The XC2S200-6FGG555C is a high-density Field Programmable Gate Array (FPGA) from AMD’s proven Spartan-II family. Engineered for demanding industrial and commercial applications, this versatile programmable logic device delivers exceptional performance with cost-effective implementation. Whether you’re designing embedded systems, telecommunications equipment, or industrial control solutions, the XC2S200-6FGG555C provides the flexibility and reliability engineers require.
Key Features of the XC2S200-6FGG555C FPGA
The XC2S200-6FGG555C stands out as a superior alternative to traditional mask-programmed ASICs. This device eliminates the initial cost barriers, reduces lengthy development cycles, and removes the inherent risks associated with conventional ASIC designs.
Advanced System-Level Specifications
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Operating Frequency |
Up to 263 MHz |
| Process Technology |
0.18 µm |
| Core Voltage |
2.5V |
Memory Architecture
The XC2S200-6FGG555C features a hierarchical SelectRAM memory system that provides designers with flexible storage options:
- Distributed RAM: 75,264 bits using 16 bits per LUT configuration
- Block RAM: 56K bits organized in dedicated 4K-bit memory blocks
- Fast RAM Interfaces: Optimized routing for efficient external RAM connectivity
XC2S200-6FGG555C Technical Specifications
Speed Grade and Temperature Rating
The -6 speed grade designation indicates this device operates within the commercial temperature range of 0°C to 85°C (TJ). This makes the XC2S200-6FGG555C ideal for standard industrial environments where extreme temperature variations are not expected.
Package Information
The FGG555 package utilizes Fine-pitch Ball Grid Array (FBGA) technology. The “G” designation indicates Pb-free (lead-free) packaging, ensuring RoHS compliance for environmentally conscious manufacturing processes.
Package Advantages
- High pin density in compact form factor
- Excellent thermal dissipation characteristics
- Reliable solder joint connections
- Space-efficient board mounting
Spartan-II Architecture Overview
The XC2S200-6FGG555C leverages the streamlined Spartan-II architecture based on proven Virtex FPGA technology. This second-generation ASIC replacement platform delivers enterprise-level features at significantly reduced costs.
Configurable Logic Blocks (CLBs)
Each CLB contains programmable logic elements that can implement combinational and sequential logic functions. The 28 x 42 CLB array provides substantial resources for complex digital designs.
Input/Output Blocks (IOBs)
The device supports up to 284 user-configurable I/Os with these interface standards:
- LVTTL and LVCMOS (1.5V, 2.5V, 3.3V)
- PCI compliant interfaces
- GTL and GTL+ signaling
- SSTL and HSTL standards
- Differential signaling support
Clock Management
Four dedicated Delay-Locked Loops (DLLs) provide advanced clock control features:
- Clock deskewing and multiplication
- Phase shifting capabilities
- Low-skew global clock distribution
- Board-level clock synchronization
Applications for the XC2S200-6FGG555C
This versatile Xilinx FPGA serves numerous application domains where programmable logic provides distinct advantages over fixed-function alternatives.
Industrial Automation
The XC2S200-6FGG555C excels in factory automation systems requiring real-time signal processing and motor control implementations. Its reconfigurable nature allows for field upgrades without hardware modifications.
Telecommunications Equipment
Network infrastructure equipment benefits from the high-speed interfaces and substantial logic resources. Applications include:
- Protocol conversion bridges
- Data switching fabrics
- Signal processing modules
- Interface adapters
Embedded Systems
Designers leverage the XC2S200-6FGG555C for custom peripheral implementations and system integration tasks where flexibility and time-to-market are critical factors.
Consumer Electronics
High-volume, cost-sensitive consumer applications benefit from the economical pricing and proven reliability of the Spartan-II platform.
Development Tools and Support
Design Software Compatibility
The XC2S200-6FGG555C is fully supported by Xilinx ISE development tools, providing:
- Automatic mapping, placement, and routing
- Comprehensive simulation capabilities
- Timing analysis and optimization
- Configuration file generation
Configuration Options
Multiple configuration modes accommodate various system requirements:
- Master Serial Mode
- Slave Serial Mode
- Master Parallel Mode (SelectMAP)
- JTAG/Boundary Scan configuration
Why Choose the XC2S200-6FGG555C?
Cost-Effective Performance
The Spartan-II family delivers optimal price-to-performance ratios for volume production while maintaining the flexibility advantages of programmable logic.
Unlimited Reprogrammability
Unlike one-time-programmable alternatives, the XC2S200-6FGG555C supports unlimited configuration cycles. This enables:
- In-system design iterations
- Field upgrades and enhancements
- Bug fixes without hardware replacement
- Product feature customization
Proven Reliability
Based on mature 0.18 µm CMOS process technology, the device offers documented reliability metrics suitable for mission-critical applications.
Full IEEE 1149.1 Compliance
Integrated boundary scan logic simplifies board-level testing and production verification procedures.
Ordering Information
When specifying the XC2S200-6FGG555C, the part number breakdown follows this convention:
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (commercial temperature)
- FGG: Fine-pitch BGA package, Pb-free
- 555: Pin count
- C: Commercial temperature range
Conclusion
The XC2S200-6FGG555C represents an excellent choice for engineers requiring high-density programmable logic with proven reliability and comprehensive development support. Its combination of substantial system gates, flexible memory architecture, and versatile I/O capabilities makes it suitable for diverse application requirements ranging from industrial automation to telecommunications infrastructure.
For design-in support, technical documentation, and development resources, consult the official AMD (formerly Xilinx) documentation portal or contact authorized distribution partners.