IPC-9203 Users Guide – IPC-B-52 Test Patterns, BOM & Implementation Tips

If you’re implementing IPC-9202 testing for the first time, you’ll quickly discover that the test protocol document alone doesn’t answer all your practical questions. That’s exactly why IPC-9203 exists—it’s the companion users guide that explains what you “should” versus “must” do, details every test pattern on the IPC-B-52, and provides the implementation guidance that IPC-9202 leaves out.

I’ve worked with engineers who purchased IPC-9202 thinking it was all they needed, only to find themselves confused about pattern assignments, component placement, and acceptable design modifications. This guide walks you through everything IPC-9203 covers and why you need it alongside IPC-9202.

What is IPC-9203?

IPC-9203 is the “Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle.” The current version is Revision A, released in October 2022, with approximately 35+ pages of detailed guidance.

While IPC-9202 defines the test protocol (what to do), IPC-9203 explains the test vehicle itself and how to implement testing successfully (how to do it). It serves as the practical companion document that clarifies requirements, describes each test pattern in detail, and provides the bill of materials needed to build complete test assemblies.

Think of IPC-9202 as the exam requirements and IPC-9203 as the study guide that helps you pass.

IPC-9203 Document Overview

Key Definitions: Characterization vs. Qualification vs. Validation

One of the most valuable contributions of IPC-9203 is clarifying terminology that confuses many engineers. These three terms appear throughout IPC-9202 and IPC-9203, and they mean specific things:

Process Terminology Defined by IPC-9203

Understanding these distinctions matters because IPC-9202 specifies different sample sizes and rigor levels depending on whether you’re doing characterization (3 samples) versus formal qualification (10 samples).

The IPC-B-52 Test Vehicle Explained

IPC-9203 provides exhaustive detail on the IPC-B-52 test assembly—far more than IPC-9202 contains. The test vehicle was designed as a “worst case” example of process residue entrapment, representing mainstream electronics manufacturing while remaining affordable and widely usable.

IPC-B-52 History and Development

The IPC-B-52 evolved from the IEC-TB-57 test board, originally designed by the National Physical Laboratory (NPL) and GEN3 Systems Ltd. in the United Kingdom. A joint effort between NPL, GEN3, and Rockwell Collins created the IPC-B-52 version, which has since become the international standard. Version 8 of the IEC-TB-57 is identical to the IPC-B-52 standard test assembly, making it a true world standard for SIR testing.

IPC-B-52 Assembly Sections

The complete IPC-B-52 test vehicle consists of four separate sections:

The main SIR test board is the primary focus of IPC-9203, with detailed explanations of each pattern and its purpose.

IPC-B-52 Test Patterns Detailed in IPC-9203

IPC-9203 documents every test pattern on the IPC-B-52 board. Understanding these patterns is essential for interpreting test results and troubleshooting failures.

Complete IPC-B-52 Test Pattern Map

Understanding Pattern Purpose

IPC-9203 explains why each pattern exists:

Connector Patterns (1, 4, 16): These evaluate wave solder and SMT connector assembly. The J1 and J2 through-hole connectors are known to show marginal SIR performance even on well-processed boards—IPC-9203 documents this characteristic so you don’t panic when these patterns perform differently than SMT areas.

Capacitor Fields (2, 5, 8): The 0402 and 0805 capacitor patterns create entrapment sites similar to production boards. Flux residues collect between closely spaced components, making these patterns sensitive indicators of cleaning effectiveness.

Large SMT Devices (3, 6, 7, 9, 10, 13, 14): The BGA and QFP patterns are critical because they include SIR combs directly under components. This “worst case” design captures residues trapped beneath low-standoff devices—exactly where field failures often originate.

Open Areas (11, 12): IPC-9203 specifically mentions these open patterns are available for custom test structures if your product uses component types not represented on the standard B-52.

IPC-B-52 Bill of Materials (BOM)

IPC-9203 includes the complete bill of materials for populating the IPC-B-52 test assembly. All components are dummy devices with open internal connections—no functional die inside.

Key IPC-B-52 Components

IPC-9203 emphasizes that using proper dummy components is essential. Functional components would create internal paths that interfere with SIR measurements.

Component Sourcing

Several suppliers offer IPC-B-52 compatible component kits:

IPC-B-52 Design Modifications Per IPC-9203

One frequently asked question is whether you can modify the IPC-B-52 design. IPC-9203 addresses this directly.

Allowed Modifications

IPC-9203 permits certain modifications to make the test vehicle more representative of your production boards:

Laminate Material: You can (and should) use the same laminate as your production boards rather than generic FR-4.

Surface Finish: Match your production finish—ENIG, immersion silver, HASL, OSP, etc. This significantly affects SIR results.

Solder Mask: Use the same solder mask type and supplier as production.

Additional Components: The open areas (patterns 11 and 12) can accommodate custom component types not on the standard design.

Modifications Requiring Caution

IPC-9203 warns against changes that would alter the fundamental test characteristics:

• Changing comb pattern spacing
• Modifying voltage gradient relationships
• Removing standard test patterns
• Altering the card edge connector pinout

If you make significant modifications, IPC-9203 recommends documenting them thoroughly and potentially establishing your own acceptance criteria rather than using IPC-9202 defaults.

Read more IPC Standards:

IPC Standards Explained: A Comprehensive Guide to PCB & Electronics Assembly Standards

IPC 2615 Standard Explained: PCB Dimensioning & Tolerancing Requirements

MIL-STD-2000A: Military Soldering Standards for Electronic Assemblies

MIL-STD-1686: ESD Control Program Requirements for Military Electronics

IPC 1791 Standard: Everything You Need to Know About Trusted PCB Certification

MIL-STD-883: Complete Guide to Microelectronics Test Methods

J-STD-048 Explained: Complete Guide to Product Discontinuance Notifications

MIL-STD-750: Semiconductor Device Test Methods Explained

MIL-STD-454: General Requirements for Military Electronic Equipment

IPC 9194: Complete Guide to SPC for PCB Assembly Manufacturing

MIL-STD-202: Electronic Component Testing Methods & Procedures

IPC 4110: Complete Guide to Cellulose Paper Specs for Printed Circuit Boards

Boundary Scan Testing (JTAG) in PCB Design: A Complete DFT Guide

Axiomtek IPC-950 Review: Specs, Features & Performance [2026 Guide]

MIL-PRF-55681: Military Ceramic Chip Capacitor Specification Guide

Implementing IPC-9203 Guidance: Practical Tips

Based on the guidance in IPC-9203, here’s how to implement testing successfully:

Test Sample Preparation

Surface Finish Matching: IPC-9203 emphasizes that test samples must use the same surface finish as your production boards. Testing with immersion silver when your product uses ENIG produces meaningless results.

Sample Identification: Mark every test assembly with a unique identifier before processing. You’ll need to track which board showed which results during data analysis.

Storage: Store unprossessed test vehicles in controlled environments—ideally nitrogen cabinets or desiccated storage. Atmospheric contamination before processing compromises baseline measurements.

Manufacturing Process Requirements

IPC-9203 states that test vehicles must be processed at the manufacturer’s location using production equipment. Having a third-party lab build your test assemblies defeats the purpose of process qualification.

Key requirements:

• Use your production reflow oven with actual production profiles
• Apply your standard flux or solder paste
• Run through your actual cleaning process (if applicable)
• Handle boards with the same ESD and cleanliness controls as production

Testing Considerations

IPC-9203 expands on the test conditions mentioned in IPC-9202:

40°C/90% RH vs. 85°C/85% RH: Different materials perform differently at these two conditions. Some flux chemistries show better SIR at 40/90 while others perform better at 85/85. IPC-9203 discusses when to use each condition.

Test Duration: The standard 168-hour test works for most applications, but IPC-9203 notes that research suggests extending to 500+ hours may be warranted for high-reliability applications.

Data Interpretation: IPC-9203 includes guidance on handling outliers, interrupted tests, and what to do when individual patterns fail while others pass.

IPC-9203 vs. IPC-9202 vs. IPC-9201

These three standards form a complete SIR testing system:

The IPC 92xx Standard Family

Recommendation: Purchase all three if you’re serious about SIR testing. IPC-9201 provides the theoretical foundation, IPC-9202 defines requirements, and IPC-9203 shows you how to execute successfully.

Where to Get IPC-9203 and Related Resources

Official Sources for IPC-9203

Related Standards and Resources

Test Equipment and Services

IPC-9203 Frequently Asked Questions

Do I need IPC-9203 if I already have IPC-9202?

Yes. IPC-9202 defines what testing is required, but IPC-9203 explains how to implement it. Without IPC-9203, you’ll lack the detailed pattern descriptions, BOM information, and practical guidance needed to execute testing correctly. IPC specifically wrote IPC-9203 as a companion document because IPC-9202 alone doesn’t provide sufficient implementation detail.

What’s the difference between IPC-9203 and IPC-9203A?

IPC-9203A (Revision A) is the updated version released in October 2022. It includes expanded content on the IPC-B-52 Revision B design, updated guidance on test conditions, and clarified definitions. If you’re purchasing now, get Revision A—it supersedes the original 2012 version.

Can I design my own test vehicle instead of using IPC-B-52?

IPC-9203 permits alternative test vehicles, but you must establish your own pass/fail criteria in agreement with your customer. The benefit of using the standard IPC-B-52 is universal acceptance and comparable results across the industry. If you design a custom vehicle, IPC-9203 recommends referencing IPC-9201 Section 3.3.8 for important design rules.

Why do the J1 and J2 connector patterns often show lower SIR values?

This is a known characteristic of the IPC-B-52 design, documented in IPC-9203. The through-hole connector patterns frequently show marginal performance even on unprocessed control boards. This doesn’t necessarily indicate a process problem—it reflects the inherent challenge of the wave solder geometry. Evaluate these patterns in context with your other results rather than treating them as automatic failures.

How much can I modify the IPC-B-52 design and still call it compliant?

IPC-9203 allows modifications to materials (laminate, surface finish, solder mask) to match your production boards—in fact, this is encouraged. However, modifying the test pattern geometry, comb spacing, or voltage gradient relationships moves you outside the standard design. If you make significant structural changes, you should establish custom acceptance criteria rather than defaulting to IPC-9202 requirements.

Conclusion

IPC-9203 transforms IPC-9202 from a set of requirements into a practical testing program. The detailed coverage of IPC-B-52 test patterns, component BOM, and implementation guidance makes the difference between successful qualification testing and frustrating trial-and-error.

If you’re planning to implement SIR testing per IPC-9202, invest in IPC-9203 from the start. The cost is minimal compared to the time you’ll waste trying to figure out pattern assignments, component sources, and acceptable design modifications without it.

For complete coverage of SIR testing fundamentals, combine IPC-9203 with IPC-9201 (theory and troubleshooting) and IPC-9202 (formal test protocol). This three-document set gives you everything needed to plan, execute, and interpret electrochemical reliability testing for your manufacturing process.