systems, and smart home devices utilize this FPGA for custom digital signal processing and interface bridging functions.

XC2S200-6FGG591C Design Support and Development Tools

ISE Design Suite Compatibility

The XC2S200-6FGG591C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Both VHDL and Verilog HDL design flows are supported.

Configuration Options

Multiple configuration modes including JTAG, SelectMAP, and serial configuration enable flexible system integration. In-system programmability supports field updates and design modifications.

Development Resources

Engineers working with the XC2S200-6FGG591C have access to reference designs, application notes, and comprehensive technical documentation. Evaluation boards and starter kits accelerate the development process.

Why Choose the XC2S200-6FGG591C FPGA

Cost-Effective Programmable Solution

The XC2S200-6FGG591C eliminates NRE costs associated with custom ASICs while providing comparable logic density and performance for medium-volume production applications.

Reduced Time-to-Market

Field programmability and instant silicon availability significantly shorten product development cycles compared to conventional ASIC design flows.

Design Flexibility

The ability to implement design changes without hardware modifications reduces risk and enables continuous product improvements throughout the device lifecycle.

Proven Reliability

Built on AMD Xilinx’s mature Spartan-II architecture with extensive field deployment history, the XC2S200-6FGG591C delivers consistent, reliable performance.

XC2S200-6FGG591C Ordering Information

The part number XC2S200-6FGG591C decodes as follows:

  • XC2S200: Spartan-II device with 200K system gates
  • -6: Speed grade -6 (highest performance, commercial only)
  • FGG: Fine-pitch Ball Grid Array, Pb-free (RoHS compliant)
  • 591: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Related Products and Resources

For additional Xilinx FPGA products, development boards, and technical resources, explore our complete programmable logic portfolio. Contact our technical team for application support, pricing inquiries, and volume availability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.