The AMD XC2S200-6FGG587C is a high-performance Field Programmable Gate Array from the renowned Spartan-II FPGA family. This advanced programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, making it the ideal solution for complex embedded applications requiring reliable, cost-effective hardware implementation.

XC2S200-6FGG587C Key Features and Specifications

The XC2S200-6FGG587C represents the pinnacle of the Spartan-II product line, offering engineers and designers a powerful platform for implementing sophisticated digital designs. Built on proven 0.18-micron CMOS technology, this FPGA combines robust architecture with impressive performance characteristics.

Core Logic Architecture Specifications

The XC2S200-6FGG587C features a comprehensive logic architecture designed for maximum flexibility:

Advanced Memory Resources

The XC2S200-6FGG587C incorporates SelectRAM hierarchical memory technology, providing versatile on-chip storage solutions:

The distributed RAM configuration utilizes Look-Up Tables (LUTs) within the Configurable Logic Blocks, offering 16 bits per LUT for shallow memory structures. This enables rapid data access for applications requiring small, fast memory arrays distributed throughout the device fabric.

Block RAM resources consist of dedicated 4K-bit memory blocks organized in two columns along the vertical edges of the die. These synchronous dual-port memories support independent read and write operations, making them ideal for FIFO buffers, data storage, and high-bandwidth applications.

Clock Management with Delay-Locked Loops

The XC2S200-6FGG587C includes four dedicated Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These DLLs provide:

• Zero propagation delay for internal clock distribution
• Low clock skew between output clock signals
• Clock multiplication and division capabilities
• Board-level clock deskewing across multiple devices
• Automatic phase alignment for optimal timing performance

Flexible I/O Standards Support

The device supports 16 selectable I/O standards through its SelectIO interface technology, enabling seamless integration with various system components and voltage domains. The multi-voltage I/O capability allows communication with devices operating at different voltage levels while maintaining signal integrity.

XC2S200-6FGG587C Package Information

The FGG587 package is a Fine-Pitch Ball Grid Array configuration featuring 587 solder balls arranged in a compact footprint. This Pb-free (RoHS compliant) package option includes the “G” designation indicating lead-free construction for environmentally conscious design requirements.

Package Characteristics

Industrial Applications for XC2S200-6FGG587C

The versatility of the XC2S200-6FGG587C makes it suitable for diverse application domains where programmable logic provides distinct advantages over fixed-function alternatives.

Telecommunications and Networking

Network equipment manufacturers leverage the XC2S200-6FGG587C for implementing protocol processing, packet switching, and data encoding/decoding functions. The high-speed I/O capabilities enable efficient interfacing with various communication standards.

Industrial Automation and Control

Process control systems benefit from the device’s reliable operation and real-time processing capabilities. Motor control algorithms, sensor interfaces, and programmable logic controllers utilize the flexible architecture for customized automation solutions.

Medical Device Electronics

The proven reliability of the Spartan-II family makes the XC2S200-6FGG587C appropriate for medical imaging systems, patient monitoring equipment, and diagnostic instruments requiring precise digital signal processing.

Automotive Electronics

Automotive applications including infotainment systems, driver assistance features, and vehicle communication interfaces utilize the device’s robust performance characteristics and wide temperature range operation.

Spartan-II FPGA Development Tools

Design implementation for the XC2S200-6FGG587C is supported through the Xilinx ISE Design Suite, providing comprehensive synthesis, place-and-route, and verification capabilities. The development environment supports both VHDL and Verilog hardware description languages for flexible design entry.

Configuration Options

The device supports multiple configuration modes including:

• Master Serial mode for autonomous operation
• Slave Serial mode for external controller programming
• Boundary Scan (JTAG) for development and testing
• SelectMAP parallel configuration for faster programming

Why Choose Xilinx FPGA Technology

The XC2S200-6FGG587C offers compelling advantages compared to traditional ASIC implementations. The unlimited reprogrammability eliminates NRE costs and enables field upgrades without hardware replacement. Fast time-to-market and reduced development risk make FPGAs the preferred choice for prototyping and production applications.

XC2S200-6FGG587C Ordering Information

When ordering the XC2S200-6FGG587C, the part number decodes as follows:

• XC2S200: Spartan-II device with 200K system gates
• -6: Speed grade (fastest available for commercial temperature)
• FGG: Fine-pitch BGA package with Pb-free construction
• 587: Number of package balls
• C: Commercial temperature range (0°C to 85°C)

Technical Support and Documentation

Comprehensive documentation for the XC2S200-6FGG587C includes the Spartan-II FPGA Family Data Sheet (DS001), providing detailed electrical specifications, timing parameters, and pinout information. Application notes cover design best practices, power management strategies, and configuration guidelines for successful implementation.

Conclusion

The AMD XC2S200-6FGG587C Spartan-II FPGA delivers the perfect combination of logic density, memory resources, and I/O flexibility for demanding embedded applications. With 200,000 system gates, advanced DLL clock management, and robust SelectRAM memory architecture, this device enables engineers to implement complex digital designs with confidence. The -6 speed grade ensures maximum performance, while the FGG587 package provides excellent board-level integration with full RoHS compliance.