The XC2S200-6FGG570C is a high-density field-programmable gate array (FPGA) from the AMD Spartan-II family, engineered to deliver exceptional performance and flexibility for demanding digital design applications. This versatile FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal solution for engineers requiring robust signal processing, communications infrastructure, and industrial control systems.
XC2S200-6FGG570C Key Features and Benefits
The XC2S200-6FGG570C represents the pinnacle of the Spartan-II FPGA series, offering a comprehensive feature set designed to meet the most challenging design requirements while maintaining cost-effectiveness.
High-Density Logic Architecture
The XC2S200-6FGG570C provides engineers with substantial logic resources for implementing complex digital designs:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
Advanced Memory Configuration
This AMD FPGA delivers flexible memory options to support diverse application requirements:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Block RAM Blocks |
14 |
The dual-port block RAM architecture enables simultaneous read/write operations with independent port configurations, supporting data widths from 1 to 16 bits.
XC2S200-6FGG570C Technical Specifications
Package and Pinout Information
The XC2S200-6FGG570C utilizes the FGG570 fine-pitch ball grid array package, offering:
- Package Type: 570-Pin FBGA (Lead-Free)
- Ball Pitch: 1.0mm
- Body Size: Compact footprint for high-density PCB designs
- Mounting: Surface mount technology (SMT)
- RoHS Compliance: Lead-free, environmentally compliant
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Operating Frequency |
Up to 263 MHz |
| Speed Grade |
-6 (Highest Performance) |
| Process Technology |
0.18µm CMOS |
Operating Temperature Range
The XC2S200-6FGG570C is available in commercial temperature grade:
- Commercial: 0°C to +85°C (TJ)
Spartan-II FPGA Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG570C features a robust CLB architecture with:
- Four logic cells per CLB
- Four-input look-up tables (LUTs)
- Dedicated carry logic for arithmetic operations
- Distributed RAM capability within LUTs
- Direct feedthrough paths for enhanced routing flexibility
Input/Output Block (IOB) Features
The advanced I/O architecture supports multiple interface standards:
- LVTTL and LVCMOS (1.5V, 2.5V, 3.3V)
- PCI compliant I/O
- Programmable slew rate control
- Selectable pull-up/pull-down resistors
- Hot-swap compliance capability
Clock Distribution Network
Four Delay-Locked Loops (DLLs) provide:
- Clock deskew and phase shift
- Clock multiplication and division
- Low-jitter clock distribution
- Frequency synthesis capabilities
XC2S200-6FGG570C Applications
This versatile Xilinx FPGA excels in numerous industrial and commercial applications:
Telecommunications and Networking
- Base station digital front-ends
- Network switches and routers
- Protocol conversion bridges
- SDH/SONET framing
Industrial Control Systems
- Motor drive controllers
- PLC implementations
- Industrial automation
- Process control systems
Digital Signal Processing
- Video and image processing
- Audio codec implementations
- Filter implementations
- Data compression engines
Consumer Electronics
- Set-top boxes
- Display controllers
- Gaming peripherals
- Smart home devices
Design Resources and Development Tools
Software Support
The XC2S200-6FGG570C is fully supported by AMD ISE Design Suite, providing:
- HDL synthesis and simulation
- Place and route optimization
- Timing analysis tools
- Configuration file generation
Configuration Options
Multiple configuration modes are supported:
- Master Serial mode
- Slave Serial mode
- Slave Parallel (SelectMAP)
- Boundary Scan (JTAG)
XC2S200-6FGG570C Ordering Information
Part Number Breakdown
XC2S200-6FGG570C
| Segment |
Description |
| XC2S |
Spartan-II Family |
| 200 |
200K System Gates |
| -6 |
Speed Grade (Fastest) |
| FGG |
Fine-Pitch BGA, Lead-Free |
| 570 |
570-Pin Package |
| C |
Commercial Temperature |
Why Choose the XC2S200-6FGG570C FPGA
The XC2S200-6FGG570C offers significant advantages over traditional ASIC solutions:
- Reduced Development Time – Eliminate lengthy ASIC design cycles with rapid prototyping and iterative design refinement
- Field Upgradability – Update designs in deployed systems without hardware replacement
- Lower NRE Costs – Avoid expensive mask charges associated with custom silicon
- Design Flexibility – Modify functionality to meet evolving requirements
- Risk Mitigation – Test and validate designs before committing to production
Related Spartan-II FPGA Devices
| Device |
System Gates |
Logic Cells |
Max User I/O |
| XC2S50 |
50,000 |
1,728 |
176 |
| XC2S100 |
100,000 |
2,700 |
176 |
| XC2S150 |
150,000 |
3,888 |
260 |
| XC2S200 |
200,000 |
5,292 |
284 |
Summary
The XC2S200-6FGG570C stands as a proven, high-performance FPGA solution for engineers demanding reliability, flexibility, and cost-effectiveness. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O support in a lead-free 570-pin BGA package, this Spartan-II FPGA delivers the resources needed for sophisticated digital designs across telecommunications, industrial, and consumer applications.
Contact your authorized AMD distributor today to learn more about the XC2S200-6FGG570C and discover how this powerful FPGA can accelerate your next design project.
