The AMD XC2S200-6FGG560C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional value for engineers seeking cost-effective solutions for complex digital design applications. With 200,000 system gates and advanced on-chip features, the XC2S200-6FGG560C stands as a superior alternative to traditional mask-programmed ASICs.

Key Features of the AMD XC2S200-6FGG560C FPGA

The XC2S200-6FGG560C combines abundant logic resources with rich functionality at a competitive price point. This device belongs to the Spartan-II FPGA family, which has established itself as an industry standard for programmable logic applications.

Logic Capacity and System Gates

The XC2S200-6FGG560C provides 200,000 system gates with 5,292 logic cells, making it suitable for implementing sophisticated digital designs. The device features a 28 x 42 CLB (Configurable Logic Block) array with 1,176 total CLBs, offering substantial resources for complex logic implementations.

Memory Architecture

This Xilinx FPGA offers flexible memory options:

• 56K bits of Block RAM organized in 14 dedicated memory blocks
• 75,264 bits of Distributed RAM for localized storage needs
• Dual-port 4096-bit RAM with independent control signals
• Configurable memory widths from 1-bit to 16-bit data paths
• Synchronous single-port and dual-port RAM configurations

Clock Management with Delay-Locked Loops

The XC2S200-6FGG560C integrates four Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These fully digital DLLs provide:

• Zero propagation delay clock distribution
• Low clock skew between output clock signals
• Clock frequency multiplication and division capabilities
• Quadrature phase outputs for advanced timing applications
• Board-level clock deskewing across multiple FPGA devices
• System clock rates supporting up to 200 MHz operation

XC2S200-6FGG560C Technical Specifications

I/O Standards and SelectIO Interface

The XC2S200-6FGG560C supports 16 high-performance I/O standards through its SelectIO interface technology. This versatility enables seamless integration with diverse system components and communication protocols.

Supported I/O Standards

• LVTTL (Low Voltage TTL)
• LVCMOS (Low Voltage CMOS) at multiple voltage levels
• PCI 3.3V and 5V compatibility
• GTL and GTL+ for high-speed buses
• HSTL for memory interfaces
• SSTL for DDR SDRAM applications
• CTT (Center Tap Terminated)
• AGP for graphics applications

I/O Banking Structure

The device organizes its I/O pins into eight independent banks, allowing designers to implement mixed-voltage interfaces efficiently. Each bank features dedicated VCCO pins that support different output voltage requirements simultaneously.

Configurable Logic Block Architecture

The CLB serves as the fundamental building block of the XC2S200-6FGG560C architecture. Each CLB contains:

Logic Cell Components

• Four-input Look-Up Tables (LUTs) for combinational logic implementation
• Dedicated flip-flops configurable as edge-triggered D-type or level-sensitive latches
• Fast carry logic for high-speed arithmetic operations
• Multiplexer resources for efficient signal routing

Advanced CLB Features

• Four direct feedthrough paths per CLB
• Local routing for high-speed internal connections
• Cascade chains for implementing large input functions
• Independent Clock Enable (CE) signals for each register
• Synchronous Set/Reset control options

Block RAM Specifications

The XC2S200-6FGG560C includes 14 dedicated Block RAM modules providing fast embedded memory. Each 4096-bit block supports:

Dual-Port Configuration

Block RAM Features

• Fully synchronous operation
• Independent read and write clocks
• Configurable aspect ratios per port
• Byte-write enable capability
• Pipeline registers for improved timing

Package Information for XC2S200-6FGG560C

The XC2S200-6FGG560C utilizes a Fine-pitch Ball Grid Array (FBGA) package that provides excellent thermal performance and reliable signal integrity for high-density PCB designs.

Package Advantages

• Compact footprint for space-constrained applications
• Low inductance connections for high-speed signals
• Enhanced thermal dissipation characteristics
• Robust mechanical stability
• Lead-free (Pb-free) options available with “G” designation

Configuration and Programming Options

The XC2S200-6FGG560C supports multiple configuration modes for flexible system integration:

Configuration Methods

• Master Serial Mode with direct PROM connection
• Slave Serial Mode for processor-controlled loading
• Slave Parallel Mode for 8-bit wide data transfer
• JTAG Boundary Scan for in-system programming
• Daisy Chain Configuration for multi-device systems

Configuration Features

• In-system reprogrammability without hardware changes
• Bitstream encryption support
• Configuration readback capability
• Partial reconfiguration options
• Platform Flash PROM compatibility

Applications for the XC2S200-6FGG560C FPGA

The XC2S200-6FGG560C excels in numerous application domains where programmable logic provides advantages over fixed-function alternatives.

Industrial Applications

• Factory automation and motion control systems
• Programmable Logic Controller (PLC) implementations
• Industrial networking and protocol conversion
• Machine vision and image processing
• Sensor interface and data acquisition

Communications Applications

• Network switching and routing equipment
• Base station signal processing
• Protocol bridging and conversion
• SDH/SONET framing applications
• Fiber optic interface controllers

Consumer Electronics

• Digital video processing systems
• Audio codec implementations
• Display controllers and timing generators
• Gaming peripheral interfaces
• Smart home automation devices

Automotive Applications

• In-vehicle infotainment systems
• Advanced Driver Assistance Systems (ADAS)
• Automotive sensor fusion
• CAN bus interface controllers
• Dashboard display systems

Development Tools and Software Support

Engineers working with the XC2S200-6FGG560C benefit from comprehensive development tool support.

Design Software

• Xilinx ISE Design Suite for legacy Spartan-II development
• Integrated HDL synthesis and simulation
• Automatic place-and-route optimization
• Static timing analysis tools
• Power estimation utilities

Design Entry Options

• VHDL and Verilog HDL support
• Schematic capture capability
• IP core integration
• Third-party EDA tool compatibility

Comparison with ASIC Solutions

The XC2S200-6FGG560C offers significant advantages compared to traditional ASIC implementations:

Cost Benefits

• Eliminates high Non-Recurring Engineering (NRE) costs
• No mask charges or fabrication setup fees
• Reduced time-to-market for new products
• Lower inventory risk with field-programmable devices

Design Flexibility

• In-field design upgrades without hardware replacement
• Rapid prototyping and iteration cycles
• Bug fixes implementable post-deployment
• Feature additions through bitstream updates

Quality and Compliance Standards

The XC2S200-6FGG560C meets stringent quality and environmental standards:

• Commercial temperature range: 0°C to +85°C
• Industrial temperature variants available
• RoHS compliance for environmental responsibility
• ISO quality management certification
• Automotive qualification options (AEC-Q100)

Ordering Information for XC2S200-6FGG560C

When ordering the XC2S200-6FGG560C, the part number breaks down as follows:

Conclusion

The AMD XC2S200-6FGG560C Spartan-II FPGA delivers an optimal combination of logic capacity, memory resources, and I/O flexibility for cost-sensitive programmable logic applications. With 200,000 system gates, 56K bits of block RAM, four DLLs, and support for 16 I/O standards, this device provides the performance and features needed for industrial, communications, consumer, and automotive applications. Its unlimited reprogrammability and comprehensive development tool support make the XC2S200-6FGG560C an ideal choice for designers seeking ASIC-alternative solutions with reduced development risk and faster time-to-market.