Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG588C: AMD Xilinx Spartan-II FPGA with 200K System Gates

Product Details

The XC2S200-6FGG588C is a high-performance Field Programmable Gate Array (FPGA) from the renowned AMD Xilinx Spartan-II family. This cost-effective programmable logic device delivers exceptional processing capabilities with 200,000 system gates and 5,292 logic cells, making it an ideal solution for telecommunications, industrial automation, and embedded system applications.

XC2S200-6FGG588C Key Features and Specifications

The XC2S200-6FGG588C combines advanced programmable logic architecture with industry-leading reliability. As a member of the Xilinx FPGA Spartan-II family, this device offers engineers a superior alternative to mask-programmed ASICs with unlimited in-system reprogrammability.

XC2S200-6FGG588C Technical Specifications

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM Bits 75,264
Block RAM Bits 56K
Delay-Locked Loops (DLLs) 4
Maximum Frequency 263 MHz
Process Technology 0.18µm
Core Voltage 2.5V
Package Type Fine Pitch Ball Grid Array (FBGA)
Speed Grade -6 (Commercial)
Operating Temperature 0°C to +85°C

XC2S200-6FGG588C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG588C features 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB contains four logic cells (LCs) organized in two slices, providing the building blocks for implementing complex digital designs. The logic cells include 4-input function generators implemented as look-up tables (LUTs), carry logic for high-speed arithmetic operations, and storage elements for sequential logic.

Block RAM Memory Architecture

This Spartan-II FPGA integrates 14 dedicated block RAM modules providing 56 Kbits of on-chip memory. Each block RAM cell is a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The configurable data widths support flexible memory configurations for data buffering, FIFO implementation, and embedded memory applications.

Distributed RAM Resources

In addition to block RAM, the XC2S200-6FGG588C provides 75,264 bits of distributed RAM implemented through the LUTs in the CLBs. This distributed memory architecture enables shallow memory structures and complements the block RAM for optimized memory utilization.

Delay-Locked Loop (DLL) Technology

Four Delay-Locked Loops positioned at each corner of the die provide advanced clock management capabilities. The DLLs support clock deskewing, frequency synthesis, and clock mirroring for board-level clock distribution, enabling system performance up to 200 MHz.

XC2S200-6FGG588C I/O Standards and Interface Support

Supported I/O Standards

The XC2S200-6FGG588C supports 16 different I/O standards for seamless integration with various system components:

  • LVTTL (Low Voltage TTL)
  • LVCMOS (Low Voltage CMOS)
  • PCI (Peripheral Component Interconnect)
  • GTL (Gunning Transceiver Logic)
  • GTL+
  • HSTL (High-Speed Transceiver Logic)
  • SSTL (Stub Series Terminated Logic)
  • CTT (Center Tap Terminated)
  • AGP (Accelerated Graphics Port)

I/O Bank Architecture

The device organizes I/Os into banks, allowing multiple voltage standards to coexist on a single device. LVTTL, LVCMOS2, and PCI inputs are 5V tolerant, providing robust interfacing capabilities with legacy systems and mixed-voltage designs.

XC2S200-6FGG588C Package Information

FBGA Package Specifications

The XC2S200-6FGG588C utilizes a Fine Pitch Ball Grid Array (FBGA) package that provides excellent thermal performance, superior signal integrity, and reliable solder joint connections. This surface mount package is optimized for automated assembly processes and high-density PCB designs.

Pin Configuration

The package provides 284 user-programmable I/O pins plus four dedicated global clock input pins. The ball grid array configuration ensures short signal paths and reduced inductance for high-speed digital applications.

XC2S200-6FGG588C Applications

Industrial Automation

The XC2S200-6FGG588C excels in industrial control systems requiring real-time processing, motor control, and programmable logic controller (PLC) replacement applications.

Telecommunications Equipment

This FPGA is well-suited for telecommunications infrastructure including base station equipment, network switches, and protocol conversion applications requiring flexible and reprogrammable hardware.

Embedded Systems

The combination of logic resources, memory, and I/O flexibility makes the XC2S200-6FGG588C ideal for embedded applications including digital signal processing, control systems, and custom peripheral interfaces.

Consumer Electronics

Cost-sensitive consumer applications benefit from the XC2S200-6FGG588C’s combination of performance and value, enabling rapid product development and field-upgradeable designs.

Automotive Applications

Industrial temperature range options support automotive electronics applications requiring reliable operation in harsh environmental conditions.

XC2S200-6FGG588C Development Tools and Software

Xilinx ISE Design Suite

The XC2S200-6FGG588C is fully supported by the Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. The development environment supports both VHDL and Verilog hardware description languages.

Configuration Options

Multiple configuration modes are available including:

  • Master Serial Mode
  • Slave Serial Mode
  • Slave Parallel Mode
  • Boundary Scan (JTAG)

Configuration data can be stored in external serial PROMs, flash memory, or delivered from a microprocessor for maximum flexibility.

XC2S200-6FGG588C Ordering Information

Part Number Breakdown

  • XC2S200: Device designation (200K system gates)
  • -6: Speed grade (fastest, Commercial temperature only)
  • FGG: Fine Pitch BGA package with Pb-free option
  • 588: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Pb-Free Packaging

The “G” in the package designation indicates Pb-free (lead-free) packaging, compliant with RoHS environmental regulations for electronic components.

Why Choose the XC2S200-6FGG588C FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG588C eliminates the initial costs, lengthy development cycles, and inherent risks associated with conventional ASICs. FPGA programmability enables design upgrades in the field without hardware replacement.

Fast Time-to-Market

Programmable logic accelerates product development cycles, allowing engineers to implement and verify designs rapidly. Design iterations can be completed in hours rather than weeks.

Design Flexibility

Unlimited in-system reprogrammability supports evolving requirements, standards updates, and bug fixes throughout the product lifecycle.

Proven Reliability

The Spartan-II architecture has been deployed in millions of applications worldwide, demonstrating exceptional reliability and long-term availability.

XC2S200-6FGG588C Technical Documentation

Comprehensive technical documentation supports successful implementation:

  • Complete Datasheet (DS001)
  • User Guide with implementation guidelines
  • Application Notes for common design patterns
  • Development board documentation
  • Configuration and programming guides

Conclusion

The XC2S200-6FGG588C delivers an optimal balance of performance, features, and cost-effectiveness for FPGA-based designs. With 200,000 system gates, 5,292 logic cells, 56K block RAM, and support for 16 I/O standards, this Spartan-II FPGA provides engineers with a reliable, flexible platform for developing next-generation electronic systems across multiple industries.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.