The AMD XC2S200-6FGG585C is a high-performance field-programmable gate array from the renowned Spartan-II FPGA family. This programmable logic device delivers exceptional versatility for embedded systems, telecommunications, and industrial automation applications. As a cost-effective alternative to mask-programmed ASICs, the XC2S200-6FGG585C offers unlimited reprogrammability with the advanced features engineers demand for modern digital designs.

XC2S200-6FGG585C Key Features and Benefits

The XC2S200-6FGG585C combines second-generation ASIC replacement technology with a streamlined architecture based on the proven Virtex FPGA platform. This device provides engineers with powerful programmable logic capabilities while maintaining cost efficiency through its 0.18-micron manufacturing process.

High-Density Logic Resources

The XC2S200-6FGG585C delivers substantial logic capacity for complex digital designs:

SelectRAM Hierarchical Memory Architecture

The XC2S200-6FGG585C features a dual-layer memory system that provides flexible storage options for data buffering, lookup tables, and register files:

The configurable 4K-bit block RAM modules can operate as single-port RAM, dual-port RAM, or ROM to meet specific design requirements. Block RAM memory blocks are organized in two columns along vertical edges of the die, extending the full height of the chip for optimal routing efficiency.

XC2S200-6FGG585C Package Information

FGG585 Fine-Pitch Ball Grid Array Package

The XC2S200-6FGG585C utilizes a 585-ball fine-pitch BGA package that maximizes I/O density while maintaining excellent signal integrity and thermal performance. The “G” designation indicates Pb-free (RoHS compliant) packaging, making this device suitable for environmentally conscious manufacturing processes.

Package Specifications

Speed Grade and Operating Conditions

-6 Speed Grade Performance

The -6 speed grade designation indicates this device is optimized for the fastest performance tier in the Spartan-II family, supporting system clock rates up to 200 MHz for demanding timing-critical applications.

Important Note: The -6 speed grade is exclusively available in the Commercial temperature range, offering the highest performance for standard operating environments.

XC2S200-6FGG585C Electrical Characteristics

Power Supply Requirements

The XC2S200-6FGG585C operates with a 2.5V core voltage while supporting multiple I/O voltage standards for maximum system integration flexibility.

Advanced Clock Management with Delay-Locked Loops

Four Dedicated DLL Circuits

The XC2S200-6FGG585C incorporates four fully digital Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These DLLs provide:

• Zero propagation delay for on-chip clock distribution
• Low clock skew between output clock signals
• Clock multiplication and division capabilities
• Board-level clock deskewing across multiple devices
• Automatic duty cycle correction

The DLL circuits resolve clock distribution challenges in complex designs by eliminating clock skew and propagation delays that impact device performance. The DLL can also function as a clock mirror for multi-device synchronization.

Global Clock Distribution Network

Four primary low-skew global clock distribution nets ensure reliable clock delivery to CLB, IOB, and block RAM clock pins throughout the device.

Versatile I/O Capabilities

16 High-Performance Interface Standards

The XC2S200-6FGG585C supports a comprehensive range of I/O standards for seamless integration with diverse system components:

• LVTTL and LVCMOS
• PCI compliant interfaces
• GTL and GTL+
• SSTL (Stub Series Terminated Logic)
• HSTL (High-Speed Transceiver Logic)
• Differential signaling standards

I/O Bank Architecture

The device organizes I/O pins into banks, with each bank supporting independent VCCO voltage levels. This architecture enables mixed-voltage interfacing within a single design while maintaining signal integrity.

Hot Swap and PCI Compliance

The XC2S200-6FGG585C is fully PCI compliant and Compact PCI Hot Swap friendly, supporting live insertion and removal in compatible systems without damaging the device or disrupting system operation.

Configurable Logic Block Architecture

CLB Structure and Functionality

Each Configurable Logic Block in the XC2S200-6FGG585C contains four logic cells, with each logic cell comprising:

• 4-input function generator (Look-Up Table)
• Storage element (flip-flop or latch)
• Dedicated carry logic for high-speed arithmetic
• Cascade chain for wide-input functions

Fast Carry Logic

Dedicated carry logic enables high-speed arithmetic operations, making the XC2S200-6FGG585C ideal for digital signal processing applications requiring fast addition, subtraction, and multiplication.

Efficient Multiplier Support

The CLB architecture includes optimized paths for implementing efficient multipliers, supporting both combinatorial and pipelined multiplication structures.

Input/Output Block Features

Flexible IOB Configuration

Each IOB in the XC2S200-6FGG585C provides:

• Independent Clock Enable (CE) signals for each register
• Shared Set/Reset (SR) configurable as synchronous or asynchronous
• Optional input delay for zero hold time
• Pull-up and pull-down resistors
• Weak-keeper circuits for maintaining valid logic levels

Zero Hold Time Simplification

The optional input delay element eliminates pad-to-pad hold time requirements, significantly simplifying system timing analysis and improving design reliability.

Configuration and Programming Options

Multiple Configuration Modes

The XC2S200-6FGG585C supports various configuration interfaces:

• Master Serial mode with internal oscillator
• Slave Serial mode for daisy-chaining
• Slave Parallel (SelectMAP) mode for fast configuration
• JTAG/Boundary Scan configuration

IEEE 1149.1 Boundary Scan Support

Full IEEE 1149.1 compatible boundary scan logic enables in-system testing, debugging, and programming through the standard JTAG interface.

Unlimited Reprogrammability

Unlike mask-programmed ASICs, the XC2S200-6FGG585C can be reprogrammed unlimited times, enabling design iterations, field upgrades, and bug fixes without hardware replacement.

XC2S200-6FGG585C Application Areas

The versatility of the XC2S200-6FGG585C makes it suitable for diverse applications:

• Telecommunications infrastructure and networking equipment
• Industrial automation and control systems
• Digital signal processing implementations
• Protocol bridging and interface conversion
• Embedded computing systems
• Video and image processing
• Test and measurement equipment

Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG585C is fully supported by the Xilinx ISE development system, providing:

• Automatic mapping, placement, and routing
• Timing analysis and simulation
• Hardware debugging capabilities
• Configuration file generation

For the latest Xilinx FPGA development resources and technical documentation, engineers can access comprehensive design guides, application notes, and reference designs.

Part Number Breakdown

Understanding the XC2S200-6FGG585C part number:

XC2S200-6FGG585C Technical Specifications Summary

Conclusion

The AMD XC2S200-6FGG585C represents an excellent choice for engineers seeking a high-performance, cost-effective FPGA solution. With 200,000 system gates, comprehensive memory resources, four DLLs for advanced clock management, and support for 16 I/O standards, this Spartan-II device delivers the flexibility and performance required for modern embedded and industrial applications. The Pb-free FGG585 package ensures RoHS compliance while the -6 speed grade provides maximum performance for timing-critical designs.