The XC2S200-6FGG545C is a high-performance field-programmable gate array from AMD’s renowned Spartan-II FPGA family. This programmable logic device delivers exceptional versatility for digital design applications, offering engineers a cost-effective alternative to traditional mask-programmed ASICs. With its advanced 0.18-micron process technology and comprehensive feature set, the XC2S200-6FGG545C stands as a reliable solution for telecommunications, industrial automation, and embedded systems development.
Key Features of the XC2S200-6FGG545C Spartan-II FPGA
The XC2S200-6FGG545C incorporates second-generation ASIC replacement technology that eliminates the initial costs and lengthy development cycles associated with conventional application-specific integrated circuits. This Xilinx FPGA supports unlimited reprogramming cycles, enabling design upgrades in the field without hardware replacement.
XC2S200-6FGG545C Technical Specifications Overview
| Parameter |
Specification |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Technology |
0.18µm CMOS |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Highest Performance) |
| Package Type |
Fine-Pitch BGA |
| Operating Frequency |
Up to 200 MHz |
XC2S200-6FGG545C Architecture and Design
Configurable Logic Block Structure
The XC2S200-6FGG545C features a programmable architecture built around Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB contains four logic cells organized in two identical slices, with every logic cell including a 4-input function generator, carry logic, and storage element. The function generators operate as look-up tables that can alternatively serve as 16 x 1-bit synchronous RAM or 16-bit shift registers for capturing high-speed data.
Input/Output Block Capabilities
The I/O structure supports sixteen different signaling standards including LVTTL, LVCMOS2, PCI (3.3V/5V at 33MHz and 66MHz), GTL, GTL+, HSTL Classes I/III/IV, SSTL2, SSTL3, CTT, and AGP-2X. Each output driver can source up to 24 mA and sink up to 48 mA, with programmable drive strength and slew rate controls to minimize bus transients.
XC2S200-6FGG545C Block RAM Resources
The device incorporates 14 dedicated block RAM modules totaling 56K bits. Each 4096-bit block RAM cell operates as a fully synchronous dual-ported memory with independent control signals for each port. The configurable data width options (1×4096, 2×2048, 4×1024, 8×512, or 16×256) provide built-in bus-width conversion capabilities.
XC2S200-6FGG545C Speed Grade Performance
The -6 speed grade designation indicates this device offers the highest performance tier within the Spartan-II family. This grade is exclusively available in the commercial temperature range (0°C to +85°C junction temperature), making it ideal for applications requiring maximum operating frequency and minimal propagation delays.
XC2S200-6FGG545C Clock Management System
Delay-Locked Loop Technology
Four fully digital Delay-Locked Loops positioned at each corner of the die provide zero propagation delay and minimal clock skew across the entire device. The DLL system can deliver quadrature phases of the source clock, double the clock frequency, or divide it by factors of 1.5, 2, 2.5, 3, 4, 5, 8, or 16. System clock rates up to 200 MHz are fully supported.
Global Clock Distribution Network
The primary global routing resources comprise four dedicated global nets with dedicated input pins specifically designed to distribute high-fanout clock signals with minimal skew. Secondary global routing includes 24 backbone lines spanning the top and bottom of the chip, supporting up to 12 unique signals per column.
XC2S200-6FGG545C Configuration Options
The XC2S200-6FGG545C supports multiple configuration modes for maximum design flexibility. Master Serial mode allows the FPGA to control configuration by driving CCLK as an output at selectable frequencies from 4 to 60 MHz. Slave Serial mode enables passive configuration from external sources such as microprocessors or CPLDs. Slave Parallel mode provides the fastest byte-wide configuration capability, while Boundary-Scan mode utilizes the IEEE 1149.1 Test Access Port for configuration through dedicated pins.
Configuration Memory Requirements
The device requires 1,335,840 bits of nonvolatile storage for complete configuration. SRAM-based configuration allows unlimited reprogramming cycles, with values stored in static memory cells controlling all configurable logic elements and interconnect resources.
XC2S200-6FGG545C Package Information
The FGG545 Fine-Pitch Ball Grid Array package provides excellent thermal performance and signal integrity through its ball grid array configuration. The Pb-free packaging option (indicated by the “G” character in the ordering code) ensures RoHS compliance for environmentally responsible manufacturing.
XC2S200-6FGG545C Application Areas
This versatile FPGA suits numerous application domains including digital signal processing implementations, communication system interfaces, industrial control systems, automotive electronics, consumer electronics products, and rapid prototyping environments. The programmability feature enables design iteration without hardware changes, significantly reducing time-to-market for development projects.
XC2S200-6FGG545C Development Support
The device receives full support from the Xilinx ISE Design Suite, providing complete design entry, synthesis, implementation, and verification capabilities. The unified library contains over 400 primitives and macros ranging from basic logic gates to complex arithmetic functions, comparators, counters, and barrel shifters. VHDL and Verilog design entry methods are fully supported with automatic mapping, placement, and routing.
XC2S200-6FGG545C Boundary Scan Compliance
Full IEEE 1149.1 boundary scan compatibility enables comprehensive testing capabilities. The Test Access Port supports EXTEST, SAMPLE/PRELOAD, BYPASS, and USERCODE instructions along with internal scan chains. All IOBs, including unbonded ones, participate in the single scan chain as independent 3-state bidirectional pins.
Why Choose the XC2S200-6FGG545C for Your Design
The XC2S200-6FGG545C offers engineers a proven solution combining high gate density, extensive I/O flexibility, and robust clock management in a cost-effective package. Its ability to replace mask-programmed ASICs while avoiding initial costs and lengthy development cycles makes it an attractive choice for both prototyping and production applications where programmable logic provides competitive advantages.
