The XC2S200-6FGG572C is a powerful Field-Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family, engineered to deliver exceptional performance for demanding digital applications. This cost-effective programmable logic device offers 200,000 system gates, 5,292 logic cells, and advanced clock management capabilities, making it the ideal solution for telecommunications, industrial automation, digital signal processing, and embedded control systems. With its 572-pin Fine-Pitch Ball Grid Array (FBGA) package, the XC2S200-6FGG572C provides maximum I/O flexibility and superior thermal performance for high-density PCB designs.

XC2S200-6FGG572C Key Features and Benefits

The XC2S200-6FGG572C stands out as a superior alternative to mask-programmed ASICs, eliminating initial tooling costs, reducing development cycles, and providing the flexibility of in-field programmability. Engineers choose the XC2S200-6FGG572C for projects requiring reliable performance, extensive I/O capabilities, and proven 0.18µm CMOS technology.

Why Choose the XC2S200-6FGG572C Spartan-II FPGA?

The XC2S200-6FGG572C delivers significant advantages for modern digital design projects:

• Cost-Effective Development: Avoid expensive ASIC mask charges and lengthy fabrication cycles
• In-Field Upgradability: Update designs through reprogramming without hardware replacement
• Proven Architecture: Built on AMD’s mature and reliable Spartan-II platform
• High-Speed Performance: -6 speed grade optimized for maximum operating frequency up to 263MHz
• Extensive I/O Support: Up to 284 user-configurable I/O pins for versatile system integration

For engineers seeking premium Xilinx FPGA solutions, the XC2S200-6FGG572C represents an optimal balance of performance, flexibility, and value.

XC2S200-6FGG572C Technical Specifications

Core Logic Architecture

Memory Resources

The XC2S200-6FGG572C incorporates flexible memory options for diverse application requirements:

Block RAM Features

The XC2S200-6FGG572C block RAM architecture provides:

• Fully synchronous dual-port 4,096-bit RAM blocks
• Independent control signals for each port
• Configurable data widths (1, 2, 4, 8, or 16 bits)
• Support for single-port RAM, dual-port RAM, and ROM configurations
• Two block RAM columns positioned along vertical edges

I/O Capabilities and Package Information

Electrical Characteristics

XC2S200-6FGG572C Clock Management System

Delay-Locked Loop (DLL) Architecture

The XC2S200-6FGG572C features four Delay-Locked Loops (DLLs) positioned at each corner of the die, providing advanced clock management capabilities:

• Clock De-Skew: Eliminates clock distribution delays for zero-delay clock buffering
• Frequency Synthesis: Generates clock frequencies at 1.5×, 2×, 2.5×, 3×, 4×, 5×, and 8× input frequency
• Clock Division: Divides input clock by factors of 1.5, 2, 2.5, 3, 4, 5, 8, and 16
• Phase Shifting: Provides 0°, 90°, 180°, and 270° phase outputs
• Clock Mirroring: Supports external clock synchronization through board-level feedback

Global Clock Distribution Network

The XC2S200-6FGG572C includes four dedicated global clock networks ensuring low-skew distribution to all sequential elements:

• Four global clock input pins (GCLK0-3)
• Primary global buffers (BUFGP) for external clocks
• Secondary global buffers (BUFGS) for internal clock routing
• Global clock pins usable as additional user I/Os when not required for clocking

XC2S200-6FGG572C I/O Standards Support

Supported I/O Standards

The XC2S200-6FGG572C versatile I/O blocks support multiple interface standards:

I/O Bank Configuration

The XC2S200-6FGG572C organizes I/Os into independently configurable banks:

• Eight independent VCCO supplies for FGG package variants
• Each bank supports different I/O standards simultaneously
• Flexible voltage configuration enables mixed-voltage system designs
• Internal pull-up and pull-down resistors available per pin

XC2S200-6FGG572C Configuration Options

Configuration Modes

The XC2S200-6FGG572C supports multiple configuration modes for flexible system integration:

Configuration Features

• In-System Programmability: Configure through JTAG or standard interfaces
• Readback Capability: Verify configuration data integrity
• Configuration CRC: Error detection for reliable programming
• Partial Reconfiguration: Update specific design regions (frame-based)

XC2S200-6FGG572C Applications

Industrial Automation

The XC2S200-6FGG572C excels in industrial control applications:

• Programmable Logic Controller (PLC) implementations
• Motor drive control systems
• Industrial networking interfaces (PROFINET, EtherCAT)
• Sensor data acquisition and processing
• Machine vision preprocessing

Telecommunications

Telecommunications engineers select the XC2S200-6FGG572C for:

• Protocol conversion and bridging
• Data multiplexing and switching
• Base station signal processing
• VoIP gateway implementations
• SDH/SONET interface controllers

Digital Signal Processing

The XC2S200-6FGG572C architecture supports efficient DSP implementations:

• FIR and IIR filter designs
• FFT/IFFT processors
• Digital down-converters
• Audio codec interfaces
• Video signal processing

Consumer Electronics

The XC2S200-6FGG572C finds applications in consumer products:

• Set-top box controllers
• Gaming peripheral interfaces
• Display timing controllers
• Audio/video format conversion
• Smart home device controllers

XC2S200-6FGG572C Development Ecosystem

Software Development Tools

Design with the XC2S200-6FGG572C using comprehensive toolchains:

• AMD Vivado Design Suite: Complete FPGA development environment
• ISE Design Suite: Legacy support for Spartan-II family
• ModelSim/QuestaSim: HDL simulation and verification
• Synplify Pro: Third-party synthesis optimization

Design Entry Methods

The XC2S200-6FGG572C supports multiple design methodologies:

• Verilog HDL and VHDL hardware description languages
• Schematic capture for legacy designs
• IP core integration from CoreGen library
• High-level synthesis (HLS) workflows

Available IP Cores

Accelerate XC2S200-6FGG572C development with pre-verified IP:

• UART, SPI, and I2C communication controllers
• Memory controllers (SDRAM, Flash)
• PCI interface cores
• DSP building blocks (multipliers, filters)
• Soft processor cores

XC2S200-6FGG572C Ordering Information

Part Number Breakdown

XC2S200-6FGG572C nomenclature explained:

Package Variants

XC2S200-6FGG572C Quality and Compliance

Environmental Standards

The XC2S200-6FGG572C meets stringent quality requirements:

• RoHS Compliant: Lead-free packaging (Pb-free)
• REACH Compliant: EU chemical regulations adherence
• WEEE Compliant: End-of-life recycling guidelines
• Moisture Sensitivity: MSL 3 (floor life 168 hours at ≤30°C/60% RH)

Reliability Standards

• ESD protection per JEDEC JESD22-A114
• Latch-up immunity per JEDEC JESD78
• Qualification testing per JEDEC standards

XC2S200-6FGG572C Technical Documentation

Available Resources

Access comprehensive documentation for the XC2S200-6FGG572C:

• DS001: Complete Spartan-II Family Data Sheet
• UG002: Spartan-II User Guide
• XAPP: Application notes for specific implementations
• Answer Records: Technical FAQ database

Design Support

Engineers working with the XC2S200-6FGG572C can access:

• Reference designs and example projects
• PCB layout guidelines and footprint files
• Power estimation spreadsheets
• Signal integrity analysis tools

Conclusion

The XC2S200-6FGG572C represents AMD’s commitment to delivering high-performance, cost-effective FPGA solutions for diverse applications. With 200,000 system gates, 5,292 logic cells, 56K block RAM, and comprehensive I/O flexibility in a 572-pin FBGA package, the XC2S200-6FGG572C empowers engineers to implement complex digital designs efficiently. Whether developing telecommunications equipment, industrial controllers, or consumer electronics, the XC2S200-6FGG572C provides the programmable logic foundation for innovative products. Contact your authorized AMD distributor today to learn more about integrating the XC2S200-6FGG572C into your next design project.