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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG546C Spartan-II FPGA: High-Performance Programmable Logic Solution

Product Details

The XC2S200-6FGG546C is a powerful field-programmable gate array from the renowned Spartan-II family, delivering exceptional performance and flexibility for demanding digital design applications. This commercial-grade FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal choice for telecommunications, industrial automation, and embedded system applications.

Key Features of the XC2S200-6FGG546C FPGA

Advanced Logic Architecture

The XC2S200-6FGG546C features a robust architecture built on proven 0.18-micron CMOS technology. With 5,292 logic cells arranged in a 28 × 42 configurable logic block (CLB) array, this device provides substantial resources for complex digital designs. The 1,176 total CLBs enable designers to implement sophisticated state machines, arithmetic functions, and custom logic circuits with ease.

High-Density Memory Resources

This Xilinx FPGA integrates comprehensive on-chip memory solutions to support data-intensive applications. The device offers 75,264 bits of distributed RAM for fast, local storage needs alongside 56 kilobits of dedicated block RAM. These dual-ported synchronous RAM blocks provide independent read/write access, enabling efficient data buffering and FIFO implementations.

Superior I/O Capabilities

The XC2S200-6FGG546C delivers extensive connectivity options with up to 284 user-configurable I/O pins. These programmable I/O blocks support multiple signaling standards, allowing seamless integration with various system components and peripheral devices. The device accommodates both 2.5V core operation and 3.3V I/O interfacing for maximum design flexibility.

Technical Specifications

Core Performance Parameters

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Operating Frequency Up to 263 MHz

Memory Configuration

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Block RAM Ports Dual-port synchronous

Electrical Characteristics

Parameter Value
Core Voltage 2.5V (2.375V – 2.625V)
I/O Voltage 3.3V compatible
Process Technology 0.18 µm CMOS
Speed Grade -6 (Fastest)
Temperature Range 0°C to +85°C (Commercial)

Package Information for XC2S200-6FGG546C

FGG546 Fine-Pitch BGA Package

The XC2S200-6FGG546C utilizes a fine-pitch ball grid array (BGA) package that optimizes board space while ensuring reliable electrical connections. The Pb-free designation (indicated by the “G” suffix) confirms RoHS compliance for environmentally conscious manufacturing processes. This surface-mount package supports automated assembly techniques and provides excellent thermal dissipation characteristics.

Pin Configuration Highlights

The package design incorporates dedicated pins for power distribution, ground connections, and configuration interfaces. Four global clock input pins provide low-skew clock distribution throughout the device, supporting synchronous design methodologies essential for high-performance applications.

Programmable Clock Management

Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG546C integrates four delay-locked loops positioned at each corner of the die. These DLLs eliminate clock distribution delays and provide precise clock conditioning for optimal timing performance. Key DLL features include clock multiplication and division capabilities, phase shifting for fine timing adjustments, and clock mirroring for board-level clock deskewing across multiple devices.

Configuration and Development Support

Flexible Configuration Options

This Spartan-II FPGA supports multiple configuration modes to accommodate various system architectures. Available configuration methods include slave serial mode for processor-controlled loading, master serial mode for autonomous PROM-based configuration, and JTAG boundary scan for development and in-system programming.

IEEE 1149.1 JTAG Compliance

Full IEEE 1149.1 boundary scan support enables comprehensive testing and debugging capabilities. Engineers can utilize JTAG interfaces for device configuration, board-level testing, and real-time debugging during development phases.

Application Areas for XC2S200-6FGG546C

Telecommunications Equipment

The high gate count and fast operating frequency make this FPGA suitable for protocol processing, channel encoding/decoding, and interface bridging applications in networking equipment.

Industrial Control Systems

Robust commercial temperature operation and extensive I/O resources support programmable logic controllers, motor drive systems, and factory automation equipment requiring reliable, field-upgradable logic solutions.

Consumer Electronics

Cost-effective programmable logic enables rapid product development for video processing, audio systems, and display controllers where design flexibility and time-to-market advantages are critical.

Embedded Computing

The combination of logic resources, memory, and I/O capabilities supports custom peripheral implementations, co-processor designs, and hardware acceleration functions in embedded processor systems.

Design Advantages

ASIC Alternative Benefits

The XC2S200-6FGG546C provides a superior alternative to mask-programmed application-specific integrated circuits. Designers benefit from eliminated NRE costs and tooling expenses, shortened development cycles measured in weeks rather than months, in-field upgrade capability without hardware replacement, and reduced inventory risk through design flexibility.

Development Ecosystem

Comprehensive development tools and documentation support efficient design implementation. Available resources include synthesis and place-and-route software, simulation libraries for functional verification, reference designs and application notes, and hardware evaluation platforms for prototyping.

Ordering Information

The XC2S200-6FGG546C part number decodes as follows: XC2S200 indicates the Spartan-II 200K gate device, -6 denotes the fastest available speed grade, FGG specifies the fine-pitch BGA package in Pb-free format, 546 indicates the pin count, and C confirms commercial temperature grade operation.

Quality and Reliability

This device meets stringent quality standards for commercial applications, featuring moisture sensitivity level ratings appropriate for standard assembly processes, anti-static packaging for supply chain protection, and comprehensive qualification testing per industry standards.

Summary

The XC2S200-6FGG546C Spartan-II FPGA delivers an optimal combination of logic density, memory resources, and I/O flexibility for mid-range programmable logic applications. With its fastest speed grade option and Pb-free packaging, this device addresses both performance requirements and environmental compliance needs for modern electronic designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.