The XC2S200-6FGG589C is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance for industrial, telecommunications, and embedded system applications. Engineered with 0.18µm process technology and operating at 2.5V core voltage, the XC2S200-6FGG589C offers engineers a powerful and cost-effective solution for complex digital design implementations.
XC2S200-6FGG589C Product Overview and Key Features
The XC2S200-6FGG589C belongs to the Spartan-II FPGA family, which represents AMD Xilinx’s second-generation ASIC replacement technology. This Xilinx FPGA device provides unlimited reprogrammability and serves as a superior alternative to mask-programmed ASICs, eliminating initial costs and lengthy development cycles while enabling field upgrades without hardware replacement.
XC2S200-6FGG589C Technical Specifications
Logic Resources and Gate Count
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Higher Performance) |
Memory Architecture and RAM Specifications
The XC2S200-6FGG589C features a comprehensive memory architecture designed for high-performance digital signal processing and data-intensive applications:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks) |
| RAM per Block |
4,096 bits |
| Dual-Port Support |
Yes |
Package Information and Pinout Details
| Specification |
Value |
| Package Type |
FGG589 Fine Pitch BGA |
| Total Pins |
589 |
| Pin Pitch |
1.0mm |
| Package Technology |
Pb-Free (RoHS Compliant) |
| Mounting Type |
Surface Mount (SMD) |
Electrical Characteristics and Power Requirements
Recommended Operating Conditions
| Parameter |
Min |
Typical |
Max |
Unit |
| Core Supply (VCCINT) |
2.375 |
2.5 |
2.625 |
V |
| I/O Supply (VCCO) |
1.4 |
2.5/3.3 |
3.6 |
V |
| Operating Temperature (Commercial) |
0 |
– |
85 |
°C |
| Operating Temperature (Industrial) |
-40 |
– |
100 |
°C |
| Maximum Frequency |
– |
263 |
– |
MHz |
Supported I/O Standards and Interface Protocols
The XC2S200-6FGG589C supports 16 high-performance I/O interface standards, providing exceptional versatility for system integration:
| I/O Standard |
VREF (V) |
VCCO (V) |
VTT (V) |
| LVTTL (2-24mA) |
N/A |
3.3 |
N/A |
| LVCMOS2 |
N/A |
2.5 |
N/A |
| PCI (33/66 MHz) |
N/A |
3.3 |
N/A |
| GTL |
0.8 |
N/A |
1.2 |
| GTL+ |
1.0 |
N/A |
1.5 |
| HSTL Class I |
0.75 |
1.5 |
0.75 |
| HSTL Class III/IV |
0.9 |
1.5 |
1.5 |
| SSTL2 Class I/II |
1.25 |
2.5 |
1.25 |
| SSTL3 Class I/II |
1.5 |
3.3 |
1.5 |
| AGP-2X |
1.32 |
3.3 |
N/A |
XC2S200-6FGG589C Architecture and Design Features
Configurable Logic Block (CLB) Structure
Each CLB in the XC2S200-6FGG589C contains four logic cells organized in two slices. Key CLB features include:
- 4-input Look-Up Tables (LUTs) for function generation
- Dedicated carry logic for high-speed arithmetic operations
- Cascade chain for wide-input functions
- Edge-triggered D-type flip-flops or level-sensitive latches
- Efficient multiplier support for DSP applications
Clock Distribution and Delay-Locked Loops (DLLs)
The XC2S200-6FGG589C incorporates four fully digital Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:
- Zero propagation delay clock distribution
- Low clock skew across the device
- Clock doubling capability
- Clock division by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Four quadrature phases of the source clock
Industrial Applications and Use Cases
Target Markets and Industry Applications
The XC2S200-6FGG589C is optimized for high-volume, cost-sensitive applications across multiple industries:
- Telecommunications Infrastructure: Base stations, switches, routers, and network equipment
- Industrial Automation: Motor control, process automation, and PLC systems
- Consumer Electronics: Set-top boxes, digital displays, and audio/video processing
- Automotive Systems: ADAS, infotainment, and vehicle networking
- Medical Devices: Diagnostic equipment and patient monitoring systems
- Aerospace and Defense: Embedded computing and signal processing
Configuration Modes and Programming Options
The XC2S200-6FGG589C supports multiple configuration modes for flexible system integration:
| Configuration Mode |
CCLK Direction |
Data Width |
Description |
| Master Serial |
Output |
1-bit |
FPGA controls configuration from serial PROM |
| Slave Serial |
Input |
1-bit |
External source provides configuration data |
| Slave Parallel |
Input |
8-bit |
Fastest configuration option |
| Boundary Scan (JTAG) |
N/A |
1-bit |
IEEE 1149.1 compliant |
Configuration File Size Requirements
Configuration bitstream size for XC2S200: 1,335,840 bits (approximately 163 KB)
Development Tools and Design Software
The XC2S200-6FGG589C is fully supported by AMD Xilinx’s comprehensive development ecosystem:
- ISE Design Suite: Complete design environment for synthesis, implementation, and verification
- Simulation Support: Timing simulation and in-circuit debugging capabilities
- IP Core Library: Over 400 verified primitives and macros
- EDIF Support: Standard interface for design interchange
IEEE 1149.1 Boundary Scan and JTAG Support
The XC2S200-6FGG589C implements full IEEE 1149.1 boundary scan capability, supporting all mandatory instructions including EXTEST, SAMPLE/PRELOAD, and BYPASS. Additional supported instructions include USERCODE, IDCODE, and dedicated configuration instructions for in-system programming and readback verification.
Part Number Nomenclature and Ordering Information
XC2S200-6FGG589C Part Number Breakdown
| Segment |
Value |
Meaning |
| XC2S200 |
Device |
Spartan-II 200K system gates |
| -6 |
Speed Grade |
Higher performance grade |
| FGG |
Package Type |
Fine Pitch BGA (Pb-Free) |
| 589 |
Pin Count |
589-ball BGA package |
| C |
Temperature Range |
Commercial (0°C to +85°C) |
Quality Standards and Environmental Compliance
- RoHS Compliant: Lead-free (Pb-free) packaging option available
- PCI Compliant: Fully compatible with PCI 3.3V/5V specifications
- Hot Swap: CompactPCI friendly design
- ESD Protection: Built-in electrostatic discharge protection on all pads
Why Choose the XC2S200-6FGG589C for Your Design
The XC2S200-6FGG589C represents an optimal balance of performance, flexibility, and cost-effectiveness for programmable logic applications. With 200,000 system gates, 56K bits of block RAM, support for 16 I/O standards, and four DLLs for advanced clock management, this Spartan-II FPGA delivers the resources needed for demanding embedded and industrial applications. The -6 speed grade ensures higher performance operation, while the Pb-free FGG589 package provides environmental compliance and reliable surface-mount integration.
Whether you’re developing telecommunications equipment, industrial automation systems, or consumer electronics, the XC2S200-6FGG589C provides a proven, reliable foundation for your programmable logic designs backed by AMD Xilinx’s comprehensive development tools and technical support infrastructure.
