Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG548C: High-Performance AMD Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG548C is a powerful field-programmable gate array (FPGA) from AMD’s renowned Spartan-II family. Engineered with advanced 0.18µm CMOS technology, this versatile programmable logic device delivers exceptional performance for cost-sensitive embedded systems and industrial automation projects. Whether you’re designing telecommunications equipment, consumer electronics, or complex control systems, the XC2S200-6FGG548C offers the ideal combination of logic density, speed, and reliability.


Key Features of XC2S200-6FGG548C AMD FPGA

The XC2S200-6FGG548C stands out as a superior alternative to traditional mask-programmed ASICs. This device eliminates lengthy development cycles while providing unlimited reprogrammability for seamless field upgrades.

XC2S200-6FGG548C Technical Specifications Overview

Specification Value
Manufacturer AMD (formerly Xilinx)
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLBs (Configurable Logic Blocks) 1,176
Total RAM Bits 57,344
Maximum User I/O 284
Block RAM 14 × 4Kb Dual-Port Blocks
Delay-Locked Loops (DLLs) 4
Maximum Clock Frequency 263 MHz
Core Voltage 2.5V
Package Type 548-Pin Fine-Pitch BGA (FBGA)
Process Technology 0.18µm CMOS
Operating Temperature 0°C to +85°C (Commercial)

XC2S200-6FGG548C Architecture and Design Features

Advanced Configurable Logic Block (CLB) Structure

The XC2S200-6FGG548C features 1,176 configurable logic blocks arranged in an optimized array architecture. Each CLB contains four logic cells (LCs), with every LC incorporating a 4-input function generator, carry logic, and a storage element. The function generators operate as 4-input look-up tables (LUTs) capable of implementing any arbitrarily defined Boolean function of four inputs.

SelectRAM Hierarchical Memory System

This AMD FPGA incorporates a powerful dual-tier memory hierarchy. The distributed RAM uses 16 bits per LUT for high-speed local storage, while 14 dedicated 4Kb block RAM modules provide true dual-port functionality for larger data structures. Each block RAM cell is fully synchronous with independent control signals for simultaneous read/write operations.

Four Integrated Delay-Locked Loops (DLLs)

The XC2S200-6FGG548C includes four DLLs positioned at each corner of the die. These provide clock distribution with minimal skew, supporting system frequencies up to 263 MHz. The DLLs also function as clock mirrors for precise timing control in high-speed interfaces.


XC2S200-6FGG548C Package Information

548-Pin FBGA Package Specifications

The fine-pitch ball grid array package ensures reliable high-density interconnections while maintaining excellent thermal characteristics. This surface-mount package supports automated assembly processes and provides superior electrical performance for demanding applications.

Package Parameter Specification
Pin Count 548
Package Style FBGA (Fine-pitch Ball Grid Array)
Mounting Type Surface Mount
Ball Pitch 1.0mm
RoHS Compliance Available

XC2S200-6FGG548C I/O Capabilities and Standards

Flexible Input/Output Architecture

The XC2S200-6FGG548C provides up to 284 user-configurable I/O pins organized into multiple banks. Each I/O block (IOB) contains three registers for input, output, and output enable functions. The programmable pull-up and pull-down resistors simplify system design by reducing external component requirements.

Supported I/O Standards

This Spartan-II FPGA supports multiple single-ended I/O standards including:

  • LVTTL – Low Voltage TTL (3.3V)
  • LVCMOS2 – Low Voltage CMOS (2.5V)
  • PCI – Peripheral Component Interconnect compliant
  • GTL+ – Gunning Transceiver Logic Plus
  • SSTL – Stub Series Terminated Logic

XC2S200-6FGG548C Configuration Options

Multiple Programming Modes

The XC2S200-6FGG548C supports flexible configuration through several interfaces. The device automatically loads configuration data from external sources at power-up, with multiple mode options available.

Serial Configuration

Master Serial mode uses the internal oscillator to generate CCLK, driving external PROMs. Slave Serial mode accepts externally-generated clock signals for daisy-chain configurations with multiple FPGAs.

Parallel Configuration

SelectMAP mode provides an 8-bit bidirectional data interface for high-speed configuration and readback. This parallel approach significantly reduces configuration time for production environments.

JTAG Boundary Scan

Full IEEE 1149.1 boundary scan support enables in-system programming, debugging, and production testing through standard JTAG interfaces.


Typical Applications for XC2S200-6FGG548C FPGA

The XC2S200-6FGG548C excels across diverse application domains requiring programmable logic solutions:

Telecommunications and Networking

Implement custom protocol bridges, data encryption engines, and interface controllers for networking equipment. The abundant logic resources support complex packet processing and routing functions.

Industrial Automation

Deploy the XC2S200-6FGG548C in motor control systems, PLC replacements, and sensor interface applications. The reliable commercial temperature range ensures consistent operation in factory environments.

Consumer Electronics

Cost-effective high-volume production benefits from the Spartan-II family’s optimized die size and mature fabrication process. Applications include video processing, audio systems, and display controllers.

Embedded Systems Development

Rapid prototyping and development platforms leverage the XC2S200-6FGG548C’s in-system reprogrammability. Iterate designs quickly without hardware modifications.


Development Tools and Software Support

AMD Vivado and ISE Design Suite Compatibility

Design entry, synthesis, and implementation for the XC2S200-6FGG548C utilize AMD’s comprehensive development environment. The ISE Design Suite provides optimized tools specifically for Spartan-II architecture.

IP Core Availability

Accelerate development with verified intellectual property cores for common functions including UART, SPI, I2C, and memory controllers. The Xilinx FPGA ecosystem offers extensive resources for rapid deployment.


Why Choose XC2S200-6FGG548C for Your Design

Cost-Effective ASIC Replacement

The XC2S200-6FGG548C eliminates expensive mask charges, lengthy fabrication cycles, and inherent risks associated with conventional ASICs. Programmability enables field upgrades without hardware replacement, dramatically reducing total cost of ownership.

Proven Reliability

Built on mature 0.18µm process technology, the Spartan-II family delivers consistent performance backed by AMD’s extensive quality programs. The commercial temperature grade ensures reliable operation from 0°C to +85°C.

Scalable Migration Path

Designs targeting the XC2S200-6FGG548C can migrate to larger Spartan-II family members or transition to newer AMD FPGA families as requirements evolve. Pin-compatible options simplify board redesigns.


XC2S200-6FGG548C Ordering Information

Part Number Breakdown

Code Element Meaning
XC2S Spartan-II Family
200 200K System Gates
-6 Speed Grade (-6 is fastest commercial)
FGG Fine-pitch BGA Package Type
548 Pin Count
C Commercial Temperature (0°C to +85°C)

Speed Grade Options

The “-6” speed grade designates the fastest timing available for commercial temperature operation. This premium speed grade delivers optimal performance for timing-critical applications requiring maximum clock frequencies.


Conclusion: XC2S200-6FGG548C High-Performance Programmable Logic

The AMD XC2S200-6FGG548C represents an excellent choice for engineers seeking proven, cost-effective programmable logic solutions. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O flexibility in a reliable 548-pin FBGA package, this Spartan-II FPGA addresses demanding requirements across telecommunications, industrial, and embedded applications. The combination of high performance, competitive pricing, and unlimited reprogrammability makes the XC2S200-6FGG548C the smart choice for both new designs and ASIC replacement projects.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.