The AMD C2S200-6FGG590C is a powerful field-programmable gate array (FPGA) from the acclaimed Spartan-II family, engineered to deliver exceptional digital processing capabilities for industrial, telecommunications, and embedded system applications. Featuring 200,000 system gates, 5,292 logic cells, and a robust 590-ball Fine-Pitch Ball Grid Array (FBGA) package, this versatile FPGA provides engineers with the flexibility and performance required for complex digital designs.
Key Features of AMD C2S200-6FGG590C FPGA
The AMD C2S200-6FGG590C combines advanced programmable logic architecture with cost-effective implementation. This Xilinx FPGA solution offers remarkable versatility across numerous application domains.
High-Density Logic Resources
The C2S200-6FGG590C delivers substantial logic capacity for demanding digital applications. With 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 array, designers gain access to extensive programmable resources. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that enable flexible implementation of complex digital circuits.
Advanced Memory Architecture
Memory resources in the AMD C2S200-6FGG590C include both distributed and block RAM configurations. The device provides 75,264 bits of distributed RAM integrated within the logic fabric, plus 56K bits of dedicated block RAM. This dual-memory architecture supports efficient data buffering, FIFO implementation, and high-speed data processing operations.
Superior Speed Performance
The -6 speed grade designation indicates optimized timing characteristics for high-performance applications. The AMD C2S200-6FGG590C achieves clock frequencies up to 263 MHz, enabling real-time signal processing and high-throughput data handling capabilities essential for modern electronic systems.
AMD C2S200-6FGG590C Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 total) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Maximum User I/O |
410 |
| Global Clock Networks |
4 |
| DLLs (Delay-Locked Loops) |
4 |
| Process Technology |
0.18 µm |
| Core Voltage |
2.5V |
| Maximum Frequency |
263 MHz |
| Speed Grade |
-6 |
| Package Type |
590-Ball FBGA (FGG590) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Status |
Compliant |
Architecture Overview of C2S200-6FGG590C
Configurable Logic Block Structure
The AMD C2S200-6FGG590C features a sophisticated CLB architecture at its core. Each CLB contains two slices with four-input LUTs capable of implementing any Boolean function. The dedicated carry logic within each slice accelerates arithmetic operations, making this FPGA ideal for digital signal processing and mathematical computations.
Input/Output Block Capabilities
The I/O architecture of the C2S200-6FGG590C supports numerous interface standards. The device accommodates LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, and SSTL signaling requirements. This multi-standard I/O capability simplifies system integration when interfacing with diverse peripheral components and memory devices.
SelectRAM Hierarchical Memory
The SelectRAM memory hierarchy in the AMD C2S200-6FGG590C provides flexible storage options. Distributed RAM within CLBs offers 16 bits per LUT for small, fast storage requirements. Block RAM modules deliver 4K-bit true dual-port memory for larger buffering needs, supporting simultaneous read and write operations.
Delay-Locked Loop Technology
Four dedicated DLLs (Delay-Locked Loops) position themselves at each corner of the C2S200-6FGG590C die. These DLLs provide clock management functions including de-skewing, frequency synthesis, and phase shifting. Clock distribution networks ensure low-skew clock delivery across the entire FPGA fabric.
Applications for AMD C2S200-6FGG590C FPGA
Telecommunications Equipment
The C2S200-6FGG590C excels in telecommunications infrastructure applications. Network routers, switches, and modems benefit from the device’s high-speed processing capabilities. Protocol conversion, data encryption, and signal conditioning functions implement efficiently within this FPGA platform.
Industrial Automation Systems
Manufacturing and process control environments leverage the AMD C2S200-6FGG590C for real-time control applications. Motor drives, programmable logic controllers (PLCs), and sensor interfaces utilize the extensive I/O resources and deterministic timing characteristics of this Spartan-II device.
Embedded Computing Platforms
Embedded system designers choose the C2S200-6FGG590C for custom processing solutions. The device serves as a co-processor alongside microcontrollers or implements complete system-on-chip designs. Hardware acceleration of algorithms significantly improves overall system performance.
Consumer Electronics
Cost-sensitive consumer applications benefit from the balanced performance and price point of the AMD C2S200-6FGG590C. Video processing, audio equipment, and gaming peripherals implement specialized functions using this programmable logic device.
Automotive Electronics
Infotainment systems, advanced driver assistance features, and vehicle network interfaces incorporate the C2S200-6FGG590C. The commercial temperature grade supports automotive cabin applications requiring reliable operation across standard temperature ranges.
Advantages of Choosing AMD C2S200-6FGG590C Over ASICs
Rapid Time-to-Market
The AMD C2S200-6FGG590C eliminates lengthy ASIC development cycles. Engineers program and reprogram the device as designs evolve, reducing product development timelines from months to weeks. This agility proves invaluable in competitive markets demanding quick innovation.
Zero Non-Recurring Engineering Costs
Unlike mask-programmed ASICs requiring expensive tooling investments, the C2S200-6FGG590C requires no NRE costs. This financial advantage makes FPGA-based solutions economically viable for low-to-medium volume production runs where ASIC amortization would be prohibitive.
Field Upgrade Capability
The in-system programmability of the AMD C2S200-6FGG590C enables post-deployment updates. Bug fixes, feature enhancements, and protocol changes implement through simple firmware updates rather than costly hardware recalls—an impossibility with fixed-function ASICs.
Design Risk Mitigation
FPGA programmability significantly reduces technical risk during product development. The C2S200-6FGG590C allows iterative design refinement without hardware modifications, ensuring final products meet all performance specifications before committing to production.
Programming and Development Tools
Design Software Environment
The AMD C2S200-6FGG590C supports industry-standard design flows using Xilinx ISE software. HDL entry through VHDL or Verilog enables sophisticated design capture. Schematic capture options accommodate designers preferring graphical design methodologies.
Simulation and Verification
Comprehensive simulation capabilities verify C2S200-6FGG590C designs before hardware implementation. Functional simulation, timing analysis, and in-circuit debugging tools ensure designs operate correctly under all specified conditions.
Configuration Options
Multiple configuration modes accommodate various system architectures. Serial and parallel configuration interfaces support external PROM-based storage. Boundary scan (JTAG) capabilities facilitate both configuration and production testing requirements.
Package Information for FGG590
Physical Dimensions
The 590-ball FBGA package of the AMD C2S200-6FGG590C features a fine-pitch ball grid array configuration. This package style balances high pin density with manageable PCB routing requirements. Ball pitch spacing accommodates standard manufacturing processes while maximizing interconnect density.
Thermal Considerations
The FGG590 package provides adequate thermal dissipation for typical operating conditions. Junction-to-ambient thermal resistance values guide thermal management strategies. Proper airflow and thermal interface materials ensure reliable long-term operation.
PCB Design Guidelines
Designing PCBs for the C2S200-6FGG590C requires attention to power distribution, signal integrity, and manufacturing constraints. Decoupling capacitor placement, power plane design, and controlled impedance routing ensure optimal FPGA performance in the final assembly.
Quality and Reliability Standards
Manufacturing Excellence
The AMD C2S200-6FGG590C undergoes rigorous quality control during manufacturing. Wafer-level testing, package-level verification, and burn-in procedures ensure each device meets published specifications. Statistical process controls maintain consistent quality across production lots.
Environmental Compliance
RoHS compliance makes the C2S200-6FGG590C suitable for environmentally conscious applications. Lead-free packaging options support green manufacturing initiatives while maintaining electrical and mechanical reliability standards.
Frequently Asked Questions About AMD C2S200-6FGG590C
What is the maximum operating frequency of the C2S200-6FGG590C?
The AMD C2S200-6FGG590C achieves maximum clock frequencies of 263 MHz with the -6 speed grade, enabling high-performance digital processing for demanding applications.
How many I/O pins does the C2S200-6FGG590C provide?
The 590-ball FBGA package offers up to 410 user-configurable I/O pins, supporting extensive peripheral connectivity and parallel interface requirements.
Is the C2S200-6FGG590C suitable for industrial applications?
Yes, the commercial temperature range (0°C to +85°C) supports industrial applications, though extended temperature variants may be required for harsh environment deployments.
What programming tools support the AMD C2S200-6FGG590C?
Xilinx ISE Design Suite provides comprehensive support for the C2S200-6FGG590C, including synthesis, place-and-route, simulation, and configuration generation capabilities.
Can the C2S200-6FGG590C replace custom ASIC designs?
The AMD C2S200-6FGG590C serves as an excellent ASIC alternative for many applications, offering comparable performance with added flexibility and reduced development costs and timelines.
Order AMD C2S200-6FGG590C Today
The AMD C2S200-6FGG590C represents a proven solution for engineers requiring reliable, high-performance FPGA capabilities. With its robust Spartan-II architecture, extensive logic resources, and flexible I/O capabilities, this device addresses diverse application requirements across telecommunications, industrial, embedded, and consumer markets.
Contact authorized distributors for current pricing, availability, and volume discount information. Technical documentation, reference designs, and application notes support rapid design adoption and successful product implementations using the AMD C2S200-6FGG590C programmable logic device.
